US2005012572A1PendingUtilityA1
Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same
Est. expiryJan 29, 2021(expired)· nominal 20-yr term from priority
H05K 3/107H05K 1/162H05K 2201/09036H05K 3/4092H01P 7/082H01P 1/20363H05K 1/0237H01P 3/088H05K 2201/037H01P 3/081H01P 11/003H05K 1/0242H01P 1/20381H05K 2201/09981H05K 2201/098
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Claims
Abstract
A microstrip line includes a strip conductor, a line electrode, and edge electrodes provided at the edges on both sides of the line electrode. The construction of the microstrip line greatly reduces the edge effect of the line electrode and decreases the conductor loss of the line electrode.
Claims
exact text as granted — not AI-modified1 - 44 . (canceled).
45 . A microstrip line, comprising:
a dielectric substrate having a front surface and a back surface; a ground electrode provided on the back surface of said dielectric substrate; and a line electrode provided on the front surface of the dielectric substrate; wherein edge electrodes are provided at edges on both sides of the line electrode, and said edge electrodes are arranged so as to be inclined to the front surface of the dielectric substrate.
46 . The microstrip line according to claim 45 , wherein a pair of reinforcing components made of a material having a small dielectric loss are provided on the front surface of the dielectric substrate to support the edge electrodes.
47 . The microstrip line according to claim 46 , wherein the reinforcing components are defined by insulating films made of a resin material.
48 . The microstrip line according to claim 46 , wherein the reinforcing components are made of a ceramic material.
49 . The microstrip line according to claim 46 , wherein a line groove is provided between the pair of reinforcing components, with the front surface of the dielectric substrate defining a bottom of the groove, said line groove includes sides that are inclined to the front surface of the dielectric substrate, the line electrode is provided at the bottom of the line groove, and the edge electrodes are linked along the entire length of the line electrode and the edges of the line electrode are located on the sides of the line groove.
50 . The microstrip line according to claim 46 , wherein the edge electrodes include a flat portion extending substantially parallel to the front surface of the dielectric substrate along the top of the reinforcing components.
51 . The microstrip line according to claim 46 , wherein a portion of the line electrode extends between the reinforcing components and the front surface of the dielectric substrate.
52 . The microstrip line according to claim 45 , wherein a flat electrode links upper ends of the edge electrodes.
53 . The microstrip line according to claim 52 , wherein a space surrounded by the line electrode, the flat electrode, and the edge electrodes is filled with a filler having a small dielectric loss tangent.
54 . The microstrip line according to claim 45 , wherein a reinforcing layer overlaps the front surface of the dielectric substrate and is made of a material with a small dielectric loss tangent, such that the reinforcing layer supports the edge electrodes.
55 . A microstrip line, comprising:
a dielectric substrate having a front surface and a back surface; and a ground electrode provided on the back surface of said dielectric substrate; wherein a pair of reinforcing components composed of a material with a small dielectric loss are arranged substantially parallel to each other, a line groove is provided between the pair of reinforcing components, with the front of the dielectric substrate defining a bottom of the groove, and said line groove being filled in with an electroconductive material to define a line electrode.
56 . A microstrip line, comprising:
a laminated substrate having a first lamination component defined by a plurality of dielectric layers, and a second lamination component defined by at least one dielectric layer; and a ground electrode provided on a back surface of the first lamination component of the laminated substrate; wherein the second lamination component includes a strip conductor mounted thereon and made of an electroconductive material that fills a line groove including a line formation hole in a dielectric sheet in which the second lamination component is provided.
57 . A resonator device, including the microstrip line according to claim 45 .
58 . A filter, including the resonator device according to claim 57 .
59 . A high frequency circuit, including the microstrip line according to claim 45 .
60 . An electronic circuit, comprising:
a transmission line; and a resonator device and a filter electrically linked to said transmission line; wherein the transmission line includes the microstrip line according to claim 45 .
61 . An electronic circuit, comprising:
a transmission line; and a resonator device and a filter electrically linked to said transmission line; wherein the transmission line and the resonator device include a microstrip line according to claim 45 .
62 . An electronic circuit, comprising:
a transmission line; and a resonator device and a filter electrically linked to said transmission line; wherein the transmission line and the filter include a microstrip line according to claim 45 .
63 . A circuit module, including the electronic circuit according to claim 60 on a dielectric substrate.
64 . A communication device, including the electronic circuit according to claim 60 .
65 . A communication device comprising:
a circuit module including:
an electronic circuit on a dielectric substrate, including:
a transmission line; and
a resonator device and a filter electrically linked to said transmission line; wherein
the transmission line and the resonator device include a microstrip line according to claim 45.Join the waitlist — get patent alerts
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