US2005026319A1PendingUtilityA1

Semiconductor laser device, optical pickup using the same, and apparatus and method for manufacturing the same

Priority: Nov 9, 2001Filed: Aug 30, 2004Published: Feb 3, 2005
Est. expiryNov 9, 2021(expired)· nominal 20-yr term from priority
H10P 72/0444H10P 72/0606H01S 5/02212H01S 5/4056H01S 5/02326H01S 5/4031
33
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Claims

Abstract

The present invention relates to an optical pickup used for an optical recording information instrument such as CD-ROM, CD-R, MO, DVD and the like, and a semiconductor laser device assembled to be incorporated in the optical pickup, as well as to a method for manufacturing said semiconductor laser device. The present invention also relates to a semiconductor laser element comprising a plurality of semiconductor laser chips, which is incorporated in the semiconductor laser device and to a method for manufacturing said semiconductor laser element, especially to an apparatus for accurately bonding and assembling a semiconductor laser element used in manufacturing said semiconductor laser element, such as a semiconductor laser chip die-bonding machine and the like.

Claims

exact text as granted — not AI-modified
1 - 20 . (Cancelled)  
   
   
       21 . A semiconductor laser device, which is manufactured by die-bonding on a stem a semiconductor laser element with a plurality of semiconductor laser chips die-bonded on one sub-mount, an axis of light emitted from at least one of semiconductor laser chips being consistent with a reference axis which is an axis lying at a prescribed angle relative to a reference surface of the stem.  
   
   
       22 . The semiconductor laser device according to  claim 21 , wherein an emitted light axis of a semiconductor laser chip is consistent with the reference axis, said semiconductor laser chip emitting a light with a shortest wavelength among the plurality of semiconductor laser chips.  
   
   
       23 . A semiconductor laser device, which is manufactured by die-bonding on a stem a semiconductor laser element with a plurality of semiconductor laser chips die-bonded on one sub-mount, an axis lying at an average angle among angles of light emitted axes of the plurality of semiconductor laser chips being consistent with a reference axis which is an axis lying at a prescribed angle relative to a reference surface of the stem.  
   
   
       24 . An optical pickup comprising a semiconductor laser device as defined in any one of  claims 21  to  23  and a condensing lens, wherein a reference surface of the optical pickup disposed at a prescribed angle relative to an optic axis of the condensing lens is consistent with a reference surface of a stem of the semiconductor laser device.

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