Method for supporting circuit component having solder column array interconnects using interposed support shims

Abstract

A circuit board assembly has a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA integrated circuit package has a substrate having an array of solder columns extending from a bottom surface. An oversized lid is affixed to the substrate. The method of supporting the CGA integrated circuit package includes disposing support shims between a portion of the lid that extends beyond an outer periphery of the substrate and a circuit board to which the CGA integrated circuit package is mounted. The support shims are affixed to the lid with adhesive after the CGA integrated circuit package is mounted on the circuit board. The adhesive accommodates any variations in height in the CGA integrated circuit package.

1 . In a circuit board assembly having a circuit board and an integrated circuit package, the integrated circuit package having a substrate with an array of solder columns extending from a bottom surface of the substrate to the circuit board, a method of supporting the integrated circuit package against compressive force, comprising the steps of affixing an oversized lid to the substrate having a portion that extends beyond a periphery of the substrate, and disposing at least one support shim between the portion of the lid that extends beyond the periphery of the substrate and the circuit board after the integrated circuit package has been mounted on the circuit board.  
   
   
       2 . The method of  claim 1  and further including the step of affixing the at least one support shim by adhesive to the lid, the adhesive accommodating any variations in height of the integrated circuit package.  
   
   
       3 . The method of  claim 2  wherein the step of affixing the at least one support shim by adhesive to the lid includes filling any gaps between the lid and the at least one support shim with the adhesive.  
   
   
       4 . The method of  claim 2  wherein the integrated circuit package is rectangular and the step of providing the at least one support shim includes providing at least one support shim at each corner of the integrated circuit package.  
   
   
       5 . The method of  claim 2  wherein the integrated circuit package is rectangular and the step of providing the at least one support shim includes providing at least one support shim at each side of the integrated circuit package.  
   
   
       6 . The method of  claim 2  wherein the integrated circuit package is a column grid array integrated circuit package.