Printed circuit board with controlled solder shunts

Abstract

A printed circuit board having pairs of shunt pads, from which the solder mask is removed and which are capable of being bridged to form zero ohm resistors. The shunt pads are spaced sufficiently far apart to avoid short circuiting, but sufficiently close to permit a solder bridge to occur between them. The shunt pads can be designed to permit mounting of a resistor component if desired, rather than being bridged.

What is claimed is:  
     
         1 . A printed circuit board, comprising: 
 a base;    a predetermined pattern of interconnections printed on the base, the pattern comprising traces for interconnecting the electrical components and comprising at least two shunt pads;    a solder mask over the pattern of interconnections, the solder mask having windows for exposing the shunt pads;    wherein the shunt pads are spaced sufficiently apart so as to avoid short circuiting but sufficiently close together so as to result in solder bridging during board soldering.    
     
     
         2 . The printed circuit board of  claim 1 , wherein the printed circuit board is a surface mount board.  
     
     
         3 . The printed circuit board of  claim 1 , wherein the printed circuit board is a through hole board.  
     
     
         4 . The printed circuit board of  claim 1 , wherein the printed circuit board has interconnections for both through hole and surface mount components.  
     
     
         5 . The printed circuit board of  claim 1 , wherein the printed circuit board has solder mask between the shunt pads.  
     
     
         6 . The printed circuit board of  claim 1 , wherein the shunt pads are rectangular in shape.  
     
     
         7 . The printed circuit board of  claim 1 , wherein the shunt pads are the same shape and size.  
     
     
         8 . The printed circuit board of  claim 1 , wherein the shunt pads are suitable for surface mounting a resistor component.  
     
     
         9 . The printed circuit board of  claim 1 , wherein the shunt pads are suitable for through hole mounting a resistor component.  
     
     
         10 . A method of forming a zero resistance connection between two points on a printed circuit board, comprising the steps of: 
 printing metal circuitry on a circuit board base, the circuitry having at least two shunt pads;    wherein the shunt pads are spaced sufficiently apart so as to avoid short circuiting but sufficiently close together so as to result in solder bridging during a board soldering process;    forming a solder mask over the metal circuitry;    exposing the shunt pads through the solder mask; and    soldering the printed circuit board, thereby creating a solder bridge between the shunt pads.    
     
     
         11 . The method of  claim 10 , wherein the creating step is performed using a solder paste process.  
     
     
         12 . The method of  claim 10 , wherein the creating step is performed using a solder wave process.  
     
     
         13 . The method of  claim 10 , wherein the printed circuit board is a surface mount board.  
     
     
         14 . The method of  claim 10 , wherein the printed circuit board is a through hole board.  
     
     
         15 . The method of  claim 10 , wherein the printed circuit board has interconnections for both through hole and surface mount components.  
     
     
         16 . The method of  claim 10 , wherein the soldering step is also used for soldering components to the board.  
     
     
         17 . A printed circuit board, comprising: 
 a base;    a predetermined pattern of interconnections printed on the base, the pattern comprising traces for interconnecting the electrical components and comprising at least one soldered shunt;    wherein the soldered shunt comprises a pair of shunt pads having a solder bridge between them;    a solder mask over the pattern of interconnections, the solder mask having windows for exposing the shunt pads;    wherein the shunt pads are spaced sufficiently apart so as to avoid short circuiting but sufficiently close together so as to result in solder bridging during board soldering.    
     
     
         18 . The printed circuit board of  claim 17 , wherein the printed circuit board is a surface mount board.  
     
     
         19 . The printed circuit board of  claim 17 , wherein the printed circuit board is a through-hole board.  
     
     
         20 . The printed circuit board of  claim 17 , wherein the printed circuit board has interconnections for both through-hole and surface mount components.