Semiconductor cooling device

Abstract

A semiconductor cooling device includes a cold plate for cooling a semiconductor element, a condenser, and a positive-displacement refrigerant pump. The cold plate, condenser and refrigerant pump are fluid connected in series with each other to define a refrigerating cycle. A centrifugal refrigerant pump can be used in place of the positive-displacement refrigerant pump. In this case, it is preferred that a receiver tank be interposed between the condenser and the refrigerant pump.

What is claimed is:  
     
         1 . A semiconductor cooling device comprising: 
 a cold plate for cooling a semiconductor element;    a condenser; and    a positive-displacement refrigerant pump, said cold plate, condenser and refrigerant pump being fluid connected in series with each other to define a refrigerating cycle.    
     
     
         2 . A semiconductor cooling device comprising: 
 a cold plate for cooling a semiconductor element;    a condenser;    a receiver tank; and    a centrifugal refrigerant pump, said cold plate, condenser, receiver tank and refrigerant pump being fluid connected in series with each other to define a refrigerating cycle.