US2004241039A1PendingUtilityA1

High temperature lead-free solder compositions

39
Individually held — no corporate assignee on recordPriority: Oct 27, 2000Filed: Jun 22, 2004Published: Dec 2, 2004
Est. expiryOct 27, 2020(expired)· nominal 20-yr term from priority
Inventors:Jennie S. Hwang
B23K 35/262C22C 13/02C22C 13/00
39
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Claims

Abstract

Disclosed is a high temperature, high performance lead-free solder alloy comprising effective amounts of tin, copper, silver, bismuth, and antimony and having a liquidus temperature above 215° C. More particularly, several lead-free solder alloys are disclosed that comprise about (i) at least about 90% Sn, 0.2 to 5.0% Cu, 0.05 to 5.0% Bi; or (ii) at least about 75% Sn, 0.5 to 7.0% Cu, 0.05 to 18% Sb; or (iii) at least about 67% Sn, 3 to 15% Ag, 0.01 to 18% Sb; (iv) at least about 78% Sn, 0.8 to 7.0% Cu, 4 to 15% Ag; (v) at least about 96% Sn, and at least one of 0.01 to 2.0% Ni, and 0.01 to 2.0% Co; (vi) at least about 90% Sn, 0.05 to 5.0% Bi, and 0 to 5.0% Sb; and (vii) at least about 90% Sn, 0.2 to 0.9% Cu, and 0.1 to 5.0% Bi.

Claims

exact text as granted — not AI-modified
I claim:  
     
         1 . A high temperature, lead-free solder alloy consisting essentially of: 
 at least about 90% Sn;    0.2 to 5.0% Cu; and    0.05 to 5.0% Bi;    the high temperature, lead-free alloy having a liquidus temperature greater than 225° C. and exhibiting a tensile strength that is at least 20% greater than a corresponding composition of Sn/Cu.    
     
     
         2 . The high temperature, lead-free solder alloy of  claim 1 , wherein the alloy includes about 90 to 99% Sn, 0.2 to 5.0% Cu, and 0.05 to 5.0% Bi.  
     
     
         3 . The high temperature, lead-free solder alloy of  claim 2 , wherein the solder alloy comprises about 96.0% Sn, 3.0% Cu, and 1.0% Bi.  
     
     
         4 . A high temperature, lead-free solder alloy consisting essentially of: 
 at least about 75% Sn;    0.5 to 7.0% Cu; and    0.5 to 18.0% Sb;    the high temperature, lead-free alloy having a liquidus temperature greater than 225° C. and exhibiting a tensile strength that is at least 20% greater than a corresponding composition of Sn/Cu.    
     
     
         5 . The high temperature, lead-free solder alloy of  claim 4 , wherein the alloy includes about 75 to 99% Sn, 0.5 to 7.0% Cu, and 0.05 to 18% Sb.  
     
     
         6 . The high temperature, lead-free solder alloy of  claim 5 , wherein the solder alloy comprises about 82% Sn, 3% Cu, and 15% Sb.  
     
     
         7 . A high temperature, lead-free solder alloy consisting essentially of: 
 at least about 78% Sn;    0.8 to 7.0% Cu; and    4.0 to 15.0% Ag;    the high temperature, lead-free alloy having a liquidus temperature greater than 225° C. and exhibiting a tensile strength that is at least 20% greater than a corresponding composition of Sn/Cu.    
     
     
         8 . The high temperature, lead-free solder alloy of  claim 7 , wherein the alloy includes about 78 to 96% Sn, 0.8 to 7.0% Cu, and 4 to 15% Ag.  
     
     
         9 . The high temperature, lead-free solder alloy of  claim 8 , wherein the solder alloy comprises about 87% Sn, 3% Cu, and 10% Ag.  
     
     
         10 . A high temperature, lead-free solder alloy consisting essentially of: 
 at least about 90% Sn;    0.05 to 5.0% Bi; and    0 to 5.0% Sb;    the high temperature, lead-free alloy having a liquidus temperature greater than 225° C.    
     
     
         11 . The high temperature, lead-free solder alloy of  claim 10 , wherein the alloy includes about 90 to 99% Sn, 0.05 to 5.0% Bi, and 0 to 5.0% Sb.  
     
     
         12 . The high temperature, lead-free solder alloy of  claim 11 , wherein the solder alloy comprises about 98.5% Sn, 1% Bi, and 0.5% Sb.  
     
     
         13 . A high temperature, lead-free solder alloy consisting essentially of: 
 at least about 90% Sn;    0.2 to 0.9% Cu; and    0.1 to 5.0% Bi;    the high temperature, lead-free alloy having a liquidus temperature greater than 225° C. and exhibiting a tensile strength that is at least 20% greater than a corresponding composition of Sn/Cu.    
     
     
         14 . The high temperature, lead-free solder alloy of  claim 13 , wherein the alloy includes about 90 to 99% Sn, 0.2 to 0.9% Cu, and 0.1 to 5.0% Bi.  
     
     
         15 . The high temperature, lead-free solder alloy of  claim 14 , wherein the solder alloy comprises about 98.3% Sn, 0.7% Cu, and 1% Bi.

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