Error-preventing device and method for semiconductor fabrication equipment

Abstract

A device for preventing errors during semiconductor wafer fabrication can be configured to prevent separation of optical sensor unit components, such as a gas supply pipe and a fixing guide, that could be caused by excess N 2 gas pressure. The device can also be configured to prevent excess moisture build-up that can lead to wafer sensing errors. The device includes a bath for receiving pure water or chemicals to remove particles. The bath can be further configured to discharge waste water after removal of the particles. Fixing guides are disposed at the outside of the bath to fix optical fiber sensors thereto. Optical fiber sensors are inserted into gas supply pipes, partially secured within the fixing guides. Purge output holes are formed at predetermined locations along the fixing guides to release N 2 gas pressure. A method for releasing excess pressure and a method for discharging excess moisture from an optical sensor unit are also provided.

1 . A method for preventing operation errors in a semiconductor fabrication system, said method comprising: 
 providing a cleaning station comprising an optical sensor unit;    arranging the optical sensor unit to detect the presence of a wafer in the cleaning station;    discharging excess moisture from the optical sensor unit to prevent errors in a sensing operation.    
   
   
       2 . A method according to  claim 1 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.  
   
   
       3 . A method according to  claim 2 , wherein the fixing guide further comprises one or more purge output holes configured to discharge excess moisture.  
   
   
       4 . A method according to  claim 1 , further comprising discharging excess pressure from the optical sensor unit to prevent unwanted separation of optical sensor unit components.  
   
   
       5 . A method according to  claim 4 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.  
   
   
       6 . A method according to  claim 5 , wherein the fixing guide comprises one or more purge output holes configured to discharge excess pressure from the optical sensor unit to prevent unwanted separation of the fixing guide and the gas supply pipe.  
   
   
       7 . A method for preventing operation errors in a semiconductor fabrication system, said method comprising: 
 providing a cleaning station comprising an optical sensor unit;    arranging the optical sensor unit to detect the presence of a wafer in the cleaning station;    discharging excess pressure from the optical sensor unit to prevent unwanted separation of optical sensor unit components.    
   
   
       8 . A method according to  claim 7 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.  
   
   
       9 . A method according to  claim 8 , wherein the fixing guide further comprises one or more purge output holes configured to discharge excess pressure.  
   
   
       10 . A method according to  claim 7 , further comprising discharging excess moisture from the optical sensor unit to prevent errors in a sensing operation.  
   
   
       11 . A method according to  claim 10 , wherein the optical sensor unit comprises a fixing guide attached to the outside of the cleaning station, a gas supply pipe disposed at least partially within the fixing guide, and an optical sensor disposed at least partially within the gas supply pipe.  
   
   
       12 . A method according to  claim 11 , wherein the fixing guide comprises one or more purge output holes configured to discharge excess moisture from the optical sensor unit to prevent sensing errors of the optical sensor unit.