US2005016100A1PendingUtilityA1

Floor covering for covering removable floor plates, floor structure with floor covering and method for producing the floor covering

Assignee: WEISS AUSBAUSYSTEME GMBHPriority: Jul 21, 2003Filed: Jul 21, 2003Published: Jan 27, 2005
Est. expiryJul 21, 2023(expired)· nominal 20-yr term from priority
Inventors:Dieter Weiss
E04F 15/024E04F 15/0215E04F 15/02405
46
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Claims

Abstract

A ready-to-lay floor covering having a fixing adhesive uniformly applied on an underside is optionally protected by a backing film.

Claims

exact text as granted — not AI-modified
1 . A floor covering, comprising: 
 a non-conductive fixing adhesive uniformly applied on an underside of said floor covering;    wherein said non-conductive fixing adhesive has been air-cured to obtain a ready-to-lay floor covering.    
   
   
       2 . The floor covering according to  claim 1 , wherein an acrylate dispersion is used as said non-conductive fixing adhesive.  
   
   
       3 . The floor covering according to  claim 1 , which is in the form of a floor-covering roll.  
   
   
       4 . The floor covering according to  claim 1 , which is in the form of floor-covering tiles.  
   
   
       5 . The floor covering according to  claim 1 , wherein said non-conductive fixing adhesive is protected by a backing film.  
   
   
       6 . The floor covering according to  claim 1 , wherein said non-conductive fixing adhesive comprises an organic or inorganic filler.  
   
   
       7 . The floor covering according to  claim 1 , wherein said non-conductive fixing adhesive comprises chalk.  
   
   
       8 . The floor covering according to  claim 1 , which is selected from the group consisting of PVC, linoleum, a tufted tile and velour.  
   
   
       9 . A floor construction, comprising: 
 a floor covering according to  claim 1  laid on a layer of floor panels laid flush with one another.    
   
   
       10 . The floor construction according to  claim 9 , wherein said floor covering overlaps butt joints between said floor panels.  
   
   
       11 . The floor construction according to  claim 9 , wherein said floor covering is in the form of floor-covering tiles; and 
 wherein said the floor covering tiles have a size different from that of said floor panels.    
   
   
       12 . The floor construction according to  claim 9 , wherein an adhesion of said non-conductive fixing adhesive to said floor covering is stronger than the adhesion to said floor panels.  
   
   
       13 . The floor construction according to  claim 9 , wherein said floor panels are finished with a smooth surface on an upper side.  
   
   
       14 . The floor construction according to  claim 9 , wherein said floor panels are finished with a smooth coating on an upper side.  
   
   
       15 . The floor construction according to  claim 9 , wherein said floor panels are finished with an impregnation on an upper side.  
   
   
       16 . A method for production of a floor covering, comprising: 
 applying a non-conductive fixing adhesive onto a floor covering, to obtain a floor covering having said non-conductive fixing adhesive on at least one side;    air-curing said floor covering having said non-conductive fixing adhesive, to obtain an air-cured floor covering;    wherein an air-curing time is chosen such that a cohesion of said at least one side of said air-cured floor covering having said non-conductive fixing adhesive is stronger than a force of adhesion to a backing film subsequently applied.    
   
   
       17 . The method according to  claim 16 , wherein said backing film can be peeled off without residue.  
   
   
       18 . The method according to  claim 16 , further comprising: 
 rolling up said floor covering and packaging as floor-covering rolls.    
   
   
       19 . The method according to  claim 16 , further comprising: 
 punching floor-covering tiles out of the floor covering.    
   
   
       20 . A floor covering produced according to the method of  claim 16 .  
   
   
       21 . A raised floor, a wooden floor or a bare floor, covered with a floor covering comprising: 
 a conductive or a non-conductive fixing adhesive uniformly applied on an underside of said floor covering;    wherein said conductive or non-conductive fixing adhesive has been air-cured to obtain a ready-to-lay floor covering.    
   
   
       22 . The raised floor, wooden floor or bare floor according to  claim 21 , wherein said floor covering is selected from the group consisting of PVC, linoleum, tufted tiles, velour and combinations thereof.  
   
   
       23 . The raised floor, wooden floor or bare floor according to  claim 21 , wherein an acrylate dispersion is used as said conductive or non-conductive fixing adhesive.  
   
   
       24 . The raised floor, wooden floor or bare floor according to  claim 21 , wherein said floor covering is in the form of floor-covering tiles.  
   
   
       25 . The raised floor, wooden floor or bare floor according to  claim 21 , wherein said conductive or non-conductive fixing adhesive comprises an organic or inorganic filler.  
   
   
       26 . The raised floor, wooden floor or bare floor according to  claim 21 , wherein said non-conductive fixing adhesive comprises chalk.  
   
   
       27 . A method for application of a fixing adhesive to a floor covering, comprising: 
 applying a first latex treatment on a back side of said floor covering, to obtain a first latex layer;    drying said first latex layer, to obtain a dried first latex layer;    applying a fixing adhesive;    drying said fixing adhesive, to obtain a dried fixing adhesive, with the proviso that said dried fixing adhesive remains elastic and tacky;    optionally attaching a protective backing film to said dried fixing adhesive.    
   
   
       28 . The method according to  claim 27 , wherein said floor covering is a velour covering.  
   
   
       29 . The method according to  claim 28 , further comprising trimming said velour covering to size and rolling up said velour covering.  
   
   
       30 . The method according to  claim 27 , wherein said fixing adhesive is a pressure-sensitive adhesive.  
   
   
       31 . The method according to  claim 27 , wherein said floor covering is a tufted tile covering.  
   
   
       32 . The method according to  claim 31 , further comprising applying an intermediate coating may be applied to said tufted tile covering before applying said fixing adhesive.  
   
   
       33 . The method according to  claim 27 , wherein said fixing adhesive is applied in more than one coating.  
   
   
       34 . The method according to  claim 27 , wherein said fixing adhesive is a conductive or a non-conductive fixing adhesive.  
   
   
       35 . A method for application of a fixing adhesive to a floor covering, comprising: 
 applying a fixing adhesive;    drying said fixing adhesive, to obtain a dried fixing adhesive, with the proviso that said dried fixing adhesive remains elastic and tacky;    optionally attaching a protective backing film to said dried fixing adhesive.    
   
   
       36 . The method according to  claim 35 , wherein said fixing adhesive is a pressure-sensitive adhesive.  
   
   
       37 . The method according to  claim 35 , wherein said fixing adhesive is applied in more than one coating.  
   
   
       38 . The method according to  claim 35 , wherein said fixing adhesive is a conductive or a non-conductive fixing adhesive.  
   
   
       39 . The method according to  claim 35 , wherein said floor covering is a PVC covering.  
   
   
       40 . The method according to  claim 35 , wherein said floor covering is a linoleum covering.  
   
   
       41 . The method according to  claim 40 , wherein said linoleum does not comprise a jute fabric.

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