Cooling apparatus for wafer baking plate

Abstract

A cooling apparatus for a wafer baking plate is provided. The wafer baking plate has a support plate for supporting a wafer, a heater under the support plate, and a heat transfer plate interposed between the support plate and the heater, for transferring heat. In the cooling apparatus, a hollow bore is formed in the heat transfer plate of the wafer baking plate and partially filled with a liquid working fluid. A cooling pipe is laid in the heat transfer plate, for circulating a cooling medium. The wafer baking plate is cooled down via the working fluid, stabilizing its temperature distribution. Therefore, the product yield of wafers is increased.

1 . A cooling apparatus for a wafer baking plate having a support plate for supporting a wafer, a heater under the support plate, and a heat transfer plate interposed between the support plate and the heater, for transferring heat, comprising: 
 a hollow bore formed in the heat transfer plate and partially filled with a liquid working fluid; and    a cooling pipe laid in the heat transfer plate, for circulating a cooling medium    
     
     
         2 . The cooling apparatus of  claim 1 , wherein the cooling pipe is laid in the hollow bore of the heat transfer plate and disposed in the working fluid which is liquid at room temperature.  
     
     
         3 . The cooling apparatus of  claim 1 , wherein a groove is formed in the bottom of the hollow bore and the cooling pipe is laid in the groove.  
     
     
         4 . The cooling apparatus of  claim 1 , wherein the cooling pipe is laid outside the hollow bore.  
     
     
         5 . The cooling apparatus of  claim 1 , wherein the cooling pipe includes a first pipe laid in the hollow bore and a second pipe laid outside the hollow bore.  
     
     
         6 . The cooling apparatus of  claim 1 , wherein a cross-section of the cooling pipe is one of circular, oval, and polygonal.