Semiconductor processor control systems, semiconductor processor systems, and systems configured to provide a semiconductor workpiece process fluid

Abstract

Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

1 - 129 . Cancelled  
   
   
       130 . A semiconductor processor control system comprising: 
 interface circuitry configured to receive a signal comprising information regarding turbidity of a fluid of a semiconductor processor system configured to process electronic device workpieces; and    control circuitry coupled with the interface circuitry and configured to access the information regarding the turbidity of the fluid, to process the information regarding the turbidity of the fluid, to select an appropriate command responsive to the processing of the information regarding the turbidity of the fluid, and to control outputting of the command to control an operation of the semiconductor processor system.    
   
   
       131 . The system of  claim 130  wherein the control circuitry is configured to control the outputting of the command to control the operation related to the turbidity of the fluid.  
   
   
       132 . The system of  claim 130  wherein the control circuitry is configured to control the outputting of the command to control a mixing operation of the fluid.  
   
   
       133 . The system of  claim 130  wherein the control circuitry is configured to control the outputting of the command to control a recirculation operation of the fluid.  
   
   
       134 . The system of  claim 130  wherein the control circuitry is configured to control the outputting of the command to control a flush operation of the fluid.  
   
   
       135 . The system of  claim 130  further comprising memory circuitry configured to store the information regarding the turbidity of the fluid at a plurality of moments in time.  
   
   
       136 . The system of  claim 130  wherein the control circuitry is configured to compare the information regarding the turbidity of the fluid with respect to a signature to process the information.  
   
   
       137 . A semiconductor processor system comprising: 
 a process chamber adapted to process at least one semiconductor workpiece using a process fluid;    a connection coupled with the process chamber and configured to receive the process fluid;    a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and    a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.    
   
   
       138 . The system according to  claim 137  wherein the connection comprises a connection of a sampling system configured to provide the process fluid in a substantially static state.  
   
   
       139 . The system according to  claim 138  wherein the control system is configured to compare the substantially static process fluid with a signature to determine at least one characteristic of the process fluid.  
   
   
       140 . The system according to  claim 137  wherein the connection is adapted to couple with a process fluid supply and is configured to supply process fluid from the process fluid supply to the process chamber.  
   
   
       141 . The system according to  claim 137  wherein the connection comprises a drain coupled with the process chamber.  
   
   
       142 . system according to  claim 137  wherein the process chamber comprises a pad adapted to process the at least one semiconductor workpiece and the connection is configured to extract process fluid from the pad.  
   
   
       143 . The system according to  claim 137  wherein the sensor is configured to output a signal indicative of accumulation of particulate matter within the connection.  
   
   
       144 . The system according to  claim 137  wherein the control system is configured to process the signal to monitor processing of the at least one semiconductor workpiece within the process chamber.  
   
   
       145 . The system according to  claim 137  further comprising a mixing system configured to mix plural components of the process fluid and the control system is configured to control the mixing system.  
   
   
       146 . The system according to  claim 137  further comprising a storage device configured to store historical data corresponding to the process fluid.  
   
   
       147 . The system according to  claim 137  wherein the process chamber comprises a process chamber of a chemical-mechanical polishing processor.  
   
   
       148 . A semiconductor processor system comprising: 
 a process chamber adapted to process at least one semiconductor workpiece using a process fluid;    a process fluid system coupled with the process chamber and including: 
 a recirculation system configured to recirculate the process fluid; and  
 a sensor coupled with the recirculation system and configured to output a signal indicative of the process fluid; and  
   a control system coupled with the sensor and configured to control recirculation of the process fluid using the recirculation system responsive to the signal.    
   
   
       149 . The system according to  claim 148  wherein the process fluid system is configured to supply process fluid to the process chamber.  
   
   
       150 . The system according to  claim 148  wherein the process chamber comprises a process chamber of a chemical-mechanical polishing processor.  
   
   
       151 . A system configured to provide a semiconductor workpiece process fluid comprising: 
 a connection configured to transport a semiconductor workpiece process fluid relative to a semiconductor process chamber;    a sensor oriented relative to the connection and configured to output a signal indicative of the semiconductor workpiece process fluid; and    a control system coupled to receive the signal from the sensor and configured to monitor the semiconductor workpiece process fluid using the signal.    
   
   
       152 . The system according to  claim 151  wherein the process chamber comprises a process chamber of a chemical-mechanical polishing processor.