Application and removal of thermal interface material

Abstract

A method, system, and apparatus are provided for applying and removing of a thermal interface material (TIM). According to one embodiment, a flow of heat is directed towards the TIM to soften the TIM, and the TIM is applied to a heat sink.

What is claimed is:  
     
         1 . A method, comprising: 
 directing a heat flow towards a thermal interface material (TIM) to soften the TIM; and    applying the TIM to a heat sink.    
     
     
         2 . The method of  claim 1 , further comprises removing the TIM from the heat sink.  
     
     
         3 . The method of  claim 1 , wherein directing the heat flow comprises changing a normal heat flow in the heat sink.  
     
     
         4 . The method of  claim 3 , wherein the changing of the normal heat flow comprises reversing the normal heat flow in the heat sink.  
     
     
         5 . The method of  claim 4 , wherein the reversing of the normal heat flow is performed by reversing a polarity of a thermoelectric (TEC) module in the heat sink.  
     
     
         6 . The method of  claim 5 , wherein the reversing of the polarity is performed by at least one of the following: reversing terminals of the TEC module, using a device to change the polarity of the TEC module, and adjusting a power source.  
     
     
         7 . The method of  claim 1 , wherein the TIM is applied using at least one of the following: an epoxy dispenser machine and a vacuum suction cup.  
     
     
         8 . The method of  claim 1 , wherein the TIM is softened by increasing the TIM temperature until at least one of the following occurs: the TIM temperature reaches the melting point of the TIM and the TIM temperature is sufficiently close to the melting point of the TIM.  
     
     
         9 . The method of  claim 1 , wherein the TIM comprises at least one of the following: a phase change material and a metal.  
     
     
         10 . The method of  claim 9 , wherein the metal comprises at least one of the following: indium, an indium alloy, tin, and silver.  
     
     
         11 . A method, comprising: 
 directing a heat flow towards a thermal interface material (TIM) to soften the TIM; and    removing the TIM from a heat sink.    
     
     
         12 . The method of  claim 11 , further comprises applying the TIM to the heat sink.  
     
     
         13 . The method of  claim 11 , wherein the directing of the heat flow comprises changing a normal heat flow in the heat sink.  
     
     
         14 . The method of  claim 13 , wherein the changing of the normal heat flow comprises reversing the normal heat flow in the heat sink.  
     
     
         15 . The method of  claim 14 , wherein the reversing of the normal heat flow is performed by reversing a polarity of a thermoelectric (TEC) module in the heat sink, the reversing of the polarity of the TEC module is performed by at least one of the following: reversing terminals of the TEC module, using a device to change the polarity of the TEC module, and adjusting a power source.  
     
     
         16 . The method of  claim 11 , wherein the TIM comprises at least one of the following: a phase change material and a metal.  
     
     
         17 . The method of  claim 16 , wherein the metal comprises at least one of the following: 
 indium, an indium alloy, tin, and silver.    
     
     
         18 . An apparatus, comprising: 
 a heat sink comprising a thermoelectric (TEC) module having a polarity; and    a thermal interface material (TIM) coupled with the heat sink, the TIM receiving a redirected heat in the heat sink upon changing of the polarity.    
     
     
         19 . The apparatus of  claim 18 , wherein the TIM is applied at and removed from at least one of the following locations: a base of the heat sink and a thermal gap between the heat sink and a heat source.  
     
     
         20 . The apparatus of  claim 18 , wherein the TIM is applied using at least one of the following: 
 an epoxy dispenser machine and a vacuum suction cup.    
     
     
         21 . The apparatus of  claim 18 , wherein the changing of the polarity comprises reversing of the polarity.  
     
     
         22 . The apparatus of  claim 21 , wherein the reversing of the polarity is performed by at least of the following: reversing terminals of the TEC module, using a device to change the polarity of the TEC module, and adjusting a power source.  
     
     
         23 . A system, comprising: 
 a storage medium;    a integrated circuit (IC) device coupled with the storage medium;    a heat sink coupled with the IC device, the heat sink comprising a thermoelectric (TEC) module having a polarity; and    a thermal interface material (TIM) coupled with the heat sink and the IC device, the TIM receiving a redirected heat in the heat sink upon changing of the polarity.    
     
     
         24 . The system of  claim 23 , wherein the TIM is applied at and removed from at least one of the following locations: a base of the heat sink and a thermal gap between the heat sink and a heat source.  
     
     
         25 . The system of  claim 23 , wherein the TIM is applied using at least one of the following: an epoxy dispenser machine and a vacuum suction cup.  
     
     
         26 . The system of  claim 23 , wherein the changing of the polarity comprises reversing of the polarity.  
     
     
         27 . The system of  claim 26 , wherein the reversing of the polarity is performed by at least of the following: reversing terminals of the TEC module, using a device to change the polarity of the TEC module, and adjusting a power source.  
     
     
         28 . The system of  claim 23 , wherein the IC device comprises at least one of the following: a microprocessor, a microcontroller, a graphics processor, a digital signal processor (DSP), a complex instruction set computing (CISC) processor, a reduced instruction set computing (RISC) processor, and a very long instruction word (VLIW) processor.