Low cost conductive containers manufactured from conductive loaded resin-based materials

Abstract

Conductive containers useful for anti-static devices are formed of a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

1 . A conductive container device comprising a conductive loaded, resin-based material comprising conductive materials in a base resin host wherein said container device is capable of physically supporting an object during transport and is capable of conducting electrical charge or current.  
   
   
       2 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.  
   
   
       3 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       4 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.  
   
   
       5 . The device according to  claim 1  wherein said conductive materials comprise metal powder.  
   
   
       6 . The device according to  claim 5  wherein said metal powder is nickel, copper, or silver.  
   
   
       7 . The device according to  claim 5  wherein said metal powder is a non-conductive material with a metal plating.  
   
   
       8 . The device according to  claim 7  wherein said metal plating is nickel, copper, silver, or alloys thereof.  
   
   
       9 . The device according to  claim 5  wherein said metal powder comprises a diameter of between about 3 μm and about 12 μm.  
   
   
       10 . The device according to  claim 1  wherein said conductive materials comprise non-metal powder.  
   
   
       11 . The device according to  claim 10  wherein said non-metal powder is carbon, graphite, or an amine-based material.  
   
   
       12 . The device according to  claim 1  wherein said conductive materials comprise a combination of metal powder and non-metal powder.  
   
   
       13 . The device according to  claim 1  wherein said conductive materials comprise micron conductive fiber.  
   
   
       14 . The device according to  claim 13  wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.  
   
   
       15 . The device according to  claim 13  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       16 . The device according to  claim 13  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       17 . The device according to  claim 13  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       18 . The device according to  claim 17  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       19 . The device according to  claim 1  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       20 . The device according to  claim 19  wherein said conductive fiber is stainless steel.  
   
   
       21 . The device according to  claim 1  wherein said base resin and said conductive materials comprise flame-retardant materials.  
   
   
       22 . The device according to  claim 1  further comprising a metal layer overlying said conductive loaded resin-based material.  
   
   
       23 . The device according to  claim 1  further comprising slots, chambers, or pockets of said conductive loaded resin-based material to support multiple said objects.  
   
   
       24 . The device according to  claim 1  further comprising a lid of said conductive loaded resin-based material.  
   
   
       25 . The device according to  claim 1  wherein said conductive loaded resin-based material is transparent.  
   
   
       26 . The device according to  claim 1  further comprising an electronic device that is encapsulated by said container device.  
   
   
       27 . The device according to  claim 1  further comprising side walls and a bottom of said conductive loaded resin-based material.  
   
   
       28 . The device according to  claim 27  wherein one side wall is of reduced height or is tilted to allow side access to said object in said container device.  
   
   
       29 . The device according to  claim 27  wherein said device comprises a trash receptacle.  
   
   
       30 . The device according to  claim 1  wherein said device comprises a flexible bag of said conductive loaded resin-based material.  
   
   
       31 . The device according to  claim 30  wherein said flexible bag comprises bubble wrapping.  
   
   
       32 . The device according to  claim 1  wherein said device is a jug, canister, drum or barrel.  
   
   
       33 . A conductive container device comprising a conductive loaded, resin-based material comprising conductive materials in a base resin host wherein said container device is capable of physically supporting an object during transport and is capable of conducting electrical charge or current wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.  
   
   
       34 . The device according to  claim 33  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       35 . The device according to  claim 33  wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.  
   
   
       36 . The device according to  claim 33  wherein said conductive materials comprise metal powder.  
   
   
       37 . The device according to  claim 36  wherein said metal powder is a non-conductive material with a metal plating.  
   
   
       38 . The device according to  claim 33  wherein said conductive materials comprise non-metal powder.  
   
   
       39 . The device according to  claim 33  wherein said conductive materials comprise a combination of metal powder and non-metal powder.  
   
   
       40 . The device according to  claim 33  wherein said conductive materials comprise micron conductive fiber.  
   
   
       41 . The device according to  claim 40  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       42 . The device according to  claim 40  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       43 . The device according to  claim 33  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       44 . The device according to  claim 43  wherein said conductive fiber is stainless steel.  
   
   
       45 . The device according to  claim 33  further comprising a metal layer overlying said conductive loaded resin-based material.  
   
   
       46 . The device according to  claim 33  further comprising slots, chambers, or pockets of said conductive loaded resin-based material to support multiple said objects.  
   
   
       47 . The device according to  claim 33  further comprising a lid of said conductive loaded resin-based material.  
   
   
       48 . The device according to  claim 33  wherein said conductive loaded resin-based material is transparent.  
   
   
       49 . The device according to  claim 33  further comprising an electronic device that is encapsulated by said container device.  
   
   
       50 . The device according to  claim 33  further comprising side walls and a bottom of said conductive loaded resin-based material.  
   
   
       51 . The device according to  claim 50  wherein one side wall is of reduced height or is tilted to allow side access to said object in said container device.  
   
   
       52 . The device according to  claim 50  wherein said device comprises a trash receptacle.  
   
   
       53 . The device according to  claim 33  wherein said device comprises a flexible bag of said conductive loaded resin-based material.  
   
   
       54 . The device according to  claim 53  wherein said flexible bag comprises bubble wrapping.  
   
   
       55 . The device according to  claim 33  wherein said device is a jug, canister, drum or barrel.  
   
   
       56 . A method to form a conductive container device, said method comprising: 
 providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host; and    molding said conductive loaded, resin-based material into said conductive container device.    
   
   
       57 . The method according to  claim 56  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       58 . The method according to  claim 56  wherein said conductive materials comprise micron conductive fiber.  
   
   
       59 . The method according to  claim 58  wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.  
   
   
       60 . The method according to  claim 58  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       61 . The method according to  claim 58  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       62 . The method according to  claim 58  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       63 . The method according to  claim 62  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       64 . The method according to  claim 56  wherein said conductive materials comprise conductive powder.  
   
   
       65 . The method according to  claim 56  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       66 . The method according to  claim 56  wherein said molding comprises: 
 injecting-said conductive loaded, resin-based material into a mold;    curing said conductive loaded, resin-based material; and    removing said conductive container device from said mold.    
   
   
       67 . The method according to  claim 56  wherein said molding comprises: 
 loading said conductive loaded, resin-based material into a chamber;    extruding said conductive loaded, resin-based material out of said chamber through a shaping outlet; and    curing said conductive loaded, resin-based material to form said conductive container device.    
   
   
       68 . The method according to  claim 56  further comprising subsequent mechanical processing of said molded conductive loaded, resin-based material.  
   
   
       69 . The method according to  claim 56  further comprising overlying a layer of metal on said molded conductive loaded, resin-based material.  
   
   
       70 . The method according to  claim 56  wherein said molding comprises: 
 loading said conductive loaded, resin-based material into a chamber;    vacuum forming said conductive loaded, resin-based material; and    removing said conductive container device from said mold.