Method and system for sensing IC package orientation in sockets

Abstract

An embodiment of this invention provides a system and method for indicating the orientation of a packaged IC in a socket. An LED is physically mounted to a socket. One lead of the LED is electrically connected to a positive voltage through a socket hole on the socket. When the orientation of the IC package in the socket is correct, the other lead of the LED is connected to a ground path on the packaged IC. As a result, the LED is activated indicating the orientation of the packaged IC is correct.

What is claimed is:  
     
         1 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically and electrically connected to the socket;    c) wherein the resistor conducts current when the packaged IC is correctly inserted in the socket.    
     
     
         2 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically and electrically connected to the socket;    c) wherein the resistor conducts current when the packaged IC is incorrectly inserted in the socket.    
     
     
         3 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket;    c) wherein the resistor conducts current when the packaged IC is correctly inserted in the socket.    
     
     
         4 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically mounted to the socket and electrically connected between a first socket hole and a second socket hole on the socket;    c) wherein the resistor conducts current when the packaged IC is incorrectly inserted in the socket.    
     
     
         5 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket;    c) wherein the first socket hole is connected to a positive voltage;    d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly;    e) wherein the resistor conducts current when the packaged IC is oriented correctly.    
     
     
         6 ) The system in  claim 5  wherein the socket is a ZIF socket.  
     
     
         7 ) A system for indicating orientation of a packaged IC comprising: 
 a) a socket;    b) a resistor, the resistor physically mounted to the socket and electrically connected between a first socket hole and second socket hole on the socket;    c) wherein the first socket hole is connected to a positive voltage;    d) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly;    e) wherein the resistor conducts current when the packaged IC is oriented incorrectly.    
     
     
         8 ) The system in  claim 7  wherein the socket is a ZIF socket.  
     
     
         9 ) A method for indicating orientation of a packaged IC comprising: 
 a) physically mounting a resistor to a socket;    b) electrically connecting the resistor between a first socket hole and a second socket hole on the socket;    c) inserting the packaged IC in the socket;    d) providing a positive voltage to the first socket hole;    e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented correctly;    f) wherein the resistor conducts current when the packaged IC is oriented correctly.    
     
     
         10 ) The method in  claim 9  wherein the socket is a ZIF socket.  
     
     
         11 ) A method for indicating orientation of a packaged IC comprising: 
 a) physically mounting a resistor to a socket;    b) electrically connecting the resistor between a first socket hole and a second socket hole on the socket;    c) inserting the packaged IC in the socket;    d) providing a positive voltage to the first socket hole;    e) wherein the second socket hole is connected to a ground path on the packaged IC when the packaged IC is oriented incorrectly;    f) wherein the resistor conducts current when the packaged IC is oriented incorrectly.    
     
     
         12 ) The method in  claim 11  wherein the socket is a ZIF socket.