Printed wiring board and electronic apparatus

Abstract

A printed wiring board is provided in which lift-off and land peeling do not occur during soldering of an inserted component onto the printed wiring board, and hence pattern breakage does not occur, but with no increase in cost. A plurality of lands 6 are each formed continuously across surfaces of a substrate and an inner peripheral surface of one of a plurality of soldering through holes 5 into which leads 2 of an inserted component 3 to be mounted onto the printed wiring board are inserted before soldering is carried out, and a solder resist 8 is coated onto the lands 6.

1 - 11 . (Cancelled).  
   
   
       12 . A printed wiring board comprising: 
 a substrate having two opposite surfaces and a plurality of soldering through holes formed in said substrate, each of said plurality of soldering through holes opening in said opposite surfaces for inserting leads of an inserted component to be mounted onto the printed wiring board and for soldering said leads of an inserted component onto said substrate,    wherein each of said plurality of soldering through holes has a conductive inner peripheral surface and a pair of conductive lands, each land of said pair of conductive lands being formed on respective ones of said opposite surfaces,    wherein at least one land of said pair of conductive lands is connected to at least one wiring pattern at a connection portion,    wherein said connection portion is maintained in a state not wetted by solder, and    wherein said at least one land of said pair of conductive lands is maintained in a state wetted by solder.