Very low resistance electrical interfaces to conductive loaded resin-based materials

Abstract

Electrical interfaces formed into a conductive loaded resin-based material. The conductive loaded resin-based material comprises micron conductive powder(s), conductive fiber(s), or a combination of conductive powder and conductive fibers in a base resin host. The percentage by weight of the conductive powder(s), conductive fiber(s), or a combination thereof is between about 20% and 50% of the weight of the conductive loaded resin-based material. The micron conductive powders are formed from non-metals, such as carbon, graphite, that may also be metallic plated, or the like, or from metals such as stainless steel, nickel, copper, silver, that may also be metallic plated, or the like, or from a combination of non-metal, plated, or in combination with, metal powders. The micron conductor fibers preferably are of nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like.

1 . A conductive device comprising: 
 a conductive loaded, resin-based material comprising conductive materials in a base resin host; and    a metal terminal embedded in said conductive loaded, resin-based material.    
   
   
       2 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material.  
   
   
       3 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       4 . The device according to  claim 1  wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.  
   
   
       5 . The device according to  claim 1  wherein said conductive materials comprise metal powder.  
   
   
       6 . The device according to  claim 5  wherein said metal powder is nickel, copper, or silver.  
   
   
       7 . The device according to  claim 5  wherein said metal powder is a non-conductive material with a metal plating.  
   
   
       8 . The device according to  claim 7  wherein said metal plating is nickel, copper, silver, or alloys thereof.  
   
   
       9 . The device according to  claim 5  wherein said metal powder comprises a diameter of between about 3 μm and about 12 μm.  
   
   
       10 . The device according to  claim 1  wherein said conductive materials comprise non-metal powder.  
   
   
       11 . The device according to  claim 10  wherein said non-metal powder is carbon, graphite, or an amine-based material.  
   
   
       12 . The device according to  claim 1  wherein said conductive materials comprise a combination of metal powder and non-metal powder.  
   
   
       13 . The device according to  claim 1  wherein said conductive materials comprise micron conductive fiber.  
   
   
       14 . The device according to  claim 13  wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.  
   
   
       15 . The device according to  claim 13  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       16 . The device according to  claim 13  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       17 . The device according to  claim 13  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       18 . The device according to  claim 17  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       19 . The device according to  claim 1  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       20 . The device according to  claim 19  wherein said conductive fiber is stainless steel.  
   
   
       21 . The device according to  claim 1  wherein said base resin and said conductive materials comprise flame-retardant materials.  
   
   
       22 . The device according to  claim 1  further comprising a metal layer overlying said conductive loaded resin-based material.  
   
   
       23 . The device according to  claim 1  wherein said metal terminal comprises a magnetizable material.  
   
   
       24 . The device according to  claim 23  wherein said metal terminal comprises iron.  
   
   
       25 . The device according to  claim 23  wherein a region of said conductive loaded resin-based material near said metal terminal is of higher conductive loading concentration than other regions of said conductive loaded resin-based material.  
   
   
       26 . The device according to  claim 23  wherein said metal terminal further comprises a solderable layer.  
   
   
       27 . The device according to  claim 1  wherein said metal terminal is a pin.  
   
   
       28 . The device according to  claim 1  wherein said metal terminal is a through hole socket.  
   
   
       29 . The device according to  claim 1  wherein said metal terminal is molded into said conductive loaded resin-based material.  
   
   
       30 . The device according to  claim 1  wherein said metal terminal is a screw or a nail.  
   
   
       31 . The device according to  claim 1  wherein said metal terminal is ultrasonically welded into said conductive loaded resin-based material.  
   
   
       32 . The device according to  claim 1  wherein said metal terminal is heat pressed into said conductive loaded resin-based material.  
   
   
       33 . A conductive device comprising: 
 a conductive loaded, resin-based material comprising conductive materials in a base resin host wherein the percent by weight of said conductive materials is between about 20% and about 50% of the total weight of said conductive loaded resin-based material; and    a metal terminal embedded in said conductive loaded, resin-based material.    
   
   
       34 . The device according to  claim 33  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       35 . The device according to  claim 33  wherein the percent by weight of said conductive materials is between about 25% and about 35% of the total weight of said conductive loaded resin-based material.  
   
   
       36 . The device according to  claim 33  wherein said conductive materials comprise metal powder.  
   
   
       37 . The device according to  claim 36  wherein said metal powder is a non-conductive material with a metal plating.  
   
   
       38 . The device according to  claim 36  wherein said metal powder comprises a diameter of between about 3 μm and about 12 μm.  
   
   
       39 . The device according to  claim 33  wherein said conductive materials comprise non-metal powder.  
   
   
       40 . The device according to  claim 33  wherein said conductive materials comprise a combination of metal powder and non-metal powder.  
   
   
       41 . The device according to  claim 33  wherein said conductive materials comprise micron conductive fiber.  
   
   
       42 . The device according to  claim 41  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       43 . The device according to  claim 41  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       44 . The device according to  claim 41  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       45 . The device according to  claim 44  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       46 . The device according to  claim 33  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       47 . The device according to  claim 46  wherein said conductive fiber is stainless steel.  
   
   
       48 . The device according to  claim 33  further comprising a metal layer overlying said conductive loaded resin-based material.  
   
   
       49 . The device according to  claim 33  wherein said metal terminal comprises a magnetizable material.  
   
   
       50 . The device according to  claim 49  wherein said metal terminal comprises iron.  
   
   
       51 . The device according to  claim 49  wherein a region of said conductive loaded resin-based material near said metal terminal is of higher conductive loading concentration than other regions of said conductive loaded resin-based material.  
   
   
       52 . The device according to  claim 49  wherein said metal terminal further comprises a solderable layer.  
   
   
       53 . The device according to  claim 33  wherein said metal terminal is a pin.  
   
   
       54 . The device according to  claim 33  wherein said metal terminal is a through hole socket.  
   
   
       55 . The device according to  claim 33  wherein said metal terminal is molded into said conductive loaded resin-based material.  
   
   
       56 . The device according to  claim 33  wherein said metal terminal is a screw or a nail.  
   
   
       57 . The device according to  claim 33  wherein said metal terminal is ultrasonically welded into said conductive loaded resin-based material.  
   
   
       58 . The device according to  claim 33  wherein said metal terminal is heat pressed into said conductive loaded resin-based material.  
   
   
       59 . A method to form a conductive device, said method comprising: 
 providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host;    providing a metal terminal; and    molding said metal terminal into said conductive loaded resin-based material to complete said conductive device.    
   
   
       60 . The method according to  claim 59  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       61 . The method according to  claim 59  wherein said conductive materials comprise micron conductive fiber.  
   
   
       62 . The method according to  claim 61  wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.  
   
   
       63 . The method according to  claim 61  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       64 . The method according to  claim 61  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       65 . The method according to  claim 61  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       66 . The method according to  claim 65  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       67 . The method according to  claim 59  wherein said conductive materials comprise conductive powder.  
   
   
       68 . The method according to  claim 59  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       69 . The method according to  claim 59  wherein said molding comprises: 
 placing said metal terminal in a mold;    injecting said conductive loaded, resin-based material into said mold;    curing said conductive loaded, resin-based material; and    removing said conductive device from said mold.    
   
   
       70 . The method according to  claim 59  wherein said metal terminal is magnetizable.  
   
   
       71 . The method according to  claim 70  further comprising magnetizing said metal terminal prior to said step of molding.  
   
   
       72 . The method according to  claim 71  wherein said step of magnetizing is performed inside of a molding apparatus.  
   
   
       73 . The method according to  claim 71  wherein said metal terminal maintains said magnetizing until experiencing a heat treatment.  
   
   
       74 . The method according to  claim 73  wherein said heat treatment is a soldering operation.  
   
   
       75 . The method according to  claim 74  wherein said metal terminal further comprises a solderable plating.  
   
   
       76 . The method according to  claim 71  wherein said conductive loaded resin-based material near said magnetized metal terminal has a high concentration of said conductive loading.  
   
   
       77 . The method according to  claim 59  wherein said metal terminal is a pin or a socket.  
   
   
       78 . The method according to  claim 59  wherein said molding comprises: 
 placing said metal terminal into a chamber;    loading said conductive loaded, resin-based material into said chamber;    extruding said conductive loaded, resin-based material out of said chamber through a shaping outlet; and    curing said conductive loaded, resin-based material to form said antenna device.    
   
   
       79 . The method according to  claim 59  further comprising subsequent mechanical processing of said molded conductive loaded, resin-based material.  
   
   
       80 . A method to form a conductive device, said method comprising: 
 molding a conductive loaded, resin-based material comprising conductive materials in a resin-based host;    providing a metal terminal; and    embedding said metal terminal into said conductive loaded resin-based material to complete a conductive device.    
   
   
       81 . The method according to  claim 80  wherein the percent by weight of said conductive materials is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       82 . The method according to  claim 80  wherein said conductive materials comprise micron conductive fiber.  
   
   
       84 . The method according to  claim 82  wherein said micron conductive fiber is nickel plated carbon fiber, or stainless steel fiber, or copper fiber, or silver fiber or combinations thereof.  
   
   
       85 . The method according to  claim 82  wherein said micron conductive fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       86 . The method according to  claim 82  wherein the percent by weight of said micron conductive fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       87 . The method according to  claim 82  wherein said micron conductive fiber is stainless steel and wherein the percent by weight of said stainless steel fiber is between about 20% and about 40% of the total weight of said conductive loaded resin-based material.  
   
   
       88 . The method according to  claim 87  wherein said stainless steel fiber has a diameter of between about 3 μm and about 12 μm and a length of between about 2 mm and about 14 mm.  
   
   
       89 . The method according to  claim 80  wherein said conductive materials comprise conductive powder.  
   
   
       90 . The method according to  claim 80  wherein said conductive materials comprise a combination of conductive powder and conductive fiber.  
   
   
       91 . The method according to  claim 80  wherein said step of embedding comprises: 
 forming a hole in said conductive loaded resin-based material;    inserting said metal terminal into said hole; and    ultrasonically welding said metal terminal to said conductive loaded resin-based material.    
   
   
       92 . The method according to  claim 91  wherein said step of forming a hole is performed during said step of molding.  
   
   
       93 . The method according to  claim 91  wherein said step of forming a hole comprises drilling, stamping, or punching said conductive loaded resin-based material after said step of molding.  
   
   
       94 . The method according to  claim 80  wherein said step of embedding comprises mechanically driving said metal terminal into said conductive loaded resin-based material.  
   
   
       95 . The method according to  claim 94  wherein said metal terminal comprises a screw.  
   
   
       96 . The method according to  claim 80  wherein said step of embedding comprises: 
 heating said conductive loaded resin-based material; and    pressing said metal terminal into said conductive loaded resin-based material.