Substrate processing apparatus and method thereof

Abstract

A substrate processing apparatus 10 for processing a glass substrate 50 comprises a slider 20 on which the glass substrate 50 is placed, a process chamber 30 that can be mounted on the slider 20 , and light irradiation units 110, 120 . The process chamber 30 comprises a supply inlet 33 for supplying process fluid, a drain outlet 34 for draining out the process fluid, and a processing space 32 , wherein one plane of the processing space that corresponds to the region to be processed is opened. When the process chamber 30 is mounted on the placing member 20 , the processing space 32 forms a processing space which is sealed with the glass substrate 50.

1 . A substrate processing apparatus for processing a substrate comprising: 
 a placing member on which a substrate is placed; and    a process chamber that can be mounted on said placing member; 
 wherein said process chamber comprises a supply inlet for supplying process fluid that includes fluid such as gases, a drain outlet for draining out the process fluid, and a processing space, wherein one plane of the processing space that corresponds to the region to be processed on the substrate is opened; and  
 wherein a processing space that is sealed with the substrate is formed on said region to be processed on the substrate when said process chamber is mounted on said placing member.  
   
   
   
       2 . The substrate processing apparatus of  claim 1 , wherein said processing space is connected to said supply inlet and drain outlet, and the process fluid supplied from said supply inlet flows through said processing space and is drained out from said drain outlet.  
   
   
       3 . The substrate processing apparatus of  claim 1 , wherein said processing space comprises a plane being parallel with said region to be processed on the substrate.  
   
   
       4 . The substrate processing apparatus of  claim 1 , wherein said process chamber further comprises a second space whose one plane is opened, wherein said second space is isolated from said processing space.  
   
   
       5 . The substrate processing apparatus of  claim 4 , wherein a second sealed space is formed on the region not to be processed on said substrate when said process chamber is mounted on said placing member.  
   
   
       6 . The substrate processing apparatus of  claim 4 , wherein a second sealed space is formed on the second region to be processed on said substrate when said process chamber is mounted on said placing member.  
   
   
       7 . The substrate processing apparatus of  claim 1 , and further including a light irradiation unit for irradiating the substrate in the process chamber with light, wherein said process chamber comprises a light passing region that passes light, and wherein said light irradiation unit irradiates the substrate with light through said light passing region.  
   
   
       8 . The substrate processing apparatus of  claim 7 , wherein said placing member comprises a light passing region that passes light, and wherein said light irradiation unit irradiates the substrate placed on the placing member through said light passing region.  
   
   
       9 . The substrate processing apparatus of  claim 7 , wherein said light irradiation unit irradiates ultraviolet rays.  
   
   
       10 . The substrate processing apparatus of  claim 7 , wherein said light irradiation unit irradiates infrared rays.  
   
   
       11 . The substrate processing apparatus of  claim 7 , wherein said light passing region comprises a transparent window formed on one plane of the process chamber.  
   
   
       12 . The substrate processing apparatus of  claim 1 , wherein said process chamber comprises a seal element surrounding said processing space, wherein said seal element is brought into contact with said substrate when said process chamber is mounted on said placing member.  
   
   
       13 . The substrate processing apparatus of  claim 12 , wherein said processing space is a recessed portion having a certain depth formed in the backside of the process chamber, wherein a groove is formed along the periphery of said recessed portion, and wherein the seal element is inserted in said groove.  
   
   
       14 . The substrate processing apparatus of  claim 5 , wherein said substrate is a glass substrate, wherein the electrode portion of the glass substrate is said region not to be processed.  
   
   
       15 . The substrate processing apparatus of  claim 1 , wherein said process chamber comprises a plurality of terminals on its upper surface, wherein voltage is applied to the selected terminals.  
   
   
       16 . The substrate processing apparatus of  claim 15 , wherein said plurality of terminals apply electric field between the terminals and a predetermined conductive region of the substrate in the processing space.  
   
   
       17 . A substrate processing apparatus for processing a substrate comprising: 
 a first process chamber that can be mounted on the side of a first main surface of the substrate, and forms a first sealed space between it and the first main surface of the substrate;    a second process chamber that can be mounted on the side of a second main surface that opposes to the first main surface of the substrate, and forms a second sealed space between it and the second main surface of the substrate; and    a light irradiation unit for applying light into the first and second sealed spaces through the first and second process chambers; 
 wherein each of said first and second process chambers comprises a supply inlet for supplying process fluid that includes fluid such as gases, a drain outlet for draining out the process fluid, and a first or a second processing space that corresponds to the first or second sealed space on the substrate.  
   
   
   
       18 . The substrate processing apparatus of  claim 17 , wherein each of the first and second process chambers comprises a transparent window that passes light.  
   
   
       19 . The substrate processing apparatus of  claim 18 , wherein the substrate is placed on the placing member in which a through hole is formed.  
   
   
       20 . The substrate processing apparatus of  claim 17 , wherein the substrate is placed on the placing member in which a through hole is formed.