US2005029090A1PendingUtilityA1

Method and apparatus for ionization film formation

Assignee: CANON KKPriority: Jan 28, 2002Filed: Sep 14, 2004Published: Feb 10, 2005
Est. expiryJan 28, 2022(expired)· nominal 20-yr term from priority
H01J 2237/3137C23C 14/32C23C 14/355C23C 14/046
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Claims

Abstract

A method for ionization film formation to form a deposited film by ionizing vaporized particles with an ionization mechanism of the hot-cathode system and injecting the ionized particles into a substrate is provided. The method includes the step of introducing He gas inside the ionization mechanism.

Claims

exact text as granted — not AI-modified
1 - 10 . (Cancelled)  
     
     
         11 . An ionization film formation apparatus for forming a deposited film, comprising: 
 a hot-cathode system having at least one filament, and defining an ionization space, wherein the at least one filament is configured to produce thermoelectrons;    a positively charged grid positioned between each filament and the ionization space; and    an ionization gas introduction device configured to introduce an ionization gas is at least one of (i) between the filament and the grid and (ii) upstream of the filament relative to the grid and the ionization space.    
     
     
         12 . The ionization film formation apparatus according to  claim 11 , further comprising a sputtering discharge gas introduction device for introducing a sputtering discharge gas, wherein the sputtering discharge gas introduction device is positioned separate from the ionization gas introduction device.  
     
     
         13 . The ionization film formation apparatus according to  claim 12 , wherein the sputtering discharge gas is selected from the group consisting of neon, argon, krypton, and xenon.  
     
     
         14 . The ionization film formation apparatus according to  claim 11 , wherein the ionization gas is helium.  
     
     
         15 . The ionization film formation apparatus according to  claim 11 , further comprising a magnetic field generation device configured to maintain a plasma in the ionization space.  
     
     
         16 . The ionization film formation apparatus according to  claim 11 , further comprising a substrate holder, positioned within the apparatus, and configured to position a substrate within the apparatus, and an electrical field generating device configured to generate an electric field on a surface of the substrate, wherein the electric field accelerates ions formed in the ionization space perpendicular to the surface to form a film on the surface of the substrate.

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