US2004232525A1PendingUtilityA1

Semiconductor structure, semiconductor device, communicating device, integrated circuit, and process for fabricating the same

Assignee: MOTOROLA INCPriority: Feb 10, 2000Filed: Jun 29, 2004Published: Nov 25, 2004
Est. expiryFeb 10, 2020(expired)· nominal 20-yr term from priority
H10P 14/69398H10P 14/6339H10P 14/6334H10P 14/3431H10P 14/3428H10P 14/3421H10P 14/3418H10P 14/3402H10P 14/3256H10P 14/3252H10P 14/3251H10P 14/3238H10P 14/3226H10P 14/3202H10P 14/2926H10P 14/2905H01S 5/0261C30B 25/18H01S 5/021H10D 84/08H10D 84/05H10D 84/01H10H 20/824H10H 20/817H10H 29/10
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Claims

Abstract

High quality epitaxial layers of compound semiconductor materials can be grown overlying large silicon wafers by first growing an accommodating buffer layer on a silicon wafer. The accommodating buffer layer is a layer of monocrystalline oxide spaced apart from the silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline compound semiconductor layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.

Claims

exact text as granted — not AI-modified
1 . A semiconductor structure comprising: 
 a monocrystalline oxide material; and    a monocrystalline compound semiconductor material of first type formed overlying the monocrystalline oxide material.    
     
     
         2 - 143  (Canceled).

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