Thermal transfer container for semiconductor component

Abstract

A thermal transfer container is disclosed for a semiconductor component to transfer heat to a heat sink such as used in rectifiers for alternators. The thermal transfer container includes an outer cylindrical surface having threads that engage threads defined in the heat sink bore for electrically and thermally connecting the metallic cylindrical container to the heat sink.

1 . A thermal transfer container for a semiconductor component for transferring heat to a heat sink having a threaded heat sink bore defined in the heat sink comprising: 
 a cylindrical container having a cylindrical surface extending between a first and a second cylindrical end;    a first end wall closing said first end of said cylindrical container;    a first connector for electrically and thermally connecting a first terminal of the semiconductor component to said first end wall of the cylindrical container;    a second connector affixing an electrical lead to a second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container; and    cylindrical threads disposed about said cylindrical surface of said cylindrical container for threadably engaging with said threaded heat sink bore of the heat sink for electrically and thermally connecting the cylindrical container to the heat sink.    
     
     
         2 . A thermal transfer container as set forth in  claim 1 , wherein said cylindrical container is a metallic container.  
     
     
         3 . A thermal transfer container as set forth in  claim 1 , wherein said cylindrical container is a metallic copper container.  
     
     
         4 . A thermal transfer container as set forth in  claim 1 , wherein said first end wall is integrally formed with said first end of said cylindrical container as a one piece unit.  
     
     
         5 . A thermal transfer container as set forth in  claim 1 , wherein said first connector comprises a first metallic connector for directly electrically and thermally connecting said first terminal of the semiconductor component to an interior surface of said first end wall of the cylindrical container.  
     
     
         6 . A thermal transfer container as set forth in  claim 1 , wherein said second connector comprises a second metallic connector for directly electrically affixing an electrical lead to said second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container.  
     
     
         7 . A thermal transfer container as set forth in  claim 1 , wherein said first connector comprises a first solder connector for directly electrically and thermally connecting said first terminal of the semiconductor component to an interior surface of said first end wall of the cylindrical container; and 
 a second solder connector for directly electrically affixing an electrical lead to said second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container.    
     
     
         8 . A thermal transfer container as set forth in  claim 1 , wherein said first end wall extends radially outward from said cylindrical sidewall to form a radial flange for electrically and thermally contacting the heat sink when said cylindrical threads of said cylindrical container are threadably engaged with said threaded heat sink bore of the heat sink for providing enhanced electrical and thermal conduction with the heat sink.  
     
     
         9 . A thermal transfer container as set forth in  claim 1 , wherein said first end wall extends radially outward from said cylindrical sidewall to form a radial flange for electrically and thermally contacting a counterbore in the heat sink when said cylindrical threads of said cylindrical container are threadably engaged with said threaded heat sink bore of the heat sink for providing enhanced electrical and thermal conduction with the heat sink.  
     
     
         10 . A thermal transfer container as set forth in  claim 1 , wherein said semiconductor component is directly electrically and thermally connected to an interior surface of said first end wall.  
     
     
         11 . A thermal transfer container as set forth in  claim 1 , wherein said cylindrical threads engaging with said threaded heat sink bore enables said cylindrical container to be unscrewed from the threaded heat sink bore to replace a cylindrical container having a defective semiconductor component.  
     
     
         12 . A thermal transfer container as set forth in  claim 1 , including a recess defined in an exterior surface of said first end wall for matingly receiving a tool for rotating said cylindrical container relative to said threaded heat sink bore of the heat sink.  
     
     
         13 . A thermal transfer container for a semiconductor component for transferring heat to a heat sink having a threaded heat sink bore defined in the heat sink comprising: 
 a cylindrical container having a cylindrical surface extending between a first and a second cylindrical end;    a first end wall closing said first end of said cylindrical container extending radially outward to form a radial flange;    a first connector for electrically and thermally connecting a first terminal of the semiconductor component to said first end wall of the cylindrical container;    a second connector affixing an electrical lead to a second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container; and    cylindrical threads disposed about said cylindrical surface of said cylindrical container for threadably engaging with said threaded heat sink bore of the heat sink for electrically and thermally connecting the cylindrical container to the heat sink with said radial flange electrically and thermally contacting the heat sink for providing enhanced electrical and thermal conduction with the heat sink.    
     
     
         14 . A thermal transfer container as set forth in  claim 13 , wherein said first end wall including said radial flange is integrally formed with said first end of said cylindrical container as a one piece unit.  
     
     
         15 . A thermal transfer container as set forth in  claim 13 , wherein said radial flange electrically and thermally contacts a counterbore in the heat sink when said cylindrical threads of said cylindrical container are threadably engaged with said threaded heat sink bore of the heat sink for providing enhanced electrical and thermal conduction with the heat sink.  
     
     
         16 . A thermal transfer container as set forth in  claim 13 , wherein said cylindrical threads engaging with said threaded heat sink bore enables said cylindrical container to be unscrewed from the threaded heat sink bore to replace a cylindrical container having a defective semiconductor component.  
     
     
         17 . A thermal transfer container as set forth in  claim 13 , including a recess defined in an exterior surface of said first end wall for matingly receiving a tool for rotating said cylindrical container relative to said threaded heat sink bore of the heat sink.  
     
     
         18 . In an alternator for generating electricity upon rotation of a rotor within a stator, the alternator having a rectifier that includes heat sinks each having a heat sink bore that receives a metallic cylindrical container having a semiconductor component having a first terminal of the semiconductor component being electrically connected to a first end of the metallic cylindrical container and a second terminal of the semiconductor component extending from a second end of the metallic cylindrical container, the improvement comprising: 
 threads defined in the heat sink bore; and    the cylindrical container having threads disposed about an outer cylindrical surface of the metallic cylindrical container for threadably engaging with the threaded heat sink bore of the heat sink bore for electrically and thermally connecting the metallic cylindrical container to the heat sink.    
     
     
         19 . A thermal transfer container as set forth in  claim 18 , wherein said cylindrical container is a metallic container.  
     
     
         20 . A thermal transfer container as set forth in  claim 18 , wherein said cylindrical container is a metallic copper container.  
     
     
         21 . A thermal transfer container as set forth in  claim 18 , wherein said first connector comprises a first metallic connector for directly electrically and thermally connecting said first terminal of the semiconductor component to an interior surface of said first end wall of the cylindrical container.  
     
     
         22 . A thermal transfer container as set forth in  claim 18 , wherein said second connector comprises a second metallic connector for directly electrically affixing an electrical lead to said second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container.  
     
     
         23 . A thermal transfer container as set forth in  claim 18 , wherein said first connector comprises a first solder connector for directly electrically and thermally connecting said first terminal of the semiconductor component to an interior surface of said first end wall of the cylindrical container; and 
 a second solder connector for directly electrically affixing an electrical lead to said second terminal of the semiconductor component with said electrical lead extending from said second cylindrical end of said cylindrical container.    
     
     
         24 . A thermal transfer container as set forth in  claim 18 , wherein said first end wall extends radially outward from said cylindrical sidewall to form a radial flange for electrically and thermally contacting the heat sink when said cylindrical threads of said cylindrical container are threadably engaged with said threaded heat sink bore of the heat sink for providing enhanced electrical and thermal conduction with the heat sink.  
     
     
         25 . A thermal transfer container as set forth in  claim 18 , wherein said semiconductor component is directly electrically and thermally connected to an interior surface of said first end wall.  
     
     
         26 . A thermal transfer container as set forth in  claim 18 , wherein said cylindrical threads engaging with said threaded heat sink bore enables said cylindrical container to be unscrewed from the threaded heat sink bore to replace a cylindrical container having a defective semiconductor component.  
     
     
         27 . A thermal transfer container as set forth in  claim 18 , including a recess defined in an exterior surface of said first end wall for matingly receiving a tool for rotating said cylindrical container relative to said threaded heat sink bore of the heat sink.  
     
     
         28 . A rectifier assembly comprising: 
 negative and positive heat sink plates spaced from each other, each having threaded diode receiving orifices;    positive and negative diode assemblies threaded into the respective threaded orifices of positive and negative heat sink plates; and    an insulator separating the respective negative and positive heat sink plates.    
     
     
         29 . A rectifier assembly according to  claim 28 , wherein each diode assembly comprises a cylindrical container and semiconductor diode received therein, and threads formed on the cylindrical container.