Method of forming a package

Abstract

A method of forming a package. The method includes attaching a device to a baseplate to form a subassembly, and placing the subassembly into an opening defined by a cover that includes a plastic body and a lead such that the device is connected to the lead. The method further includes sealing a gap between the cover and the baseplate.

1 - 22 . (Canceled)  
   
   
       23 . A method of packaging a device, comprising: 
 attaching the device to a base; and    attaching the base to a cover, the cover including a plastic body and at least one electrically conductive lead, such that the body encloses the device and such that the an exposed portion of the lead is electrically connected to the device.    
   
   
       24 . The method of  claim 23 , wherein attaching the device to the base includes attaching the device to an electrically conductive baseplate with conductive epoxy.  
   
   
       25 . The method of  claim 23 , further comprising attaching at least one electrically conductive bump to the device prior to attaching the base to the cover, and wherein attaching the base to the cover includes attaching the base to the cover such that the exposed portion of the lead is electrically connected to the device via the bump.  
   
   
       26 . The method of  claim 25 , wherein attaching at least one electrically conductive bump to the device includes attaching at least one electrically conductive bump to the device with conductive epoxy.  
   
   
       27 . The method of  claim 25 , wherein attaching the base to the cover includes: 
 positioning the base with a pick-and-place machine such that an inner surface of the body of the cover is adjacent to the base and such that the that the exposed portion of the lead is electrically connected to the device via the bump;    curing a conductive epoxy between the bump and the exposed portion of the lead; and    curing an epoxy between the inner surface of the body of the cover and the base.    
   
   
       28 . A method of forming a package, the method comprising: 
 attaching a device to a baseplate to form a subassembly;    placing the subassembly into an opening defined by a cover that includes a plastic body and a lead such that the device is connected to the lead; and    sealing a gap between the cover and the baseplate.    
   
   
       29 . The method of  claim 28 , wherein attaching the device includes attaching the device with a eutectic die attach.  
   
   
       30 . The method of  claim 28 , wherein attaching the device includes attaching the device with a conductive epoxy.  
   
   
       31 . The method of  claim 28 , wherein attaching the device includes attaching the device to an electrically conductive baseplate.  
   
   
       32 . The method of  claim 31 , wherein attaching the device includes attaching the device to a thermally conductive baseplate.  
   
   
       33 . The method of  claim 28 , wherein attaching the device includes attaching the device to an insulative baseplate.  
   
   
       34 . The method of  claim 28 , wherein placing the subassembly includes placing the subassembly with a pick-and-place machine.  
   
   
       35 . The method of  claim 28 , wherein placing the subassembly includes flipping the subassembly prior to placing the subassembly.  
   
   
       36 . The method of  claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad.  
   
   
       37 . The method of  claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad of a substrate.  
   
   
       38 . The method of  claim 28 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via a bonding pad of the device.  
   
   
       39 . The method of  claim 38 , wherein placing the subassembly includes placing the subassembly such that the device is connected to the lead via an electrically conductive bump.  
   
   
       40 . The method of  claim 28 , wherein sealing the gap between the cover and the baseplate includes sealing the gap with a nonconductive epoxy.  
   
   
       41 . The method of  claim 28 , further comprising attaching an electrically conductive bump to a bonding pad of the device prior to placing the subassembly.  
   
   
       42 . The method of  claim 41 , wherein attaching the electrically conductive bump includes attaching the electrically conductive bump with a ball bonder.  
   
   
       43 . The method of  claim 41 , further comprising soldering the electrically conductive bump to an exposed portion of the lead.  
   
   
       44 . The method of  claim 41 , further comprising thermally compressing the electrically conductive bump to an exposed portion of the lead.  
   
   
       45 . The method of  claim 41 , further comprising ultrasonically bonding the electrically conductive bump to an exposed portion of the lead.  
   
   
       46 . The method of  claim 28 , further comprising applying a conductive epoxy on an exposed portion of the lead prior to placing the subassembly.  
   
   
       47 . The method of  claim 28 , further comprising curing the package after sealing the gap between the cover and the baseplate  
   
   
       48 . The method of  claim 47 , wherein curing the package includes curing a conductive epoxy applied to an exposed portion of the lead.  
   
   
       49 . The method of  claim 47 , wherein curing the package includes curing a nonconductive epoxy applied between the cover and the baseplate.  
   
   
       50 . The method of  claim 47 , wherein curing the package includes applying pressure to the baseplate.