Light emitting diode package structure

Abstract

A light emitting diode package structure includes an insulating carrier base formed with a recess or a through hole. The recess or the through hole has a depth enough for completely accommodating a light emitting diode. The recess or the through hole may have two stepwise portions for providing two intermediate mesa planes. Two planar metal layers are separately formed on the two intermediate mesa planes and, respectively, connected to two metal pads which are arranged outside of the recess or the through hole. Two wiring lines connect two electrodes of the light emitting diode with the two planar metal layers, respectively. A resin fills the recess or the through hole for sealing all of the light emitting diode and the two wiring lines.

1 . A package structure for a light emitting diode having a substrate and two electrodes, comprising: 
 a transparent insulating carrier base for passing light emitted from the light emitting diode, said transparent insulating carrier base formed with a recess, the recess having a bottom surface for supporting the substrate, in which a depth of the recess is large enough for accommodating the light emitting diode;    at least a planar metal layer formed in a region on a top surface of the transparent insulating carrier base;    at least a wiring for connecting one of the at least a planar metal layer and one of the two electrodes; and    a resin for filling the recess and partially covering the at least a planar metal layer in order to seal the light emitting diode and the at least a wiring.    
   
   
       2 . The package structure according to  claim 1 , further comprising: 
 at least a metal pad formed on a portion, which is not covered by the resin, of the at least a planar metal layer.    
   
   
       3 . The package structure according to  claim 1 , wherein the transparent insulating carrier base is made of glass.  
   
   
       4 . The package structure according to  claim 1 , wherein the depth of the recess is smaller than 10 mm.  
   
   
       5 . The package structure according to  claim 1 , wherein the recess is formed in an approximately central region of the transparent insulating carrier base.  
   
   
       6 . The package structure according to  claim 1 , wherein the substrate is fixed on the bottom surface by using a transparent adhesive.  
   
   
       7 . The package structure according to  claim 1 , wherein the resin is made of epoxy resin.  
   
   
       8 . The package structure according to  claim 1 , wherein a material with a high thermal conductivity is added into the resin for enhancing the heat dissipating ability of the package structure.  
   
   
       9 . The package structure according to  claim 1 , wherein a material with a high reflectivity is added into the resin for reflecting light generated from the light emitting diode.  
   
   
       10 . The package structure according to  claim 1 , wherein the material type of the light emitting diode is an AlGaInP-based type, an AlGaInN-based type, an InGaN-based type, an AlGaAs-based type, a SiC-based type, or the like.  
   
   
       11 . The package structure according to  claim 1 , further comprising a reflective layer coated on the resin for reflecting light generated from the light emitting diode.  
   
   
       12 . The package structure according to  claim 1 , wherein the recess further comprises at least a stepwise portion connected to the bottom surface, the at least a stepwise portion having a lower sidewall surface connected to the bottom surface, an intermediate mesa plane, and an upper sidewall surface; wherein the at least a planar metal layer is extended onto both of the intermediate mesa plane and the upper sidewall surface of the at least a stepwise portion.  
   
   
       13 . The package structure according to  claim 12 , wherein the transparent insulating carrier base is made of glass.  
   
   
       14 . The package structure according to  claim 12 , wherein the depth of the recess is smaller than 10 mm.  
   
   
       15 . The package structure according to  claim 12 , wherein the recess is formed in an approximately central region of the transparent insulating carrier base.  
   
   
       16 . The package structure according to  claim 12 , wherein the substrate is fixed on the bottom surface by using a transparent adhesive.  
   
   
       17 . The package structure according to  claim 12 , wherein the resin is made of epoxy resin.  
   
   
       18 . The package structure according to  claim 12 , wherein a material with a high thermal conductivity is added into the resin for enhancing the heat dissipating ability of the package structure.  
   
   
       19 . The package structure according to  claim 12 , wherein a material with a high reflectivity is added into the resin for reflecting light generated from the light emitting diode.  
   
   
       20 . The package structure according to  claim 12 , wherein the material type of the light emitting diode is an AlGaInP-based type, an AlGaInN-based type, an InGaN-based type, an AlGaAs-based type, a SiC-based type, or the like.  
   
   
       21 . The package structure according to  claim 12 , further comprising a reflective layer coated on the resin for reflecting light generated from the light emitting diode.