Semiconductor integrated circuit device, mounting board, and device and board assembly

Abstract

A semiconductor integrated circuit device according to the present invention comprises, a semiconductor chip formed with a semiconductor integrated circuit, at least one pair of previous-stage power supply terminals provided on the semiconductor chip and connected to a power supply line, a plurality of pairs of subsequent-stage power supply terminals provided on the semiconductor chip and connected to the power supply line connected commonly to the at least one pair of previous-stage power supply terminals, at least one previous-stage line providing a connection between the at least one pair of previous-stage power supply terminals, and subsequent-stage lines equal in number to the plurality of pairs of subsequent-stage power supply terminals and each providing a connection between the corresponding one of the plurality of pairs of subsequent-stage power supply terminals, wherein the at least one pair of previous-stage power supply terminals and the plurality of pairs of subsequent-stage power supply terminals are connected to each other to form a closed circuit when they are mounted on a mounting board.

1 . A semiconductor integrated circuit device comprising: 
 a semiconductor chip formed with a semiconductor integrated circuit;    at least one pair of previous-stage power supply terminals provided on the semiconductor chip and connected to a power supply line;    a plurality of pairs of subsequent-stage power supply terminals provided on the semiconductor chip and connected to the power supply line connected commonly to the at least one pair of previous-stage power supply terminals;    at least one previous-stage line providing a connection between the at least one pair of previous-stage power supply terminals; and    subsequent-stage lines equal in number to the plurality of pairs of subsequent-stage power supply terminals and each providing a connection between the corresponding one of the plurality of pairs of subsequent-stage power supply terminals,    the at least one pair of previous-stage power supply terminals and the plurality of pairs of subsequent-stage power supply terminals being connected to each other to form a closed circuit when they are mounted on a mounting board.    
   
   
       2 . The device of  claim 1 , wherein each of the previous-stage and subsequent-stage lines is composed of a material lower in electric resistance than a material composing the pairs of previous-stage and subsequent-stage power supply terminals.  
   
   
       3 . The device of  claim 1 , further comprising: 
 a previous-stage center power supply terminal disposed between the at least one pair of previous-stage power supply terminals and connected to a power supply line other than the foregoing power supply line; and    a plurality of subsequent-stage center power supply terminals each disposed between the corresponding one of the plurality of pairs of subsequent-stage power supply terminals and connected to the power supply line connected commonly to the previous-stage center power supply terminal,    the previous-stage center power supply terminal and the plurality of subsequent-stage center power supply terminals being connected to each other when they are mounted on the mounting board.    
   
   
       4 . The device of  claim 3 , wherein the pairs of previous-stage and subsequent-stage power supply terminals are positioned such that respective minimum distances are provided between the at least one pair of previous-stage power supply terminals and between each of the plurality of pairs of subsequent-stage power supply terminals.  
   
   
       5 . The device of  claim 3 , wherein 
 the previous-stage center power supply terminal is connected to a first power supply line,    the at least one pair of previous-stage power supply terminals is composed of a plurality of second to N-th pairs connected to second to N-th power supply lines, and    the plurality of pairs of subsequent-stage power supply terminals are composed of a plurality of second to N-th pairs connected to the second to N-th power supply lines.    
   
   
       6 . The device of  claim 5 , further comprising: 
 at least one signal terminal provided eternally of the at least one pair of previous-stage power supply terminals or the plurality of pairs of subsequent-stage power supply terminals.    
   
   
       7 . A mounting board comprising: 
 a board having a mounting region for mounting thereon a semiconductor integrated circuit device;    at least one pair of previous-stage power supply input electrodes disposed within the mounting region and connected to a power supply line;    a plurality of pairs of subsequent-stage power supply input electrodes disposed within the mounting region and connected to the power supply line connected commonly to the at least one pair of previous-stage power supply input electrodes; and    a line for connecting the at least one pair of previous-stage power supply input electrodes and the plurality of pairs of subsequent-stage power supply input electrodes to each other,    the at least one pair of previous-stage power supply input electrodes and the plurality of pairs of subsequent-stage power supply input electrodes being connected to each other to form a closed circuit with the semiconductor integrated circuit device being mounted on the mounting region.    
   
   
       8 . The mounting board of  claim 7 , further comprising: 
 a previous-stage center power supply input electrode disposed between the at least one pair of previous-stage power supply input electrodes and connected to a power supply line other than the foregoing power supply line;    a plurality of subsequent-stage center input electrodes each disposed between the corresponding one of the plurality of pairs of subsequent-stage power source input electrodes and connected to the power supply line connected commonly to the previous-stage center power supply input electrode; and    a line connecting the previous-stage center power supply input electrode and the subsequent-stage center power supply input electrodes to each other.    
   
   
       9 . The mounting board of  claim 8 , wherein 
 the previous-stage center power supply input electrode is connected to a first power supply line,    the at least one pair of previous-stage power supply input electrodes are composed of a plurality of second to N-th pairs connected to second to N-th power supply lines, and    the plurality of pairs of subsequent-stage power supply input electrodes are composed of a plurality of second to N-th pairs connected to the second to N-th power supply lines.    
   
   
       10 . A device and board assembly comprising: 
 a semiconductor integrated circuit device comprising a semiconductor chip formed with a semiconductor integrated circuit, at least one pair of previous-stage power supply terminals provided on the semiconductor chip and connected to a power supply line, a plurality of pairs of subsequent-stage power supply terminals provided on the semiconductor chip and connected to the power supply line connected commonly to the at least one pair of previous-stage power supply terminals, at least one previous-stage line providing a connection between the at least one pair of the previous-stage power supply terminals, and subsequent-stage lines equal in number to the plurality of pairs of subsequent-stage power supply terminals and each providing a connection between the corresponding one of the plurality of pairs of subsequent-stage power supply terminals; and    a mounting board comprising a board having a mounting region for mounting thereon a semiconductor integrated circuit device, at least one pair of previous-stage power supply input electrodes disposed within the mounting region and connected to the at least one pair of previous-stage power supply terminals, a plurality of pairs of subsequent-stage power supply input electrodes disposed within the mounting region and connected to the plurality of respective pairs of subsequent-stage power supply terminals, and a line for connecting the at least one pair of previous-stage power supply input electrodes and the plurality of pairs of subsequent-stage power supply input electrodes to each other,    the semiconductor integrated circuit device being mounted on the mounting region.