US2005013723A1PendingUtilityA1
Formation of metallic thermal barrier alloys
Priority: Feb 11, 2003Filed: Feb 11, 2004Published: Jan 20, 2005
Est. expiryFeb 11, 2023(expired)· nominal 20-yr term from priority
Inventors:Daniel James Branagan
C22C 33/0278B22F 9/082B22F 2009/088Y10T428/31678
51
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Claims
Abstract
Metal alloys having low electrical and thermal conductivity including relatively large fractions of P-Group element additions. The P-Group elements may be selected from the group including phosphorous, carbon, boron, and silicon. The resultant alloys do not exhibit significantly increased brittleness, and are applied as a coating that provides a metallic thermal barrier coating.
Claims
exact text as granted — not AI-modified1 . A metal alloy comprising an alloy metal and greater than about 4 atomic % of at least one P-group alloying element.
2 . A metal alloy of claim 1 wherein the P-group alloying element is present at a level of 4 atomic % to 50 atomic %.
3 . The metal alloy of claim 1 wherein said P-group alloying element is selected from the group consisting of carbon, nitrogen, phosphorous, silicon, boron, and mixtures thereof.
4 . A metal alloy according to claim 1 , wherein said at least one P-group alloying element comprises 16.0 atomic % B, 4.0 atomic % C, and 5.0 atomic % Si.
5 . A metal alloy according to claim 1 wherein the alloy metal is selected from the group consisting of iron, chrome, molybdenum, tungsten, manganese, cobalt, nickel, copper, and mixtures thereof.
6 . A method for reducing the thermal and/or electrical conductivity of a metal alloy composition comprising:
(a) supplying a metal alloy composition; and (b) supplying a P-group alloying element; (c) mixing said metal alloy composition and said P-group alloying element wherein said P-group alloying element is present at a level to reduce the thermal/and or electrical conductivity of said metal alloy composition.
7 . A method of reducing the thermal and/or electrical conductivity of a metal alloy composition comprising:
(a) supplying a base metal with a free electron density (b) supplying a P-group alloying element (c) combining said P-group alloying element with said base metal and decreasing the free electron density of the base metal.
8 . The method of claim 7 wherein the free electron density of the base metal is reduced from its base metal value, and wherein said free electron density is generally representative of a fully filled outer shell after combination with said P-group alloying element.
9 . The method of claim 7 wherein said P-group alloying element is selected from the group consisting of carbon, nitrogen, phosphorous, silicon, boron, and mixtures thereof.
10 . The method of claim 7 wherein the base metal is selected from the group consisting of iron, nickel, cobalt, aluminum, copper, zinc. titanium, zirconium, niobium, molybdenum, tantalum, vanadium, hafnium, tungsten, manganese, and combinations thereof.Join the waitlist — get patent alerts
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