Multi-chip module with extension

Abstract

A multi-chip module may include a pair of chips which are arranged one over the other on each side of a laminate layer. A central passage through the laminate layer provides a passage to wire bond a chip on a first side of the laminate layer to contacts on a second side of the laminate layer. A second chip is also placed on the second side of the laminate layer. By causing the laminate layer to extend outwardly beyond the first and second chips, and providing contacts on the extension, contact may be made to the laminate layer extension for electrically coupling the first and second chips to the outside world.

What is claimed is:  
     
         1 - 11  (Canceled).  
     
     
         12 . A method of forming a multi-chip module comprising: 
 adhesively securing a first chip to a first surface of a laminate layer;    inverting the assembly of said laminate layer and said first chip;    wire bonding said first chip to a second surface of said laminate layer;    securing a second chip to the second surface of said laminate layer using bumps;    positioning said first and second chips on said laminate layer so that at least a portion of said laminate layer extends outwardly beyond said first and second chips; and    providing solder ball contacts on said first surface of said extension electrically coupled to said first and second chips.    
     
     
         13 . The method of  claim 12  including aligning said first and second chips over one another.  
     
     
         14 . The method of  claim 13  including providing a pair of extensions extending outwardly beyond said first and second chips.  
     
     
         15 . The method of  claim 13  including aligning said chips so as to form an extension of said laminate layer that extends outwardly beyond said chips and completely around said module.  
     
     
         16 . The method of  claim 14  including providing solder balls on said contacts on said extensions.  
     
     
         17 . The method of  claim 12  including filling a region between said chips with an encapsulant.  
     
     
         18 . The method of  claim 17  including forming a passage through said laminate layer and forming wire bonds from said first chip through said passage to the second surface of said laminate layer.  
     
     
         19 . The method of  claim 17  including coupling said contact and said first and second chips through traces extending through said laminate layer.  
     
     
         20 - 29  (Canceled).  
     
     
         30 . A method comprising: 
 coupling a first chip to a first side of a support structure;    coupling a second chip to a second side of said support structure;    causing said support structure to extend outwardly beyond the first chip; and    providing solder ball pads on the portion of said structure extending outwardly beyond said first chip, said pads electrically coupled to said first and second chips.    
     
     
         31 . The method of  claim 30  wherein coupling a first chip includes adhesively coupling a first chip to said support structure.  
     
     
         32 . The method of  claim 31  wherein coupling a first chip includes wire bonding said first chip to bonding pads on said second side of said support structure.  
     
     
         33 . The method of  claim 30  wherein coupling a second chip includes bump bonding said second chip to said second side of said support structure.  
     
     
         34 . The method of  claim 30  wherein causing said support structure to extend outwardly includes causing said support structure to extend outwardly from two opposed edges of the first chip.  
     
     
         35 . The method of  claim 34  wherein causing said support structure to extend outwardly includes causing said support structure to extend outwardly beyond four edges of said first chip.  
     
     
         36 . The method of  claim 30  wherein causing said support structure to extend outwardly includes causing said support structure to extend outwardly beyond said first and second chips.  
     
     
         37 . The method of  claim 30  including coupling said first and second chips to said solder ball pads on said portion via traces extending through said structure.