Plating method and plating apparatus

Abstract

The present invention provides a plating method and a plating apparatus capable of plating small parts effectively without any deformation. A object product to be plated is put in each accommodating concave portion 51 in a carrier tape 5 including a number of the accommodating concave portions 51, 51, 51 spaced at a specific interval and this carrier tape 5 is passed through a plating apparatus 2 so as to form metallic plating layer on the surface of the object product to be plated.

1 . A plating method comprising putting an object product to be plated in each accommodating concave portion in a carrier tape having a number of spaced accommodating concave portions and passing the object product to be plated through a plating apparatus by feeding the carrier tape so as to form metallic plating layer on the surface of the object product to be plated.  
     
     
         2 . The plating method according to  claim 1  wherein washing units are disposed in the upstream and downstream of said plating unit and said object product to be plated is passed through each washing unit and washed.  
     
     
         3 . A plating apparatus comprising a feeding mechanism for the carrier tape containing a number of accommodating concave portions each capable of keeping an object product to be plated and a cell so constructed that the carrier tape can pass through plating solution and the cell is provided with a cathode member for supplying the object product to be plated with electricity.  
     
     
         4 . The plating apparatus according to  claim 3  wherein each accommodating concave portion in said carrier tape includes an opening which allows plating solution to flow in and out and said cathode member to invade.