[heat sink structure]

Abstract

A heat sink structure suitable for a chip-packaging unit is provided. The heat sink structure includes a heat spreader and at least one arcuate spring. The heat spreader has a top surface and a bottom surface and the bottom surface covers over the chip-packaging unit. The arcuate spring is disposed between the bottom surface of the heat spreader and the chip-packaging unit, such that the arcuate spring is in contact with the back surface of a chip of the chip-packaging unit.

1 . A heat sink structure suitable for a chip-packaging unit, comprising: 
 a heat spreader, having a top surface and a bottom surface, the bottom surface suitable for covering over the chip-packaging unit; and    at least one arcuate spring disposed on the bottom surface, wherein end portions of the arcuate spring are connected with the bottom surface, and a central area of the arcuate spring is further away from the bottom surface of the heat spreader and is in contact with a surface of the chip-packaging unit.    
     
     
         2 . The heat sink structure according to  claim 1 , further comprising a plurality of hooks, wherein the hooks, at one end thereof, are fixed on a periphery of the bottom surface of the heat spreader, and, at another end thereof, are extended to and clipped on the chip-packaging unit.  
     
     
         3 . The heat sink structure according to  claim 1 , wherein the heat spreader is made of copper, alloy of aluminum, or alloy of copper.  
     
     
         4 . The heat sink structure according to  claim 1 , wherein the arcuate spring is fabricated along with the heat spreader.  
     
     
         5 . The heat sink structure according to  claim 1 , wherein end portions of the arcuate spring are welded on the bottom surface of the heat spreader.  
     
     
         6 . The heat sink structure according to  claim 1 , wherein end portions of the arcuate spring are bolted on the bottom surface of the heat spreader.  
     
     
         7 . The heat sink structure according to  claim 1 , wherein end portions of the arcuate spring are locked on the bottom surface of the heat spreader.  
     
     
         8 . The heat sink structure according to  claim 1 , wherein a plurality of grooves are disposed on a periphery of the heat spreader, for end portions of the arcuate spring being locked into the grooves.  
     
     
         9 . A heat sink structure suitable for a chip-packaging unit, comprising: 
 a heat spreader, having a top surface and a bottom surface, the bottom surface suitable for covering over the chip-packaging unit;    a plurality of heat-dissipating fins disposed on the top surface; and    at least one arcuate spring disposed on the bottom surface, wherein end portions of the arcuate spring are connected with the bottom surface, while a central area of the arcuate spring is further away from the bottom surface of the heat spreader and is in contact with a surface of the chip-packaging unit.    
     
     
         10 . The heat sink structure according to  claim 9 , further comprising a plurality of hooks, wherein the hooks, at one end thereof, are fixed on a periphery of the bottom surface of the heat spreader, and, at another end thereof, are extended to and clipped to the chip-packaging unit.  
     
     
         11 . The heat sink structure according to  claim 9 , wherein a plurality of grooves are disposed on a periphery of the heat spreader, for end portions of the arcuate spring being locked into the grooves.  
     
     
         12 . A chip-packaging unit comprising: 
 a package baseboard having a first surface and a second surface;    a chip disposed on the first surface of and is electronically connected to the baseboard; and    a heat sink structure covering on the chip, comprising:    a heat spreader having a top surface and a bottom surface;    at least one arcuate spring disposed on the bottom surface, wherein end portions of the arcuate spring are connected with a periphery of the bottom surface, and a central area of the arcuate spring is further away from the bottom surface of the heat spreader and is in contact with a surface of the chip; and    a plurality of hooks, at one end thereof fixed on a periphery of the bottom surface of the heat spreader, and at another end thereof extended to and clipped on the second surface of the package baseboard.    
     
     
         13 . The chip-packaging unit according to  claim 12 , wherein the chip is electronically connected to the package baseboard via flip-chip bonding, and the arcuate spring is in contact with a back surface of the chip.  
     
     
         14 . The chip-packaging unit according to  claim 12 , wherein the heat spreader is made of copper, alloy of aluminum, or alloy of copper.  
     
     
         15 . The chip-packaging unit according to  claim 12 , wherein the arcuate spring is fabricated along with the heat spreader.  
     
     
         16 . The chip-packaging unit according to  claim 12 , wherein end portions of the arcuate spring are welded on the bottom surface of the heat spreader.  
     
     
         17 . The chip-packaging unit according to  claim 12 , wherein end portions of the arcuate spring are bolted on the bottom surface of the heat spreader.  
     
     
         18 . The chip-packaging unit according to  claim 12 , wherein end portions of the arcuate spring are locked on the bottom surface of the heat spreader.  
     
     
         19 . The chip-packaging unit according to  claim 12 , wherein a plurality of grooves are disposed on a periphery of the heat spreader, for end portions of the arcuate spring being locked into the grooves.