Method for assembling integral type electronic device, and integral type electronic device

Abstract

An integral type electronic device is formed from a first board and a second board by storing and holding electronic components in component storage parts of the first board, and then electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on a basis of an arrangement accuracy of the component storage parts, and the electronic components stored and held in the component storage parts are limited in motion.

1 . An integral electronic device comprising: 
 a first board having an opening that extends completely through a thickness of said first board;    an electronic component held within said opening; and    a second board electrically connected to said electronic component.    
   
   
       2 . The integral electronic device according to  claim 1 , wherein 
 said electronic component comprises a light-emitting element and said opening is defined by a side wall that is capable of shielding light emitted from said light-emitting element.    
   
   
       3 . The integral electronic device according to  claim 2 , wherein 
 said first board comprises a board of any one of glass, ceramic and an organic resin.    
   
   
       4 . The integral electronic device according to  claim 3 , wherein said light-emitting element is held within said opening via a photo-curing insulating resin.  
   
   
       5 . The integral electronic device according to  claim 2 , wherein said light-emitting element is held within said opening via a photo-curing insulating resin.  
   
   
       6 . The integral electronic device according to  claim 1 , wherein 
 said first board comprises a board of any one of glass, ceramic and an organic resin.    
   
   
       7 . The integral electronic device according to  claim 6 , wherein said electronic component is held within said opening via a photo-curing insulating resin.  
   
   
       8 . The integral electronic device according to  claim 1 , wherein said electronic component is held within said opening via a photo-curing insulating resin.  
   
   
       9 . The integral electronic device according to  claim 1 , wherein 
 said second board is electrically connected to said electronic component via a flat metallic bump.    
   
   
       10 . The integral electronic device according to  claim 1 , wherein 
 said electronic component is held within said opening via an insulating resin that surrounds said electronic component except for upper and lower surfaces of said electronic component.    
   
   
       11 . The integral electronic device according to  claim 10 , wherein 
 said second board is electrically connected to said electronic component by being electrically connected to said upper surface of said electronic component, said integral electronic device further comprising: 
 a third board electrically connected to said lower surface of said electronic component.  
   
   
   
       12 . The integral electronic device according to  claim 1 , further comprising: 
 another electronic component held within another opening that extends completely through the thickness of said first board,    wherein said second board is electrically connected to said another electronic component, with said opening and said another opening being parallel to one another.