US2005025981A1PendingUtilityA1

Method for making enhanced light transmission conductive coated transparent substrate

Assignee: DONNELLY CORP A MICHIGAN CORPPriority: Jun 23, 2000Filed: Sep 1, 2004Published: Feb 3, 2005
Est. expiryJun 23, 2020(expired)· nominal 20-yr term from priority
G06F 3/041C03C 2218/365G02B 1/116C03C 17/3417Y10T428/24942
47
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Claims

Abstract

A method for making a reduced glare, conductive coated panel having increased visible light transmission and suitable for use as a touch screen, digitizer panel or a substrate in an information display includes forming a first transparent thin film layer on a first surface of a transparent substrate and a first transparent thin film layer on a second surface of the substrate by dipping the substrate in a liquid solution of a precursor for the thin film material at an angle to the vertical such that the layer of one side of the substrate has a thickness different from that on the opposite side, and applying a transparent electrically conductive coating over the thin film layer on at least one of the first and second surfaces. Preferably, the dipped substrate is fired at an elevated temperature prior to applying the transparent electrically conductive coating.

Claims

exact text as granted — not AI-modified
1 - 33 . (cancelled)  
     
     
         34 . A method for making a reduced glare, conductive coated panel comprising: 
 providing a transparent substrate having a first surface and a second surface;    forming a first transparent thin film layer on said first surface and a first transparent thin film layer on said second surface by dipping said substrate in a liquid solution of a precursor of a material for said first transparent thin film layers while maintaining said substrate at an angle to the vertical whereby said first layer on said first surface has a thickness greater than the thickness of said first layer on said second surface; and    applying a layer of a transparent electrically conductive coating over at least one of said first layer on said first surface and said first layer on said second surface.    
     
     
         35 . The method of  claim 34  including firing said dipped substrate at an elevated temperature to complete transformation of said as-dipped layers into said transparent thin films prior to said applying said layer of transparent electrically conducting coating.  
     
     
         36 . The method of  claim 34  wherein said angle is between about 5 and 25 degrees.  
     
     
         37 . The method of  claim 34  including forming a second transparent thin film layer on said first layer on said first surface and a second transparent thin film layer on said first layer on said second surface by dipping said substrate in a liquid solution of a precursor of a material for said second transparent thin film layers while maintaining said substrate coated with said first layers at an angle to the vertical, and applying said transparent electrically conductive coating to said second transparent thin film layer on at least one of said first surface and said second surface subsequent to forming said second transparent thin film layer on said first layer on said first surface and said second transparent thin film layer on said first layer on said second surface.  
     
     
         38 . The method of  claim 37  wherein said angle for dipping said coated substrate to form said second layers is between about 5 and 25 degrees.  
     
     
         39 . The method of  claim 37  including applying a transparent electrically conductive coating over each of said second layer on said first surface and said second layer on said second surface.  
     
     
         40 . The method of  claim 37  including forming a third transparent thin film layer on said second layer on said first surface, and a third transparent thin film layer on said second layer on said second surface by dipping said substrate in a liquid solution of a precursor of a material for said third transparent thin film layers while maintaining said substrate coated with said first and second layers at an angle to the vertical, and applying said transparent electrically conductive coating to said third transparent thin film layer on at least one of said first surface and said second surface subsequent to forming said third transparent thin film layer on said second layer on said first surface and said second layer on said second surface.  
     
     
         41 . The method of  claim 40  wherein said angle for dipping said coated substrate to form said third layers is between about 5 and 25 degrees.  
     
     
         42 . The method of  claim 40  including applying a transparent electrically conductive coating over each of said third layer on said first surface and said third layer on said second surface.  
     
     
         43 . The method of  claim 42  including applying said transparent electrically conductive coating by vacuum deposition.  
     
     
         44 . The method of  claim 43  wherein said vacuum deposition comprises sputtering.  
     
     
         45 . The method of  claim 40  including applying said transparent electrically conductive coating by vacuum deposition.  
     
     
         46 . The method of  claim 45  wherein said vacuum deposition comprises sputtering.  
     
     
         47 . The method of  claim 34  including applying a transparent electrically conductive coating over each of said first layer on said first surface and said first layer on said second surface.  
     
     
         48 . The method of  claim 34  including applying said transparent electrically conductive coating by vacuum deposition.  
     
     
         49 . The method of  claim 48  wherein said vacuum deposition comprises sputtering.  
     
     
         50 . The method of  claim 34  wherein said dipping said substrate in the liquid solution includes withdrawing said substrate from the liquid solution in a direction parallel to the direction in which said substrate extends when maintained at said angle to the vertical.

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