US2004238086A1PendingUtilityA1

Processing copper-magnesium alloys and improved copper alloy wire

Priority: May 27, 2003Filed: May 27, 2003Published: Dec 2, 2004
Est. expiryMay 27, 2023(expired)· nominal 20-yr term from priority
Inventors:Joseph Saleh
C22C 9/00C22F 1/08
40
PatentIndex Score
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Claims

Abstract

In accordance with the present invention, a copper alloy wire having high strength and high conductivity is provided. The copper alloy wire is formed from a copper base alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total. The wire has a single end diameter no greater than 0.10 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS. A process for producing the copper wire of the present invention is also described.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A copper alloy wire having high strength and high conductivity which comprises a copper alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total, said wire having a single end diameter less than 0.010 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS.  
     
     
         2 . A copper alloy wire according to  claim 1 , wherein said tensile strength is at least 110 ksi.  
     
     
         3 . A copper alloy wire according to  claim 1 , wherein said electrical conductivity is greater than 70% IACS.  
     
     
         4 . A copper alloy wire according to  claim 1 , wherein said copper alloy also contains from 0.01 to 0.3 wt % phosphorous.  
     
     
         5 . A copper alloy wire according to  claim 4 , wherein said phosphorous is present in an amount from 0.01 to 0.15 wt % and said magnesium is present in an amount from 0.1 to 0.4 wt %.  
     
     
         6 . A copper alloy wire according to  claim 4 , wherein a majority of particles of said phosphorous are submicron in size.  
     
     
         7 . A copper alloy wire according to  claim 1 , wherein said copper alloy also contains at least one additional constituent selected from the group consisting of from 0.01 to 1.0 wt % iron, from 0.01 to 0.5 wt % nickel, from 0.01 to 0.3 wt % phosphorous, from 0.01 to 0.2 wt % silver, from 0.01 to 0.2 wt % tin, and from 0.01 to 0.5 wt % zinc.  
     
     
         8 . A copper alloy wire according to  claim 7 , wherein said at least one additional constituent includes iron in an amount from 0.01 to 0.5 wt %.  
     
     
         9 . A copper alloy wire according to  claim 7 , wherein said at least one additional constituent includes tin in an amount from 0.01 to 0.1 wt %.  
     
     
         10 . A copper alloy wire according to  claim 7 , wherein said at least one additional constituent includes phosphorous in an amount from 0.02 to 0.15 wt %.  
     
     
         11 . A copper alloy wire according to  claim 1 , wherein said wire is in a restructuring annealed and cold worked condition.  
     
     
         12 . A copper alloy wire according to  claim 1 , wherein said single end diameter is greater than 0.002 inches.  
     
     
         13 . A copper alloy having high strength and high conductivity which comprises a copper alloy consisting of from 0.05 to 0.9 wt % magnesium, 0.01 to 0.3 wt % phosphorous, and the balance copper and more than 15 ppm impurities in total, said wire having a single end diameter no greater than 0.010 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 70% IACS.  
     
     
         14 . A copper alloy according to  claim 13 , wherein said phosphorous content is in the range of from 0.01 to 0.15 wt %, and said tensile strength is at least 110 ksi.  
     
     
         15 . A copper alloy wire having high strength and high conductivity which comprises a copper alloy consisting of from 0.05 to 0.9 wt % magnesium, at least one constituent selected from the group consisting of from 0.01 to 1.0 wt % iron, from 0.01 to 0.5 wt % nickel, from 0.01 to 0.3 wt % phosphorous, from 0.01 to 0.2 wt % silver, from 0.01 to 0.2 wt % tin, and from 0.01 to 0.5 wt % zinc, and the balance copper and more than 15 ppm impurities in total, said wire having a single end diameter no greater than 0.010 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 70% IACS.  
     
     
         16 . A process for manufacturing a copper alloy wire having high strength and high conductivity comprising the steps of: 
 providing a base material formed from a copper alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total;    cold working said base material into a wire having at least a 40% reduction in original cross section area;    performing a restructuring anneal after said cold working step; and    cold working said annealed material into a wire having a final gage of no greater than 0.010 inches.    
     
     
         17 . A process according to  claim 16 , wherein said restructuring anneal is performed after said base material has been cold worked into a wire having at least a 70% reduction in said original cross section area.  
     
     
         18 . A process according to  claim 16 , wherein said restructuring anneal is performed at a temperature in the range of 650 to 1050° F. for a time period in the range of 1 to 5 hours.  
     
     
         19 . A process according to  claim 18 , wherein said restructuring anneal is performed at a temperature in the range of 750 to 900° F. for a time period in the range of 2 to 3 hours.  
     
     
         20 . A process according to  claim 16 , wherein said base material providing step comprises providing material formed from a copper alloy consisting of from 0.05 to 0.9 wt % magnesium and the balance copper and more than 15 ppm impurities in total.  
     
     
         21 . A process according to  claim 16 , wherein said base material providing step comprises providing material formed from a copper alloy consisting of from 0.05 to 0.9 wt % magnesium, from 0.01 to 0.3 wt % phosphorous, and the balance copper and more than 15 ppm impurities in total.  
     
     
         22 . A process according to  claim 16 , wherein said base material providing step comprises providing material formed from a copper alloy consisting of from 0.05 to 0.9 wt % magnesium, at least one constituent selected from the group consisting of from 0.01 to 1.0 wt % iron, from 0.01 to 0.5 wt % nickel, from 0.01 to 0.3 wt % phosphorous, from 0.01 to 0.2 wt % silver, from 0.01 to 0.2 wt % tin, and from 0.01 to 0.5 wt % zinc, and the balance copper and more than 15 ppm impurities in total.  
     
     
         23 . A process according to  claim 16 , wherein said final gage cold working step comprises cold working said annealed material into a wire having a diameter less than 0.010 inches.  
     
     
         24 . A non-cadmium containing copper alloy wire having high strength and high conductivity which comprises a copper alloy containing from 0.05 to 0.9 wt % magnesium and more than 15 ppm impurities in total, said single end wire having a diameter no greater than 0.10 inches, a tensile strength of at least 100 ksi, and an electrical conductivity greater than 60% IACS.

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