US2005013328A1PendingUtilityA1

Laser radiation source

Priority: Sep 8, 1998Filed: Jul 30, 2004Published: Jan 20, 2005
Est. expirySep 8, 2018(expired)· nominal 20-yr term from priority
B23K 26/0622B23K 26/40B23K 26/382B23K 26/0604B23K 26/0648B23K 26/0861B23K 26/0613B23K 26/0608B23K 26/082B23K 26/142B23K 26/0884B23K 26/0652B23K 26/0665B23K 26/067B41C 1/05B23K 26/389B23K 26/0643B23K 2103/50B23K 26/0676B23K 26/064B23K 26/1462B23K 2101/40
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Claims

Abstract

In a method and system for processing a processing surface of a material, a mounting receives the material with the processing surface. At least one fiber laser comprising a pump source and a laser fiber has an infeed end, an outfeed end, and a core surrounded by a pump core, the pump source being positioned at the infeed end, and the laser fiber outputting a continuous wave laser beam at the outfeed end. At least one of the laser beam and the processing surface are laterally movable with respect to each other. A focusing optics is provided through which the laser beam passes. The laser beam output from the laser fiber is diffraction-limited to permit the focusing optics to focus the laser beam onto the processing surface as a spot having a spot size sufficiently small to create a fine structure by processing material at the processing surface.

Claims

exact text as granted — not AI-modified
1 - 263 . (cancelled).  
   
   
       264 . A material processing system for processing a processing surface of a material, comprising: 
 a mounting which receives said material with the processing surface;    at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    said laser fiber outfeed end being spaced from said surface, and at least one of said laser beam and said processing surface being laterally movable with respect to each other;    focusing optics through which said laser beam passes; and    the laser beam output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by removing material at said processing surface.    
   
   
       265 . A system according to  claim 264  wherein said focusing optics comprises a lens on a terminator connected to said laser fiber outfeed end.  
   
   
       266 . A system according to  claim 264  wherein said focusing optics comprises a laser gun having a lens.  
   
   
       267 . A system according to  claim 266  wherein said laser gun has a modulator which controls the laser beam.  
   
   
       268 . A system according to  claim 264  wherein the spot size is equal to or less than approximately 10 micrometers in diameter.  
   
   
       269 . A system according to  claim 264  wherein the spot size is equal to or less than approximately 20 micrometers in diameter.  
   
   
       270 . A system according to  claim 264  wherein the laser beam at the spot has a power of at least approximately 100 watts at full beam intensity.  
   
   
       271 . A system according to  claim 264  wherein the laser beam at said spot has a power density of at least approximately 10 7 W/cm 2  at full beam intensity.  
   
   
       272 . A system according to  claim 264  wherein said pump source comprises at least one laser diode.  
   
   
       273 . A system according to  claim 266  wherein: 
 a housing is provided having said mounting for the processing surface;    the pump source and an end of the laser fiber opposite the outfeed end are mounted in a fixed position with respect to said housing;    the laser gun is mounted for lateral movement parallel to said processing surface; and    said laser gun having at an output end adjacent said processing surface said lens and at an input end said modulator, said laser fiber outfeed end being connected to said input end of said laser gun and moveable as said laser gun moves.    
   
   
       274 . A system according to  claim 273  wherein one of said laser fiber outfeed end and an outfeed end of a passive fiber connected to said laser fiber are at said input end of said laser gun.  
   
   
       275 . A system according to  claim 264  wherein a reflection surface is positioned to deflect the laser beam when it is intended that it not strike said processing surface.  
   
   
       276 . A system according to  claim 264  wherein a sump is positioned to receive the laser beam when it is intended that it not strike said processing surface.  
   
   
       277 . A system of  claim 276  wherein a reflection surface is positioned to deflect said laser beam to said sump when it is intended that the laser beam should not strike said processing surface.  
   
   
       278 . A system according to  claim 277  wherein said reflection surface and sump are positioned on a laser gun after the outfeed end of the laser fiber.  
   
   
       279 . A system according to  claim 267  wherein a diffraction optics is provided between said lens and an output of said modulator.  
   
   
       280 . A system of  claim 264  wherein a modulator is located to modulate said laser beam from said outfeed end.  
   
   
       281 . A system according to  claim 264  wherein said pump source comprises a plurality of laser diodes having light outputs directed to said laser fiber.  
   
   
       282 . A system according to  claim 264  wherein said laser fiber comprises two surfaces positioned to reflect laser light in said laser fiber.  
   
   
       283 . A system according to  claim 264  wherein at least one of said laser fiber and a passive fiber connected to said laser fiber has a length which is significantly greater than a distance between said pump source and an input end of a laser gun.  
   
   
       284 . A system according to  claim 264  wherein said laser fiber is flexibly arranged in a pattern with bends to take up an excess length of said laser fiber between a laser gun and said pump source.  
   
   
       285 . A system according to  claim 273  wherein said housing has a controller, and wherein at a top side of said housing said flat processing surface is positioned along with said laterally moveable laser gun.  
   
   
       286 . A system according to  claim 264  wherein said laser fiber comprises an outfeed reflection surface and another reflection surface spaced from said outfeed reflection surface.  
   
   
       287 . A system according to  claim 267  wherein at one of said outfeed end of said laser fiber and an outfeed end of a passive fiber a terminator is connected with an optics adjacent an input of said modulator which converts the laser beam exiting the laser fiber with diverging rays to parallel rays which enter at the input of the modulator.  
   
   
       288 . A system according to  claim 264  wherein a terminator having an optics is adjustably attached to said laser fiber at said outfeed end to set a distance between an end of said core of said laser fiber and said terminator optics.  
   
   
       289 . A system according to  claim 267  wherein said modulator comprises an acousto-optical modulator which receives a control signal having a frequency which controls a deflection angle of the laser beam output from said modulator.  
   
   
       290 . A system according to  claim 267  wherein said modulator comprises an acousto-optical modulator and an amplitude of a control signal fed to said modulator controls an amplitude of the laser beam exiting from the modulator.  
   
   
       291 . A system according to  claim 275  wherein said reflection surface is positioned after an output of a modulator and is angled so as to direct said laser beam deflected by the reflection surface to a sump, said sump being attached to a laser gun radially outwardly from a longitudinal axis of said laser gun.  
   
   
       292 . A system according to  claim 275  wherein said reflection surface is positioned on a laser gun with respect to a longitudinal axis of said laser gun between an output of a modulator and a diffraction optics in said laser gun.  
   
   
       293 . A system according to  claim 267  wherein said modulator comprises an acousto-optical modulator on said laser gun and is positioned such that a control signal fed to said modulator controls an output angle of said laser beam from said modulator by a frequency of said control signal to selectively strike said processing surface through the lens.  
   
   
       294 . A system according to  claim 267  wherein said modulator comprises an acousto-optical modulator positioned in said laser gun such that given no control signal fed to said modulator the output laser beam from the modulator hits a reflection surface and given presence of the control signal with a prescribed frequency said laser beam output from said modulator passes through said focusing lens and hits said processing surface.  
   
   
       295 . A system according to  claim 279  wherein said diffraction optics is mounted in said laser gun, and, relative to a traveling direction of the laser beam, said diffraction optics causes a laser beam output from said modulator to diverge prior to passing through said lens.  
   
   
       296 . A system according to  claim 264  wherein said focusing optics comprises at least one lens and focuses the laser beam onto said processing surface to form a laser spot at said processing surface having a diameter equal to or less than approximately 10 um.  
   
   
       297 . A system according to  claim 264  wherein said material processing surface comprises a semiconductor.  
   
   
       298 . A system according to  claim 297  wherein said semiconductor comprises a wafer.  
   
   
       299 . A system according to  claim 264  wherein said laser beam is oriented so that the laser beam strikes said processing surface at an angle which is less than 90° relative to a perpendicular of said processing surface.  
   
   
       300 . A system according to  claim 264  wherein said laser fiber converts a relatively large diameter of a pump spot at said infeed end to a relatively much smaller diameter of the output laser beam from said core at said outfeed end of said laser fiber.  
   
   
       301 . A system according to  claim 264  wherein said laser fiber at said outfeed end connects to a passive fiber.  
   
   
       302 . A system according to  claim 264  wherein said laser fiber at said outfeed end connects to a terminator, said terminator having an open portion a lens.  
   
   
       303 . A system according to  claim 266  wherein a plurality of laser fibers are provided between said pump source and said laser gun, and a coupler which combines outfeed ends of said plurality of laser fibers being connected to said laser gun.  
   
   
       304 . A system according to  claim 264  wherein a plurality of fiber lasers are provided.  
   
   
       305 . A system according to  claim 266  wherein said laser fiber connects to a coupler having at its output end a plurality of passive fibers, output ends of said passive fibers being connected to said laser gun.  
   
   
       306 . A system according to  claim 267  wherein said modulator comprises an electro-optical modulator which changes a polarization direction of a laser beam passing therethrough, and wherein a polarization direction sensitive element follows said electro-optical modulator so that depending upon a polarization direction, the element either transmits a laser beam which is communicated to said lens and then to said processing surface, or deflects the laser beam.  
   
   
       307 . A system according to  claim 266  wherein a plurality of said laser fibers are provided connected to said laser gun for outputting onto said processing surface a plurality of said laser beams.  
   
   
       308 . A system according to  claim 307  wherein said plurality of laser beams are focused to a common spot.  
   
   
       309 . A system according to  claim 307  wherein said plurality of laser beams are arranged to provide spots along a line next to one another on said processing surface.  
   
   
       310 . A laser system according to  claim 266  wherein a plurality of said laser guns are provided spaced from each other adjacent to said processing surface and in a direction along and parallel to said processing surface, each laser gun being fed by at least one laser fiber.  
   
   
       311 . A system according to  claim 266  wherein in said laser gun between said focusing optics and said processing surface a base member having an inner cavity is provided with a transparent plate through which said laser beam passes on its way to said processing surface through said cavity, and after said transparent plate at least one extraction channel which extracts unwanted eroded material from said cavity.  
   
   
       312 . A system according to  claim 273  wherein the housing has at an upper side said mount and said movable laser gun positioned adjacent thereto, and wherein a lower portion of said housing has a controller, modulation signal unit, and a cooling system, the cooling system being connected to cool said pump source, and wherein said laser fiber extends between said pump source fixedly mounted in said lower portion of said housing up to said laser gun at said upper portion of said housing.  
   
   
       313 . A system according to  claim 264  wherein said laser beam striking said processing surface creates said fine structure as at least one of the laser beam and the processing surface move laterally with respect to each other.  
   
   
       314 . A system according to  claim 264  wherein said laser beam striking the processing surface is amplitude modulated to cause a changing intensity of said laser light beam for causing different amounts of said material to be eroded depending on an intensity of said laser light beam.  
   
   
       315 . A system according to  claim 264  wherein a penetration depth of said fine structure changes dependent upon an intensity of said laser light beam.  
   
   
       316 . A system according to  claim 264  wherein said fine structure comprises holes.  
   
   
       317 . The system according to  claim 264  wherein an intensity of said laser beam is controlled by a modulator in accordance with at least an 8-bit signal fed to said modulator.  
   
   
       318 . A system according  claim 264  wherein said structure comprises eroded material forming a line in the processing surface.  
   
   
       319 . A system according to  claim 264  wherein said material is used for creating a printed circuit board.  
   
   
       320 . A system according to  claim 264  wherein a modulation control of said laser beam allows adjusting a depth of said fine structure within a fraction of a micrometer.  
   
   
       321 . A system according to  claim 264  wherein the processing of the material comprises individual circuits cut from a semiconductor wafer.  
   
   
       322 . A system according to  claim 267  wherein the modulator is located on the laser gun and an optics is provided such that parallel rays of the laser beam leaving the modulator diverge and when the laser beam passes through the focusing optics rays of the laser beam converge.  
   
   
       323 . A system according to  claim 264  wherein the fine structure comprises eroded holes.  
   
   
       324 . A system according to  claim 264  wherein the laser beam erodes the processing surface as the mount moves the processing surface.  
   
   
       325 . A system according to  claim 264  wherein at least one of the outfeed end of the laser fiber and an outfeed end of a passive fiber connected to said laser fiber is moved during the structuring.  
   
   
       326 . A system according to  claim 264  wherein the processing surface comprises at least one of metal, ceramic, glass, semiconductor, rubber, and plastic.  
   
   
       327 . A system according to  claim 264  wherein the laser beam impinging on the processing surface creates the structure such that a shape of the structure is created independently of a size of the structure at the processing surface.  
   
   
       328 . A system according to  claim 264  wherein the laser beam impinging on the processing surface creates an area of the structure at the processing surface which is independent of its depth.  
   
   
       329 . A system according to  claim 264  wherein the laser fiber has an absorption efficiency of more than 60%.  
   
   
       330 . A system according to  claim 264  wherein the laser fiber core has a diameter which creates a laser radiation beam at its outfeed end having a diameter of approximately 10 μm or less.  
   
   
       331 . A system according to  claim 264  wherein said processing surface is substantially flat, and said mount moves the processing surface in at least two dimensions.  
   
   
       332 . A system according to  claim 273  wherein one of the laser fiber outfeed end and an outfeed end of a passive fiber connected to said laser fiber is directly connected at the input end of the movable laser gun and proceeds in a pattern with bends back to the pump source at a fixed location on the housing.  
   
   
       333 . A system according to  claim 264  wherein said material comprises at least a layer of a printed circuit board and the material at the processing surface is eroded to form at least one of bores and patterns of interconnects for the printed circuit board.  
   
   
       334 . A system according to  claim 264  wherein the laser beam at said spot has a power density of at least approximately 10 7  W/cm 2 .  
   
   
       335 . A system according to  claim 264  wherein the processing surface comprises a semiconductor wafer which is at least one of excised and cut to provide differing fine patterns on the surface.  
   
   
       336 . A system according to  claim 264  wherein the processing surface comprises a display screen structured by the laser beam.  
   
   
       337 . A system according to  claim 265  wherein said terminator comprises a body with an aperture receiving one of said outfeed end of said laser fiber and an outfeed end of a passive fiber connected to said laser fiber, the lens being provided at an end of said body, and said body being adjustable and positioned to adjust a spacing of said lens from one of said outfeed end of said laser fiber and said passive fiber outfeed end.  
   
   
       338 . A system according to  claim 264  wherein a plurality of fiber lasers are provided and wherein at least one of the outfeed end of said laser fiber and an outfeed end of a passive fiber connected to said laser fiber of each laser being arranged along a line and at a substantially same distance from said processing surface.  
   
   
       339 . A system according to  claim 338  wherein each of the laser fiber outfeed ends has a respective terminator with a lens thereon connected to the laser fiber.  
   
   
       340 . A system according to  claim 338  wherein said material comprises a semiconductor which is cut by each of the laser beams from the respective fiber lasers.  
   
   
       341 . A system according to  claim 264  wherein a plurality of fiber lasers are provided and respective outfeed ends thereof are commonly connected to a carrier.  
   
   
       342 . A system according to  claim 341  wherein the carrier is rotatable so that a spacing between the laser beams can be changed on the processing surface by rotating the carrier.  
   
   
       343 . A system according to  claim 341  wherein the carrier has a guide, each of at least one of the outfeed ends of the fiber lasers and outfeed ends of passive fibers connected to said laser fibers being mounted adjustably to the guide so that a spacing between the laser beams can be adjusted.  
   
   
       344 . A system according to  claim 341  wherein each of the laser fiber outfeed ends has a connected terminator and the terminator is mounted by a mounting element in adjustable fashion to the carrier.  
   
   
       345 . A system according to  claim 341  wherein the carrier is connected to a laser carrier guiding machine which allows movement of the carrier towards and away from the processing surface and also movement of the carrier in a direction parallel to the processing surface.  
   
   
       346 . A system according to  claim 345  wherein said carrier is rotatable by said machine about a vertical axis perpendicular to said processing surface.  
   
   
       347 . A system according to  claim 264  wherein the processing surface is substantially flat and the mounting comprises a table on which the material with the processing surface is positioned.  
   
   
       348 . A system according to  claim 264  wherein the mounting is moveable in at least one dimension.  
   
   
       349 . A system according to  claim 264  wherein the mounting is movable in at least two dimensions.  
   
   
       350 . A system according to  claim 264  wherein the mounting is movable in at least three dimensions.  
   
   
       351 . A system according to  claim 264  wherein the laser fiber outfeed end is stationary, the processing surface is stationary, and at least one optical element is employed which causes movement of the laser beam across the processing surface in at least one dimension.  
   
   
       352 . A system according to  claim 351  wherein the movement is in at least two dimensions.  
   
   
       353 . A system according to  claim 264  wherein the mounting is movable in at least in one dimension with the laser fiber outfeed end being stationary and at least one optical element is provided which moves the laser beam in at least one different dimension relative to the processing surface.  
   
   
       354 . A system according to  claim 264  wherein optical elements comprising a rotating mirror, a deflection mirror, and an optics are utilized to move the laser beam relative to the processing surface while the laser fiber outfeed end remains stationary.  
   
   
       355 . A system according to  claim 264  wherein a chamber is provided adjacent the processing surface through which the laser beam passes and which collects eroded material.  
   
   
       356 . A system according to  claim 355  wherein the chamber comprises a suction outlet.  
   
   
       357 . A system according to  claim 355  wherein the chamber comprises a gas inlet which, combined with a gas outlet, removes eroded material during the fine structuring.  
   
   
       358 . A system according to  claim 355  wherein said chamber comprises a glass plate closing off an end of the chamber and through which said laser beam passes.  
   
   
       359 . A system according to  claim 264  wherein the material with the processing surface comprises a pattern of photo-voltaic cells and a plurality of fiber lasers with respective laser beams are employed for the processing.  
   
   
       360 . A material processing system for processing a processing surface of a material, comprising: 
 a mounting which receives said material with the processing surface;    at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    at least one of said laser beam and said processing surface being movable with respect to each other;    focusing optics through which said laser beam passes; and    the laser beam output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by removing material at said processing surface.    
   
   
       361 . A material processing system for processing a processing surface of a material, comprising: 
 a mounting which receives said material with the processing surface;    at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    said laser fiber outfeed end having a connected terminator with a lens, and the terminator being connected to a laser gun, said laser gun having an optics through which said laser beam directed through said terminator lens passes on its way to said processing surface, and wherein said terminator lens and said laser gun optics comprise a focusing optics;    at least one of said laser gun and said processing surface being movable with respect to each other;    the laser beam output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by removing material at said processing surface.    
   
   
       362 . A material processing system for processing a substantially flat processing surface of a material, comprising: 
 a mounting which receives said material with the substantially flat processing surface, said material comprising at least one of a metal, a semiconductor, ceramic, plastic, and a rubber;    at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    said laser fiber outfeed end being spaced from said flat surface, and at least one of said laser beam and said substantially flat processing surface being laterally movable with respect to each other;    focusing optics through which said laser beam passes; and    the laser beam output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by processing material at said material processing surface.    
   
   
       363 . A system according to  claim 362  wherein said fine structure comprises cuts in a semiconductor material to divide up said semiconductor material into pieces.  
   
   
       364 . A system according to  claim 362  wherein said fine structure comprises holes in a semiconductor material.  
   
   
       365 . A system according to  claim 362  wherein said fine structure comprises eroded lines in said processing surface.  
   
   
       366 . A method for processing a processing surface of a material, comprising the steps of: 
 providing a mounting to receive said material with the processing surface;    providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    providing a focusing optics through which said laser beam passes;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by removing material at said processing surface;    providing said laser fiber outfeed end at a spacing from said processing surface; and    moving at least one of said laser beam and said processing surface with respect to each other and creating said fine structure by removing material at said processing surface.    
   
   
       367 . A method according to  claim 366  wherein the moving occurs during said removing of the material when creating at least a portion of said fine structure.  
   
   
       368 . A method according to  claim 366  wherein the fine structure comprises making holes in the processing surface.  
   
   
       369 . A method according to  claim 366  wherein said fine structure comprises cutting off pieces of said material at said processing surface.  
   
   
       370 . A method according to  claim 366  wherein said fine structure comprises eroding lines into said processing surface.  
   
   
       371 . A method according to  claim 366  wherein the spot size is equal to or less than approximately 20 micrometers diameter.  
   
   
       372 . A method according to  claim 366  wherein the spot size is equal to or less than approximately 10 micrometers diameter.  
   
   
       373 . A method according to  claim 366  wherein the laser beam at the spot has a power of at least approximately 100 watts at full beam intensity.  
   
   
       374 . A method according to  claim 366  wherein the laser beam at said spot has a power density of at least approximately  10   7  W/cm 2  at full beam intensity.  
   
   
       375 . A method according to  claim 366  wherein said pump source comprises at least one laser diode.  
   
   
       376 . A method according to  claim 366  including the steps of: 
 providing a housing for said processing surface mounting;    mounting the pump source and an end of said laser fiber opposite said outfeed end in a fixed position with respect to said housing;    connecting the laser outfeed end to a laser gun positioned adjacent said processing surface; and    providing said laser gun at an output end adjacent said drum with a lens, and at an input end with a modulator, and providing at least one of said laser fiber outfeed end connected to said input end of said laser gun and an outfeed end of a passive fiber connected to said laser fiber and connected to said laser gun so that as the laser gun moves at least one of the laser fiber outfeed end and passive fiber outfeed end also moves.    
   
   
       377 . A method according to  claim 376  wherein one of said laser fiber outfeed end and passive fiber outfeed end is secured at said input end of said laser gun and moves along with said laser gun during the processing.  
   
   
       378 . A method according to  claim 376  wherein a reflection surface is positioned in said laser gun after an output of said modulator, a sump is positioned on said laser gun, and as said material is being processed, a laser beam from said modulator is deflected by said reflection surface to said sump.  
   
   
       379 . A method according to  claim 366  including providing a lens in front of a modulator through which said laser beam passes so that parallel rays from said modulator diverge prior to the laser beam entering the focusing optics.  
   
   
       380 . A method according to  claim 366  including providing a plurality of laser diodes having outputs directed to said laser fiber.  
   
   
       381 . A method of  claim 366  including the step of providing at least one of said laser fiber and a passive fiber connected to said laser fiber with a length sufficiently greater than a distance between said pump source and an input end of a laser gun.  
   
   
       382 . A method according to  claim 366  wherein after said outfeed end of said laser fiber a lens is provided so that the laser beam entering an input to a modulator has parallel rays.  
   
   
       383 . A method according to  claim 366  including the step of connecting said laser fiber at said outfeed end to a passive fiber.  
   
   
       384 . A method according to  claim 366  wherein a modulator is provided which comprises an acousto-optical modulator mounted in a laser gun and providing a control signal having a frequency which controls a deflection angle of the laser beam output from said modulator.  
   
   
       385 . A method according to  claim 366  wherein an amplitude of a control signal fed to a modulator controls an amplitude of the laser beam exiting from the modulator.  
   
   
       386 . A method according to  claim 366  wherein a modulator is provided which comprises an acousto-optical modulator and a control signal fed to said modulator controls by its frequency an output angle of said laser beam from said modulator to selectively strike said processing surface through said focusing optics.  
   
   
       387 . A method according to  claim 366  wherein a modulator is provided through which said laser beam passes.  
   
   
       388 . A method according to  claim 366  wherein said processing surface comprises a semiconductor.  
   
   
       389 . A method according to  claim 366  including the step of having said laser beam strike said processing surface at an angle which is less than 90 degrees relative to a perpendicular to a said processing surface.  
   
   
       390 . A method according to  claim 366  including the step of providing a plurality of fiber lasers.  
   
   
       391 . A method according to  claim 366  wherein an optics is provided so that diverging rays of the laser beam exiting the core of the laser fiber enter a modulator in parallel.  
   
   
       392 . A method according to  claim 366  wherein a modulator is provided which comprises an electro-optical modulator which changes a polarization direction of the laser beam passing there through, and wherein a polarization direction sensitive reflection surface follows said electro-optical modulator.  
   
   
       393 . A method according to  claim 366  wherein a laser gun connected to at least one of said fiber lasers outputs onto said processing surface a plurality of laser beams.  
   
   
       394 . A method according to  claim 393  wherein said plurality of laser beams are focused to a common spot.  
   
   
       395 . A method according to  claim 366  wherein a plurality of laser beams provide spots along a line next to one another on said processing surface.  
   
   
       396 . A method according to  claim 366  wherein a plurality of fiber lasers are provided spaced apart from each other adjacent to said processing surface.  
   
   
       397 . A method according to  claim 366  wherein said laser beam striking the processing surface is amplitude modulated to cause a changing intensity of said laser light beam for causing different amounts of said surface to be eroded depending on an intensity of said laser beam.  
   
   
       398 . A method according to  claim 366  including the step of providing a plurality of said fiber lasers each having a connected terminator at an end thereof, each terminator having a lens.  
   
   
       399 . A method according to  claim 398  wherein the terminators are positioned a same distance from said processing surface.  
   
   
       400 . A method according to  claim 366  including the step of connecting a terminator to the laser fiber.  
   
   
       401 . A method according to  claim 400  including the step of rotating the carrier to change a spacing between the laser beams from the respective terminators.  
   
   
       402 . A method according to  claim 366  including the step of providing a chamber which removes eroded material from the processing surface, said laser beam passing through said chamber.  
   
   
       403 . A method according to  claim 402  including the step of providing a vacuum in the chamber to remove the eroded material.  
   
   
       404 . A method according to  claim 366  wherein the mounting is moved in at least two dimensions.  
   
   
       405 . A method according to  claim 366  including the step of moving at least one of the outfeed end of the laser fiber and an outfeed end of a passive fiber connected to the laser fiber in at least one dimension.  
   
   
       406 . A method according to  claim 366  including the step of moving at least one of the outfeed end of the laser fiber and an outfeed end of a passive fiber connected to the laser fiber in at least two dimensions.  
   
   
       407 . A method according to  claim 366  including the step of providing at least one of the outfeed end of the laser fiber and an outfeed end of a passive fiber connected to the laser fiber in a fixed position and moving the laser beam with optical elements across said processing surface.  
   
   
       408 . A method according to  claim 407  including the step of moving the mounting in at least one dimension.  
   
   
       409 . A method for processing a processing surface of a material, comprising the steps of: 
 providing a mounting to receive said material with the processing surface;    providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    providing a focusing optics through which said laser beam passes;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said focusing optics to focus the laser beam onto said processing surface as a spot having a spot size sufficiently small to create a fine structure by removing material at said processing surface; and    moving at least one of said laser beam and said processing surface with respect to each other.    
   
   
       410 . A method for processing a substantially flat processing surface of a material, comprising the steps of: 
 providing a mounting to receive said material with the substantially flat processing surface, the material comprising at least one of a metal, a semiconductor, a ceramic, and a rubber;    providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    providing focusing optics;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said laser gun to focus the laser beam onto said processing surface with the focusing optics as a spot having a spot size equal to or less than 20 μm to create a fine structure by processing material at said processing surface;    providing said laser fiber outfeed end at a spacing from said processing surface; and    moving at least one of said laser beam and said processing surface laterally with respect to each other and creating said fine structure by processing material at said processing surface.    
   
   
       411 . A material processing system for processing a surface of a material, comprising: 
 at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a continuous wave laser beam at said outfeed end;    said laser fiber outfeed end being spaced from said surface, and at least one of said laser beam and said surface being movable with respect to each other;    focusing optics through which said laser beam passes; and    the laser output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said surface as a spot having a spot size sufficiently small to create a fine structure by processing material at said surface.    
   
   
       412 . A system according to  claim 411  wherein a modulator is provided after said outfeed end of said laser fiber to control said continuous wave laser beam.  
   
   
       413 . A system according to  claim 412  wherein said modulator changes an intensity of said laser beam.  
   
   
       414 . A system according to  claim 412  wherein said modulator controls whether or not the laser beam strikes said surface.  
   
   
       415 . A system according to  claim 411  wherein said surface comprises a printing form.  
   
   
       416 . A method for processing a surface of a material, comprising the steps of: 
 providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a continuous wave laser beam at said outfeed end;    providing a focusing optics through which said laser beam passes;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said focusing optics to focus the laser beam onto said surface as a spot having a spot size sufficiently small to create a fine structure by processing material at said surface;    providing said laser fiber outfeed end at a spacing from said surface; and    moving at least one of said laser beam and said surface with respect to each other.    
   
   
       417 . A method of  claim 416  including providing a modulator through which said laser beam from the outfeed end of said laser fiber passes.  
   
   
       418 . A method of  claim 417  wherein the modulator changes an intensity of the laser beam.  
   
   
       419 . A method of  claim 417  wherein the modulator determines whether or not the laser beam reaches the surface.  
   
   
       420 . A method according to  claim 416  wherein the surface comprises a printing form.  
   
   
       421 . A material processing system for processing a surface of a material, comprising: 
 at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a pulsed laser beam at said outfeed end;    said laser fiber outfeed end being spaced from said surface, and at least one of said laser beam and said surface being movable with respect to each other;    focusing optics through which said laser beam passes; and    the laser output from said laser fiber outfeed end being diffraction-limited to permit said focusing optics to focus the laser beam onto said surface as a spot having a spot size sufficiently small to create a fine structure by processing material at said surface.    
   
   
       422 . A system according to  claim 421  wherein a modulator is provided which internally modulates the pulsed laser beam.  
   
   
       423 . A system according to  claim 421  wherein a modulator externally modulates the pulsed laser beam.  
   
   
       424 . A system according to  claim 421  wherein an acousto-optical modulator within a laser resonator of the laser fiber modulates the pulsed laser beam.  
   
   
       425 . A system according to  claim 421  wherein said surface comprises a printing form.  
   
   
       426 . A system according to  claim 421  wherein said pulsed laser beam comprises a quality-switched laser beam.  
   
   
       427 . A method for processing a surface of a material, comprising the steps of: 
 providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a pulsed laser beam at said outfeed end;    providing a focusing optics through which said laser beam passes;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said focusing optics to focus the laser beam onto said surface as a spot having a spot size sufficiently small to create a fine structure by processing material at said surface;    providing said laser fiber outfeed end at a spacing from said surface; and    moving at least one of said laser beam and said surface with respect to each other.    
   
   
       428 . A method according to  claim 427  wherein a modulator is provided which internally modulates the pulsed laser beam.  
   
   
       429 . A method according to  claim 427  wherein a modulator externally modulates the pulsed laser beam.  
   
   
       430 . A method according to  claim 427  wherein an acousto-optical modulator within a laser resonator of the laser fiber modulates the pulsed laser beam.  
   
   
       431 . A method according to  claim 427  wherein said surface comprises a printing form.  
   
   
       432 . A method according to  claim 427  wherein said pulsed laser beam comprises a quality-switched laser beam.  
   
   
       433 . A material processing system for processing a surface of a material, comprising: 
 at least one fiber laser comprising a pump source and a laser fiber having an outfeed end and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    at least one of said laser beam and said surface being movable with respect to each other; and    the laser beam output from said laser fiber outfeed end being diffraction-limited to permit said laser beam impinging onto said surface as a spot to have a spot size sufficiently small to create a fine structure by processing material at said surface.    
   
   
       434 . A method for processing a surface of a material, comprising the steps of: 
 providing at least one fiber laser comprising a pump source and a laser fiber having an outfeed and a core surrounded by a pump core, said pump source being positioned at said laser fiber, and said laser fiber outputting a laser beam at said outfeed end;    providing the laser beam output from said laser fiber outfeed end as diffraction-limited to permit said laser beam impinging onto said surface to have a spot with a spot size sufficiently small to create a fine structure by processing material at said surface; and    moving at least one of said laser beam and said surface with respect to each other.    
   
   
       435 . A method of  claim 434  wherein said surface comprises at least a layer of a printed circuit board.  
   
   
       436 . A method of  claim 434  wherein at least two fiber lasers are provided outputting respective laser beams of at least one of different wavelengths and different polarization directions, and wherein the two laser beams are combined at said spot.

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