Protein enhanced low carbohydrate snack food

Abstract

A protein enhanced, low carbohydrate wafer having protein material in a concentration of about 26% to about 99% of the wafer is described, as well as methods of making the same.

1 . A wafer, comprising: 
 protein material, wherein said protein material comprises, by weight, between about 26% and about 99% of a wafer.    
     
     
         2 . The wafer of  claim 1 , further comprising: 
 flavorings or seasonings;    oil; and    an emulsifier.    
     
     
         3 . The wafer of  claim 1 , wherein said protein material is whey protein, wheat protein, soy protein, calcium caseinate, egg white protein or a combination thereof.  
     
     
         4 . The wafer of  claim 1 , comprising: 
 caseinate; and    whey protein isolate;    wherein the ratio of caseinate to whey protein isolate is about 1:5.4 to about 1:5.7.    
     
     
         5 . The wafer of  claim 1 , comprising: 
 whey protein isolate; and    soy protein isolate.    
     
     
         6 . The wafer of  claim 5 , wherein the ratio of soy protein isolate to whey protein isolate ranges from about 1:1 to about 1:4.  
     
     
         7 . A wafer, comprising by weight: 
 up to about 99% whey protein isolate;    up to about 99% soy protein isolate;    up to about 11% calcium caseinate; and    up to about 23% egg white protein.    
     
     
         8 . The wafer of  claim 7 , wherein: 
 whey protein isolate comprises about 60%;    soy protein isolate comprises about 15%;    calcium caseinate comprises about 11%; and    egg white protein comprises about 8%.    
     
     
         9 . The wafer of  claim 7 , further comprising up to about 99% by weight wheat protein.  
     
     
         10 . A wafer, comprising: 
 at least one protein material; and    starch;    wherein said starch comprises up to about 65% of a wafer.    
     
     
         11 . The wafer of  claim 10 , wherein said starch is pastry flour, Hi-maize flour or wheat flour.  
     
     
         12 . The wafer of  claim 10 , wherein: 
 said at least one protein material comprises about 26% by weight of said wafer; and    said starch comprises about 64% by weight of said wafer.    
     
     
         13 . The wafer of  claim 10 , wherein said protein material comprises: 
 whey protein isolate comprising about 11% by weight of said wafer;    soy protein isolate comprising about 11% by weight of said wafer;    calcium caseinate comprising about 2% by weight of said wafer; and    egg white proteins comprising about 2% by weight of said wafer.    
     
     
         14 . The wafer of  claim 13 , further comprising wheat proteins.  
     
     
         15 . A base wafer batter, comprising; 
 protein material; and    water;    wherein said protein material comprises up to about 65% of a base wafer batter; and    wherein said water comprises up to about 60% of said base wafer batter.    
     
     
         16 . The base wafer batter of  claim 15 , wherein the ratio of said protein material to said water ranges from about 1:1.5 to about 1:2.  
     
     
         17 . A base wafer batter, comprising: 
 protein material;    starch; and    water;    wherein said protein material comprises up to about 65% of said base wafer batter;    said starch comprises up to about 30% of said base wafer batter; and    said water comprises up to about 60% of said base wafer batter.    
     
     
         18 . The base wafer batter of  claim 17 , wherein: 
 said protein material comprises about 12% by weight of said batter;    said starch comprises about 30% by weight of said batter; and    said water comprises about 54% by weight of said batter.    
     
     
         19 . A snack food, comprising a protein enhanced wafer, wherein said wafer comprises up to about 99% protein.  
     
     
         20 . The snack food of  claim 19 , further comprising: 
 a cream filling;    chocolate;    an icing; or    a combination thereof.    
     
     
         21 . A method for making a wafer, comprising: 
 making a base wafer batter; and    baking said batter;    wherein said batter comprises up to about 65% protein, and wherein whey protein is added to said batter before soy protein is added to said batter.    
     
     
         22 . The method of  claim 21 , wherein said batter bakes at a temperature from about 140° C. to about 165° C. and for a time period from about 1.5 minutes to about 2.5 minutes.  
     
     
         23 . A method for making a base wafer batter, comprising: 
 first making a solution of water, egg whites and emulsifiers; and    then combining proteins, wherein whey protein is added and mixed before soy protein is added and mixed.    
     
     
         24 . The method of  claim 23 , further comprising adding and mixing wheat protein after whey protein is added and mixed and before soy protein is added and mixed.  
     
     
         25 . The method of  claim 23 , wherein caseinate is added and mixed before whey protein is added and mixed.  
     
     
         26 . The method of  claim 23 , further comprising adding and mixing salt, seasonings, flavorings, or a combination thereof.  
     
     
         27 . A method for making a base wafer batter, comprising: 
 making a protein slurry;    making a starch slurry; and    mixing together said protein slurry with said starch slurry.    
     
     
         28 . The method of  claim 27 , wherein said protein slurry is made by: 
 first mixing together water and egg whites;    then adding oil and an emulsifier to the mixture and mixing;    then adding caseinate and mixing;    then adding protein and mixing, wherein whey protein is added and mixed before    soy protein is added and mixed; and    wherein said starch slurry is made by:    combining water, starch, an emulsifier, oil, salt and a leavening agent and mixing.    
     
     
         29 . The method of  claim 28 , further comprising adding and mixing wheat protein after whey protein is added and mixed and before soy protein is added and mixed.  
     
     
         30 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 21 .    
     
     
         31 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 22 .    
     
     
         32 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 23 .    
     
     
         33 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 24 .    
     
     
         34 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 25 .    
     
     
         35 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 26 .    
     
     
         36 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 27 .    
     
     
         37 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 28 .    
     
     
         38 . A method for making a snack food, comprising: 
 making a protein enhanced, low carbohydrate wafer;    forming said wafer; and    coating, filling or dressing said wafer with a cream filling, icing or chocolate;    wherein said wafer is made by the method of  claim 29 .    
     
     
         39 . A diet, comprising a snack food containing a protein enhanced, low carbohydrate wafer.  
     
     
         40 . A wafer, comprising: 
 up to about 27 grams of protein per 28 grams of said wafer; and    up to about 4 grams of carbohydrates per 28 grams of said wafer.    
     
     
         41 . A snack food comprising: 
 a wafer;    wherein said snack food comprises up to about 19 grams of protein per 28 grams of said snack food.    
     
     
         42 . A snack food, comprising: 
 a wafer;    wherein said snack food comprises up to about 9 grams of carbohydrates per 28 grams of said snack food.