Method of manufacturing disk substrate, and method and device for manufacturing optical disk

Abstract

A method for producing a disk-shaped substrate 10 used for producing an optical disk includes: (a) forming a protective layer 12 a that is larger in area than the disk-shaped substrate 10 on a surface of a transparent plate 11 a ; and (b) cutting a portion of the plate 11 a with the protective layer 12 a formed thereon other than an outer edge portion of the protective layer 12 a to form a disk shape. According to this producing method, a thin substrate can be prevented from being damaged by forming a protective layer. Furthermore, according to this producing method, a protective layer with a uniform thickness can be formed.

1 - 32 . (Canceled)  
     
     
         33 . An apparatus for producing an optical disk using a first substrate and a second substrate, comprising: 
 punching means for punching out a transparent plate with a protective film formed on one principal plane to form the second substrate; and    attachment means for attaching the first substrate and the second substrate to each other so that the protective film is placed outside.    
     
     
         34 . An apparatus for producing an optical disk according to  claim 33 , further comprising 
 peeling means for peeling the protective film.    
     
     
         35 . An apparatus for producing an optical disk according to  claim 33 , wherein the attachment means includes: 
 coating means for coating at least one substrate selected from the first substrate and the second substrate with radiation-curable resin;    stacking means for stacking the first substrate and the second substrate so that a center of the first substrate is matched with a center of the second substrate; and    irradiation means for irradiating the radiation-curable resin with radiation.    
     
     
         36 . An apparatus for producing an optical disk according to  claim 35 , wherein the attachment means further includes rotation means for rotating the stacked first substrate and second substrate.  
     
     
         37 . An apparatus for producing an optical disk according to  claim 35 , wherein the coating means includes dropping means for dropping the radiation-curable resin onto the at least one substrate and rotation means for rotating the at least one substrate, and 
 the stacking means includes a container that can be evacuated.    
     
     
         38 . An apparatus for producing an optical disk including a first substrate and a second substrate in which a signal area is to be formed on one principal plane, comprising: 
 a support for supporting the other principal plane of the second substrate, which is an opposite side of the one principal plane; and    fixing means for fixing the other principal plane to the support.    
     
     
         39 . An optical disk producing apparatus according to  claim 38 , further comprising film-forming means for forming at least one film selected from a metal film, a dielectric film, a magnetic film and a coloring film on the one principal plane.  
     
     
         40 . An optical disk producing apparatus according to  claim 38 , further comprising attachment means for attaching the first substrate and the second substrate to each other.  
     
     
         41 . An optical disk producing apparatus according to  claim 40 , wherein the support is made of a radiation-permeable material, and the attachment means includes irradiation means on a side opposite to a side where the second substrate is placed with respect to the support.  
     
     
         42 . An optical disk producing apparatus according to  claim 38 , wherein the second substrate has a circular through-hole at a center thereof, and the fixing means includes pressure means for pressing at least one selected from an inner peripheral edge and an outer peripheral edge of the second substrate to the support side.  
     
     
         43 . An optical disk producing apparatus according to  claim 38 , further comprising signal area forming means for forming the signal area on the one principal plane of the second substrate.