US2005023270A1PendingUtilityA1

Ceramic substrate and process for producing the same

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Assignee: IBIDEN CO LTDPriority: Feb 25, 2000Filed: Aug 30, 2004Published: Feb 3, 2005
Est. expiryFeb 25, 2020(expired)· nominal 20-yr term from priority
Inventors:Yasuji HiramatsuYasutaka Ito
H10P 72/722H10P 72/72H10P 72/0432H05B 3/265H05B 3/74H05B 3/143H05B 3/18
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Claims

Abstract

An object of the present invention is to provide a ceramic substrate that is superior in heat uniformity and thermal shock resistance, and has a large chuck power in the case that the ceramic substrate is made to be an electrostatic chuck. The ceramic substrate of the present invention is a ceramic substrate comprising a conductor layer formed therein, characterized in that a section of the edge of the conductor layer is in a peaked shape.

Claims

exact text as granted — not AI-modified
1 - 5 . (Canceled)  
   
   
       6 . A ceramic substrate comprising a conductor layer formed therein, characterized in that a section of the edge of the conductor layer is in a peaked shape.  
   
   
       7 . The ceramic substrate according to  claim 6 , wherein the conductor layer is a resistance heating element and functions as a hot plate.  
   
   
       8 . The ceramic substrate according to  claim 6 , wherein the conductor layer is an electrostatic electrode and functions as an electrostatic chuck.  
   
   
       9 . The ceramic substrate according to  claim 7 , wherein the conductor layer is an electrostatic electrode and functions as an electrostatic chuck.  
   
   
       10 . The ceramic substrate according to  claim 6 , wherein the conductor layer has a portion in the peaked-shape having a width of 0.1 to 200 μm.  
   
   
       11 . The ceramic substrate according to  claim 7 , wherein the conductor layer has a portion in the peaked-shape having a width of 0.1 to 200 μm.  
   
   
       12 . The ceramic substrate according to  claim 8 , wherein the conductor layer has a portion in the peaked-shape having a width of 0.1 to 200 μm.  
   
   
       13 . The ceramic substrate according to  claim 9 , wherein the conductor layer has a portion in the peaked-shape having a width of 0.1 to 200 μm.  
   
   
       14 . A process for producing a ceramic substrate, characterized by printing a conductor layer on a ceramic green sheet, integrating the green sheet with another green sheet under heating and pressure, and then sintering a ceramic powder.

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