Method of manufacturing a thermal dissipation assembly

Abstract

The present invention discloses a method of providing an integral thermal interface on an interface surface of a heat dissipation device, such as a heat sink. In accordance with the present invention, the phase change material is applied directly onto the interface surface of the heat sink to form an integral interface layer directly on the heat sink during the manufacturing process. This process includes the steps of providing a heat dissipating device having an interface surface, liquefying the phase change material at a controlled temperature so as to decrease the material viscosity to a flowable form, applying the liquefied phase change material directly onto the mating surface of the heat dissipating device either by directly dispensing the material, screen printing or stencil printing and cooling the material causing it to cure on the surface of the heat dissipating device.

1 . A method of applying a phase change thermal interface comprising: 
 providing a thermal heat sink having a contact surface, said contact surface having voids;    providing a phase change material;    heating said phase change material to liquefy said material;    applying said liquefied phase change material to said contact surface, said liquefied phase change material filling said voids and fully wetting out said contact surface; and    cooling said liquefied phase change material to form a solid thermal interface layer on said contact surface.    
     
     
         2 . The method of applying a phase change thermal interface of  claim 1 , wherein said step of providing a phase change material is providing polysiloxane rubber.  
     
     
         3 . The method of applying a phase change thermal interface of  claim 1 , wherein said step of providing a phase change material is providing thermoplastic polymer.  
     
     
         4 . The method of applying a phase change thermal interface of  claim 1 , wherein said step of applying said liquefied phase change material further includes screen printing said liquefied phase change material.  
     
     
         5 . The method of applying a phase change thermal interface of  claim 1 , wherein said step of applying said liquefied phase change material further includes stencil printing said liquefied phase change material.  
     
     
         6 . The method of applying a phase change thermal interface of  claim 1 , further comprising: 
 mixing an adhesive material with said liquefied phase change material, before said step of applying said liquefied phase change material to said contact surface.    
     
     
         7 . The method of applying a phase change thermal interface of  claim 1 , further comprising: 
 installing said heat dissipating device onto a heat generating electronic component having a heat generating surface, said applied phase change material being in thermal communication with said heat generating surface, after said step of cooling said applied phase change material.    
     
     
         8 . A method of manufacturing a thermal dissipation assembly comprising: 
 providing a thermal heat sink having a contact surface, said contact surface having voids;    providing a phase change material;    heating said phase change material to liquefy said material;    filling said voids and fully wetting out said contact surface by applying said liquefied phase change material to said contact surface;    cooling said liquefied phase change material to form a solid thermal interface layer on said contact surface; and    installing said heat dissipating device onto a heat generating electronic component having a heat generating surface, said applied phase change material being in thermal communication with said heat generating surface.