US2005032463A1PendingUtilityA1
Polishing composition for magnetic disk
Priority: Aug 8, 2003Filed: Jul 23, 2004Published: Feb 10, 2005
Est. expiryAug 8, 2023(expired)· nominal 20-yr term from priority
C09K 3/1463C09G 1/02C09K 3/1409
43
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Claims
Abstract
A polishing composition for a magnetic disk, comprising alumina, water, a peroxide and an organic acid; a polishing process for a substrate to be polished, comprising the step of polishing the substrate to be polished with the polishing composition; and a process for manufacturing a substrate, comprising the step of polishing a substrate to be polished with the polishing composition. The polishing composition can be suitably used for the manufacture of a magnetic disk substrate for high-quality hard disks and the like.
Claims
exact text as granted — not AI-modified1 . A polishing composition for a magnetic disk, comprising alumina, water, a peroxide and an organic acid.
2 . The polishing composition according to claim 1 , wherein the organic acid is one or more members selected from the group consisting of sulfur-containing organic acids, carboxylic acids, and phosphorus-containing organic acids.
3 . The polishing composition according to claim 1 or 2 , further comprising an inorganic acid.
4 . The polishing composition according to claim 1 , wherein the composition has a pH of 0.1 or more and less than 6.
5 . The polishing composition according to claim 3 , wherein the composition has a pH of 0.1 or more and less than 6.
6 . A polishing process for a substrate to be polished, comprising the step of polishing the substrate to be polished with the polishing composition of claim 1 .
7 . A polishing process for a substrate to be polished, comprising the step of polishing the substrate to be polished with the polishing composition of claim 3 .
8 . The polishing process according to claim 6 , wherein the substrate to be polished is a substrate produced by plating an aluminum alloy with a Ni—P alloy.
9 . The polishing process according to claim 7 , wherein the substrate to be polished is a substrate produced by plating an aluminum alloy with a Ni—P alloy.
10 . A process for manufacturing a substrate, comprising the step of polishing a substrate to be polished with the polishing composition of claim 1 .
11 . A process for manufacturing a substrate, comprising the step of polishing a substrate to be polished with the polishing composition of claim 3 .
12 . The process according to claim 10 , wherein the substrate to be polished is a substrate produced by plating an aluminum alloy with a Ni—P alloy.
13 . The process according to claim 11 , wherein the substrate to be polished is a substrate produced by plating an aluminum alloy with a Ni—P alloy.Join the waitlist — get patent alerts
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