Method and apparatus for creating radial profiles on a substrate

Abstract

The gradient deposition method and apparatus permits a radial thickness or composition gradient on a substrate to be formed. The system comprises one or more deposition sources that can be fired sequentially or simultaneously. The system also comprises one or more dynamic shutters (e.g., shutters that can be moved independently of each other and during the deposition of a material) in combination with equipment that permits the substrate to be rotated during the deposition of the material onto the substrate. The system may also include one or more contact masks that may be placed on the substrate during the deposition in order to mask off particular portions of the substrate during the deposition process.

1 . An apparatus for creating a radial profile of a target material on a substrate, the apparatus comprising: 
 a deposition source for directing a target material for deposition on a substrate;    a shutter for blocking an amount of the target material from depositing on the substrate; and    a platform that holds the substrate, wherein the substrate and shutter are adapted for rotation relative to each other during the deposition of the target material, such that the shutter blocks a predetermined amount of the target material to generate a radial profile on the substrate.    
     
     
         2 . The apparatus of  claim 1  further comprising a contact mask for blocking all of the target material from striking a portion of the substrate.  
     
     
         3 . The apparatus of  claim 1 , wherein the platform holding the substrate is rotatable and the shutter is not rotatable.  
     
     
         4 . The apparatus of  claim 3 , wherein the rotatable platform is rotatable at a constant speed.  
     
     
         5 . The apparatus of  claim 3 , wherein the rotatable platform is rotatable at a variable speed.  
     
     
         6 . The apparatus of  claim 3 , further comprising a motor that is controllable to move the shutter and change the location on the substrate of the region that is blocked from deposition of the target material.  
     
     
         7 . The apparatus of  claim 6 , wherein the shutter is movable, such that a gradient profile is generated during the deposition of the target material on the substrate.  
     
     
         8 . The apparatus of  claim 6 , wherein the shutter is movable at a constant speed.  
     
     
         9 . The apparatus of  claim 6 , wherein the shutter is movable at a variable speed.  
     
     
         10 . The apparatus of  claim 6 , wherein the shutter is adapted to be initially positioned to block the target material at the center of the substrate and is further adapted to move toward the edge of the substrate while the substrate is rotated during deposition to generate a conical profile on the substrate.  
     
     
         11 . The apparatus of  claim 6 , wherein the shutter is adapted to be initially positioned to block the target material at the edge of the substrate and is further adapted to move toward the rotation center of the substrate during deposition while the substrate is rotated.  
     
     
         12 . The apparatus of  claim 3  wherein the shutter is a first shutter, the apparatus further comprising a second shutter that is independently movable relative to the first shutter.  
     
     
         13 . The apparatus of  claim 12 , wherein the first and second shutters are adapted to be initially positioned at opposite edges of the substrate and are further adapted to move toward each other and toward the center of the substrate during deposition.  
     
     
         14 . The apparatus of  claim 12 , wherein the first and second shutters are adapted to be initially positioned at the center of the substrate and are adapted to move away from each other and toward the opposite edges of the substrate during deposition.  
     
     
         15 . The apparatus of  claim 12 , wherein the first and second shutters are adapted to be placed at a fixed position during the deposition to generate an annular ring of target material on the substrate.  
     
     
         16 . The apparatus of  claim 12 , wherein the first and second shutters are adapted to be rotated during the deposition to generate an annular ring of target material on the substrate.  
     
     
         17 . The apparatus of  claim 3  further comprising one or more additional deposition sources for depositing one or more additional target materials onto the substrate and one or more additional shutters for blocking an amount of the one or more additional target materials from depositing on the substrate.  
     
     
         18 . The apparatus of  claim 1 , wherein the shutter is rotatable around the substrate and the substrate is not rotatable.  
     
     
         19 . The apparatus of  claim 18 , further comprising a motor that is controllable to move the shutter and change the amount of target material being blocked and the location of the target material on the substrate being blocked.  
     
     
         20 . The apparatus of  claim 19 , wherein the shutter is movable, such that a gradient profile is generated during the deposition of the target material on the substrate.  
     
     
         21 . The apparatus of  claim 19 , wherein the shutter is moveable at a constant speed.  
     
     
         22 . The apparatus of  claim 19 , wherein the shutter is moveable at a variable speed.  
     
     
         23 . The apparatus of  claim 19 , wherein the shutter is adapted to be initially positioned to block the target material at the center of the substrate and is further adapted to move toward the edge of the substrate while the shutter is rotated during deposition to generate a conical profile.  
     
     
         24 . The apparatus of  claim 19 , wherein the shutter is adapted to be initially positioned to block the target material at the edge of the substrate and is further adapted to move toward the rotation center of the substrate during deposition while the shutter is rotated.  
     
     
         25 . The apparatus of  claim 18  wherein the shutter is a first shutter, and further comprising a second shutter that is independently movable relative to the first shutter.  
     
     
         26 . The apparatus of  claim 25 , wherein the first and second shutters are adapted to be initially positioned at opposite edges of the substrate and are further adapted to move toward each other and toward the center of the substrate during deposition.  
     
     
         27 . The apparatus of  claim 25 , wherein the first and second shutters are adapted to be initially positioned at the center of the substrate and are further adapted to move away from each other and toward the opposite edges of the substrate during deposition.  
     
     
         28 . The apparatus of  claim 25 , wherein the first and second shutters are adapted to be placed at a fixed position during the deposition to generate an annular ring of target material on the substrate.  
     
     
         29 . The apparatus of  claim 25 , wherein the first and second shutters are rotatable during the deposition to generate an annular ring of target material on the substrate.  
     
     
         30 - 63 . canceled.  
     
     
         64 . A radial gradient deposition apparatus comprising: 
 a rotatable platform that is adapted to rotate a substrate during deposition;    a deposition source that is adapted to direct a target material for deposition on the substrate; and    a shutter that is adapted to selectively blocks a varying amount of the target material during deposition to generate a radial thickness gradient on the substrate.    
     
     
         65 . An apparatus for creating a radial profile of a target material on a substrate the apparatus comprising: 
 a deposition source for directing a target material for deposition on a substrate; and    a shutter adapted to blocks an amount of the target material from striking the substrate, the shutter being rotatable radially around the substrate during the deposition of the target material to generate a radial profile on the substrate.