Method and apparatus for non-conductively interconnecting integrated circuits

Abstract

A method and apparatus for constructing, repairing and operating modular electronic systems utilizes peripheral half-capacitors (i.e., conductive plates on the outside of the modules) to communicate non-conductively between abutting modules. Such systems provide lower cost, improved testability/repairability and greater density than conventional modular packaging techniques, such as printed circuit boards and multi-chip modules. The non-conductive interconnection technique of the invention can be applied to all levels in the packaging hierarchy, from bare semiconductor dies to complete functional sub-units. Numerous exemplary systems and applications are described.

1 . A modular electronic system comprising: 
 a substrate including a transmission line and a ground plane for the transmission line;    a monolithic integrated circuit chip including digital circuitry;    means for powering said chip; and, means mounted in part on the substrate and in part on the chip for capacitively coupling digital signals between said chip and said substrate.    
     
     
         2 - 26 . (Cancelled).  
     
     
         27 . A modular electronic system as defined in  claim 1  wherein said transmission line comprises a stripline, a microchip or a slotline.  
     
     
         28 - 29 . (Cancelled).  
     
     
         30 . A modular electronic system as defined in  claim 1  wherein said transmission line is coupled to said means for capacitively coupling.  
     
     
         31 . A modular electronic system as defined in  claim 30  wherein said transmission line is further coupled to a second means for capacitively coupling.  
     
     
         32 - 205 . (Cancelled).  
     
     
         206 . A modular electronic system as defined in claim  20  wherein said transmission line is terminated.  
     
     
         207 . A modular electronic system as defined in claim  20  wherein said transmission line connects a plurality of points together electrically.  
     
     
         208 . A modular electronic system as defined in claim  20 , wherein said plurality of points includes a plurality of listeners.  
     
     
         209 . A modular electronic system as defined in claim  20 , wherein said plurality of points includes a plurality of senders.  
     
     
         210 . A modular electronic system as defined in claim  20 , wherein said plurality of points includes a plurality of transmission lines.  
     
     
         211 . A modular electronic system comprising a first module, including a first array; and 
 a second module, including a second array; and    a third module, including a third array and a fourth array, said third array capacitively coupled to said first array, and said fourth array capacitively coupled to said second array;    each array comprising a plurality of half-capacitors.    
     
     
         212 . A modular electronic system as defined in  claim 211  further comprising a fourth module, including a fifth array; and 
 said second module further including a sixth array;    said fifth array capacitively coupled to said sixth array.    
     
     
         213 . A modular electronic system as defined in  claim 211  wherein said modules are tiled in a regular geometric pattern.  
     
     
         214 . A modular electronic system as defined in  claim 211  wherein said modules include a monolithic integrated circuit.  
     
     
         215 . A modular electronic system as defined in  claim 211  further including structures for facilitating mechanical alignment.