Circuit module and manufacturing method thereof

Abstract

A circuit module includes an electronic component, a ceramic multilayer substrate and a resin wiring substrate. The ceramic multilayer substrate is provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized. The resin wiring substrate has an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin. The ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.

1 . A circuit module comprising: 
 an electronic component;    a ceramic multilayer substrate provided with a wiring layer disposed on top thereof and a cavity in which the electronic component is mounted, wherein a space between the electronic component and the cavity is filled with a thermosetting resin and a surface of the filled cavity is planarized; and    a resin wiring substrate including an insulating adhesive layer disposed at one side thereof and provided with at least one opening filled with a conductive resin,    wherein the ceramic multilayer substrate and the resin wiring substrate are bonded by the insulating adhesive layer, and the wiring layer on the ceramic multilayer substrate is electrically connected with the conductive resin.    
   
   
       2 . The circuit module of  claim 1 , wherein the height difference between a surface of the thermosetting resin filling the cavity and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer.  
   
   
       3 . The circuit module of  claim 1 , wherein the resin wiring substrate further includes one or more stacking sheets, each of the stacking sheets having an insulating adhesive layer, a wiring layer formed thereon, the insulating adhesive layer being provided with at least one opening filled with a conductive resin which is electrically connected to the wiring layer of each of the stacking sheets.  
   
   
       4 . The circuit module of  claim 1 , wherein the insulating adhesive layer makes use of a thermosetting material.  
   
   
       5 . The circuit module of  claim 1 , wherein the ceramic multilayer substrate is made of a glass-ceramic material allowing a low temperature sintering.  
   
   
       6 . The circuit module of  claim 1 , wherein at least one electronic component is mounted on a surface of the resin wiring substrate, at least a part of said at least one electronic component being located directly above at least a part of the cavity formed in the ceramic multilayer substrate.  
   
   
       7 . The circuit module of  claim 1 , wherein the electronic component mounted in the cavity includes a semiconductor integrated circuit device.  
   
   
       8 . A method of fabricating a circuit module, comprising the steps of: 
 (a) mounting at least one electronic component in a cavity provided in a ceramic multilayer substrate;    (b) filling a space between the electronic component and the cavity with a thermosetting resin to planarize a surface of the filled cavity;    (c) providing at least one opening in an insulating adhesive layer of a sheet having the insulating adhesive layer and a metal layer stacked on each other or in both of the insulating adhesive layer and the metal layer, and filling the opening with a conductive resin connected to the metal layer;    (d) bonding the sheet and the ceramic multilayer substrate by the insulating adhesive layer and at the same time electrically connecting a wiring layer formed on the ceramic multilayer substrate with the conductive resin; and    (e) patterning the metal layer of the sheet to form a wiring layer.    
   
   
       9 . The method of  claim 8 , further comprising, after the step (e), the steps of: 
 (f) bonding a stacking sheet which has an insulating adhesive layer and a metal layer, at least one opening being provided in the insulating adhesive layer or in both of the insulating adhesive layer and the metal layer and filled with a conductive resin connected with the metal layer, by means of the insulating adhesive layer, onto an uppermost layer of an assembly provided in the immediately preceding step and at the same time electrically connecting the wiring layer formed on the uppermost layer with the conductive resin of the stacking sheet; and    (g) patterning the metal layer of the stacking sheet to form a wiring layer, wherein the steps (f) and (g) are repeated N times (N being an integer not smaller than 1).    
   
   
       10 . The method of  claim 8 , wherein an amount of the thermosetting resin used in said step (b) of filling the space to planarize the surface of the filled cavity corresponds to the difference between a volume of the cavity and that of the electronic component, and the height difference between a surface of the thermosetting resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer in the immediate vicinity of the ceramic multilayer substrate.  
   
   
       11 . The method of  claim 8 , wherein the step (b) of filling the space to planarize the surface of the filled cavity is carried out by first filling the cavity with the thermosetting resin by using an amount exceeding the difference between a volume of the cavity and that of the electronic component, thermally curing the filled thermosetting resin, and then polishing a surface of the cured thermosetting resin and wherein the height difference between a surface of the polished resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer directly abutting the ceramic multilayer substrate.  
   
   
       12 . The method of  claim 8 , wherein the electronic component includes a semiconductor integrated circuit device.  
   
   
       13 . A method of fabricating a circuit module, comprising the steps of: 
 (a) mounting at least one electronic component in a cavity provided in a ceramic multilayer substrate;    (b) filling a space between the electronic component and the cavity with a thermosetting resin to planarize a surface of the filled cavity;    (c) patterning a metal layer of a sheet to form a wiring layer, the sheet having an insulating adhesive layer and the metal layer stacked on each other;    (d) providing at least one opening in the insulating adhesive layer or in both of the insulating adhesive layer and the wiring layer, and filling the opening with a conductive resin connected to the wiring layer; and    (e) bonding the sheet and the ceramic multilayer substrate by means of the insulating adhesive layer and at the same time electrically connecting a wiring layer formed on the ceramic multilayer substrate with the conductive resin.    
   
   
       14 . The method of  claim 13 , further comprising, after the step (e), the step of: 
 (f) bonding a stacking sheet which has an insulating adhesive layer and a wiring layer, at least one opening being provided in the insulating adhesive layer or in both of the insulating adhesive layer and the wiring layer and filled with a conductive resin connected with the wiring layer, by means of the insulating adhesive layer, onto an uppermost layer of an assembly provided in the immediately preceding step and at the same time electrically connecting the wiring layer formed on the uppermost layer with the conductive resin of the stacking sheet,    wherein the step (f) is repeated N times (N being an integer not smaller than 1).    
   
   
       15 . The method of  claim 13 , wherein an amount of the thermosetting resin used in said step (b) of filling the space to planarize the surface of the filled cavity corresponds to the difference between a volume of the cavity and that of the electronic component, and the height difference between a surface of the thermosetting resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer in the immediate vicinity of the ceramic multilayer substrate.  
   
   
       16 . The method of  claim 13 , wherein the step (b) of filling the space to planarize the surface of the filled cavity is carried out by first filling the cavity with the thermosetting resin by using an amount exceeding the difference between a volume of the cavity and that of the electronic component, thermally curing the filled thermosetting resin, and then polishing a surface of the cured thermosetting resin and wherein the height difference between a surface of the polished resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer directly abutting the ceramic multilayer substrate.  
   
   
       17 . The method of  claim 13 , wherein the electronic component includes a semiconductor integrated circuit device.  
   
   
       18 . A method of fabricating a circuit module, comprising the steps of: 
 (a) mounting at least one electronic component in a cavity provided in a ceramic multilayer substrate;    (b) filling a space between the electronic component and the cavity with a thermosetting resin to planarize a surface of the filled cavity;    (c) patterning a metal layer of a sheet to form a wiring layer and simultaneously providing at least one opening in the wiring layer, the sheet having an insulating adhesive layer and the metal layer stacked on each other;    (d) bonding the sheet and the ceramic multilayer substrate by means of the insulating adhesive layer;    (e) removing the insulating adhesive layer located under the opening in the wiring layer to provide an extended opening exposing therethrough a surface of a wiring layer formed on the ceramic multilayer substrate; and    (f) filling the extended opening with a conductive resin to electrically connect the wiring layer of the sheet with the wiring layer on the ceramic multilayer substrate.    
   
   
       19 . The method of  claim 18 , further comprising, after the step (f), the steps of: 
 (g) bonding a stacking sheet which has an insulating adhesive layer and a wiring layer, at least one opening being provided in the wiring layer, onto an uppermost layer of an assembly provided in the immediately preceding step by means of the insulating adhesive layer;    (h), in the stacking sheet, removing the insulating adhesive layer located under the opening in the wiring layer to provide an extended opening exposing therethrough a surface of the uppermost layer; and    (i) filling the extended opening in the stacking sheet with a conductive resin and electrically connecting the wiring layer of the stacking sheet with a wiring layer of the uppermost layer,    wherein the steps (g) to (i) are repeated N times (N being an integer not smaller than 1)    
   
   
       20 . The method of  claim 18 , wherein an amount of the thermosetting resin used in said step (b) of filling the space to planarize the surface of the filled cavity corresponds to the difference between a volume of the cavity and that of the electronic component, and the height difference between a surface of the thermosetting resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer in the immediate vicinity of the ceramic multilayer substrate.  
   
   
       21 . The method of  claim 18 , wherein the step (b) of filling the space to planarize the surface of the filled cavity is carried out by first filling the cavity with the thermosetting resin by using an amount exceeding the difference between a volume of the cavity and that of the electronic component, thermally curing the filled thermosetting resin, and then polishing a surface of the cured thermosetting resin and wherein the height difference between a surface of the polished resin and that of the ceramic multilayer substrate around the cavity is less than a thickness of the insulating adhesive layer directly abutting the ceramic multilayer substrate.  
   
   
       22 . The method of  claim 18 , wherein the electronic component includes a semiconductor integrated circuit device.