Multi media card formed by transfer molding

Abstract

A semiconductor card is made by a method which in one molding step forms a plastic body on a substrate attached to a surrounding frame by narrow connecting segments spanning a peripheral opening. The connecting segments are motivated downward by pins outside of the card periphery, holding the substrate against a lower level of the mold cavity during molding. Molded wings extending laterally from the card periphery are also formed. Following molding and curing, the casting is removed and the card singulated by excising the wings from the card. The resulting card has smooth edge surfaces and precise dimensions. Separate glob top encapsulation is avoided.

1 . A semiconductor card comprising: 
 a printed circuit substrate having a circuit side, a back side and a peripheral substrate edge with front and back edge corners, the substrate including a plurality of conductors on the circuit side and a plurality of external contacts on the back side in electrical communication with the conductors;    at least one semiconductor component on the circuit side in electrical communication with the conductors;    a plastic body molded to the circuit side and extending laterally from the peripheral edge to form a card having a front face and a back face with a smooth card edge connecting said faces, said plastic body encapsulating the semiconductor component and conductors while leaving external contacts exposed; and    a plurality of narrow ends of connecting segments of the substrate intersecting with a peripheral edge and exposed therein.    
   
   
       2 . A semiconductor card in accordance with  claim 1 , wherein the back side of said substrate is substantially exposed.  
   
   
       3 . A semiconductor card in accordance with  claim 1 , further comprising a cut central portion of said card edge intermediate and separated from the peripheral edges along the front face and back face.  
   
   
       4 . A semiconductor card in accordance with  claim 1 , wherein said back face is substantially continuously planar.  
   
   
       5 . A semiconductor card in accordance with  claim 1 , wherein said substrate comprises a printed circuit board.  
   
   
       6 . A semiconductor card in accordance with  claim 1 , wherein said card has a thickness of about 1 mm to about 6 mm.  
   
   
       7 . A semiconductor card in accordance with  claim 1 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       8 . A semiconductor card in accordance with  claim 1 , wherein said substrate comprises a reinforced organic polymer resin.  
   
   
       9 . A semiconductor card in accordance with  claim 1 , wherein the plastic body comprises a Novoloc epoxy resin.  
   
   
       10 . A semiconductor card in accordance with  claim 1 , wherein said at least one semiconductor component comprises flash memory.  
   
   
       11 . A semiconductor card in accordance with  claim 1 , wherein said card comprises a memory card for digitally recording and retrievably storing photographic data in a digital camera.  
   
   
       12 . A module for forming a semiconductor card with a card outline, said module comprising: 
 a strip of planar insulating material having a circuit side and a back side;    a peripheral opening defining the outer edge of a substrate and the inner edge of a frame, said opening having an inner edge inside of the card outline and an outside edge outside of the card outline; and    a plurality of connecting segments of said strip connecting said substrate to said frame, said connecting segments configured for forced movement to a level different from the frame, wherein said substrate, frame, opening and segments comprise said module.    
   
   
       13 . A module in accordance with  claim 12 , wherein the width of said peripheral opening adjacent connecting segments is enlarged to elongate said segments.  
   
   
       14 . A module in accordance with  claim 12 , wherein said connecting segments connect the substrate to the frame on opposing sides thereof.  
   
   
       15 . A module in accordance with  claim 12 , wherein said strip of planar material comprises a printed circuit board.  
   
   
       16 . A module in accordance with  claim 12 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       17 . A module in accordance with  claim 12 , wherein said substrate comprises a reinforced organic polymer resin.  
   
   
       18 . A card for semiconductor components comprising: 
 a substrate having a circuit side, a back side and a peripheral substrate edge with front and back edge corners, the substrate including a plurality of conductors on the circuit side and a plurality of external contacts on the back side in electrical communication with the conductors;    a semiconductor component on the circuit side in electrical communication with the conductors;    a plastic body molded to the circuit side and extending laterally from the peripheral edge to form a card having a front face and a back face with a smooth card edge connecting said faces, said plastic body for encapsulating the semiconductor component and conductors while leaving the external contacts exposed; and    a plurality of narrow ends of connecting segments of the substrate intersecting with a peripheral edge and exposed therein.    
   
   
       19 . A card in accordance with  claim 18 , wherein the back side of said substrate is substantially exposed.  
   
   
       20 . A card in accordance with  claim 18 , further comprising a cut central portion of said card edge intermediate and separated from the peripheral edges along the front face and back face.  
   
   
       21 . A card in accordance with  claim 18 , wherein said back face is substantially continuously planar.  
   
   
       22 . A card in accordance with  claim 18 , wherein said substrate comprises a printed circuit board.  
   
   
       23 . A card in accordance with  claim 18 , wherein said card has a thickness of about 1 mm to about 6 mm.  
   
   
       24 . A card in accordance with  claim 18 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       25 . A card in accordance with  claim 18 , wherein said substrate comprises a reinforced organic polymer resin.  
   
   
       26 . A card in accordance with  claim 18 , wherein the plastic body comprises a Novoloc epoxy resin.  
   
   
       27 . A card in accordance with  claim 18 , wherein said at least one semiconductor component comprises flash memory.  
   
   
       28 . A card in accordance with  claim 18 , wherein said card comprises a memory card for digitally recording and retrievably storing data for a digital camera.  
   
   
       29 . A module having a substrate having an outline, said module comprising: 
 a strip of planar insulating material having a circuit side and a back side;    a peripheral opening defining the outer edge of a substrate and the inner edge of a frame, said opening having an inner edge inside of the card outline and an outside edge outside of the card outline; and    a plurality of connecting segments of said strip connecting said substrate to said frame, said connecting segments for forcing movement to a level different from the frame, said substrate, frame, opening and segments comprising said module.    
   
   
       30 . A module in accordance with  claim 29 , wherein the width of said peripheral opening adjacent connecting segments includes an enlarged opening to elongate said segments.  
   
   
       31 . A module in accordance with  claim 29 , wherein said connecting segments connect the substrate to the frame on opposing sides thereof.  
   
   
       32 . A module in accordance with  claim 29  wherein said strip of planar material comprises a printed circuit board.  
   
   
       33 . A module in accordance with  claim 29 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       34 . A module in accordance with  claim 29 , wherein said substrate comprises a reinforced organic polymer resin.  
   
   
       35 . A card for components comprising: 
 a substrate having a circuit side, a back side and a peripheral substrate edge with front and back edge corners, the substrate including a plurality of conductors on the circuit side and a plurality of external contacts on the back side in electrical communication with the conductors;    a component on the circuit side in electrical communication with the conductors;    a plastic body molded to the circuit side and extending laterally from the peripheral edge to form a card having a front face and a back face with a smooth card edge connecting said faces, said plastic body for encapsulating the component and conductors while leaving the external contacts exposed; and    a plurality of narrow ends of connecting segments of the substrate intersecting with a peripheral edge and exposed therein.    
   
   
       36 . A card in accordance with  claim 35 , wherein the back side of said substrate is substantially exposed.  
   
   
       37 . A card in accordance with  claim 35 , further comprising a cut central portion of said card edge intermediate and separated from the peripheral edges along the front face and back face.  
   
   
       38 . A card in accordance with  claim 35 , wherein said back face is substantially continuously planar.  
   
   
       39 . A card in accordance with  claim 35 , wherein said substrate comprises a printed circuit board.  
   
   
       40 . A card in accordance with  claim 35 , wherein said card has a thickness of about 1 mm to about 6 mm.  
   
   
       41 . A card in accordance with  claim 35 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       42 . A card in accordance with  claim 35 , wherein said substrate comprises a reinforced organic polymer resin.  
   
   
       43 . A card in accordance with  claim 35 , wherein the plastic body comprises a Novoloc epoxy resin.  
   
   
       44 . A card in accordance with  claim 35 , wherein said at least one semiconductor component comprises flash memory.  
   
   
       45 . A card in accordance with  claim 35 , wherein said card comprises a memory card for digitally recording and retrievably storing data.  
   
   
       46 . A module comprising: 
 a strip of planar insulating material having a circuit side, a back side, and an outline, said strip comprising a substrate;    a peripheral opening defining the outer edge of a substrate and the inner edge of a frame, said opening having an inner edge inside of the card outline and an outside edge outside of the card outline; and    a plurality of connecting segments of said strip connecting said substrate to said frame, said connecting segments for forcing movement to a level different from the frame, said substrate, frame, opening and segments comprising said module.    
   
   
       47 . A module in accordance with  claim 46 , wherein the width of said peripheral opening adjacent connecting segments includes an enlarged opening to elongate said segments.  
   
   
       48 . A module in accordance with  claim 46 , wherein said connecting segments connect the substrate to the frame on opposing sides thereof.  
   
   
       49 . A module in accordance with  claim 46  wherein said strip of planar material comprises a printed circuit board.  
   
   
       50 . A module in accordance with  claim 46 , wherein said substrate has a thickness of about 0.2 to about 1.6 mm.  
   
   
       51 . A module in accordance with  claim 46 , wherein said substrate comprises a reinforced organic polymer resin.