Heat pipe circuit board

Abstract

A heat pipe circuit board comprising: a heat pipe; at least one insulating layer; a circuit pattern provided on a surface of or inside the at least one insulating layer; and electronic components being mounted on the heat pipe through the insulating layer. The heat pipe is formed by jointing two plate members by friction stir welding, at least one of the two plate members being provided with a recess portion which is a fluid channel of a working fluid.

1 - 9 . (Canceled)  
     
     
         10 . A heat pipe circuit board comprising: 
 a heat pipe, said heat pipe being formed by jointing two plate members by friction stir welding, at least one of said two plate members being provided with a recess portion which is a fluid channel of a working fluid;    at least one insulating layer;    a circuit pattern provided on a surface of or inside said at least one insulating layer; and    electronic components being mounted on said heat pipe through said insulating layer.    
     
     
         11 . The heat pipe circuit board as claimed in  claim 10 , wherein said at least one insulating layer takes the shape of a sheet or a plate.  
     
     
         12 . The heat pipe circuit board as claimed in  claim 10 , wherein said at least one insulating layer is formed by a coating.  
     
     
         13 . The heat pipe circuit board as claimed in  claim 10 , wherein said at least one insulating layer is strong enough to support said electronic components by itself.  
     
     
         14 . The heat pipe circuit board as claimed in  claim 10 , wherein said electronic components are mounted on said two plate members via said at least one insulating member.  
     
     
         15 . The heat pipe circuit board as claimed in  claim 10 , wherein said electronic components are mounted on either of said two plate members via said at least one insulating member.  
     
     
         16 . A heat pipe circuit board manufacturing method wherein two plate members are prepared, at least one of the plate members being provided with a recess portion which is a fluid channel of a working fluid, electronic components being mounted on at least one of the plate members via an insulating layer, and then, the plate members being jointed by friction stir welding.