US2004231120A1PendingUtilityA1
Solid electrolytic capacitor and method for manufacturing the same
Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO LTDPriority: Oct 28, 1999Filed: Jul 1, 2004Published: Nov 25, 2004
Est. expiryOct 28, 2019(expired)· nominal 20-yr term from priority
H01G 9/012H01G 11/48H01G 9/0029H01G 9/07H01G 9/042H01G 9/025H01G 9/15H01G 11/56H01G 9/26Y02E60/13
39
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Claims
Abstract
In the present invention, a capacitor element including a valve action metal an oxide film layer formed on the surface of the valve action metal, and a solid electrolytic layer formed on the oxide film layer is provided with an organic compound having a boiling point of not lower than 150° C. and a melting point of not higher than 150° C., and the capacitor element including the organic compound is arranged inside a package. The oxide film is repaired with the organic compound as a solvent by an application of a dc voltage.
Claims
exact text as granted — not AI-modified1 - 13 . (Cancelled)
14 . A method for manufacturing a solid electrolytic capacitor comprising a package and a capacitor element inside the package, the capacitor element comprising a valve action metal, an oxide film layer formed on the surface of the valve action metal, and a solid electrolytic layer formed on the oxide film layer, the method comprising, making the capacitor element containing an organic compound having a boiling point of not lower than 150° C. and a melting point of not higher than 150° C., and arranging the capacitor element containing the organic compound inside the package, wherein the organic compound does not substantially dissociate.
15 . The manufacturing method according to claim 14 , wherein the organic compound is included in the capacitor element by impregnating a solution prepared by dissolving the organic compound in a solvent into the capacitor element and evaporating the solvent by heat.
16 . The manufacturing method according to claim 14 , wherein the organic compound is included in the capacitor element by impregnating a vapor generated by heating the organic compound into the capacitor element.
17 . The manufacturing method according to claim 14 , wherein the organic compound is included in the capacitor element by impregnating the organic compound that is liquefied by heating into the capacitor element.
18 . The manufacturing method according to claim 14 , wherein the organic compound is included in the capacitor element by impregnating the organic compound into the capacitor element after lowering the viscosity of the organic compound by heating.
19 . The manufacturing method according to claim 14 , wherein the organic compound is included in the capacitor element by adding the organic compound to a solution for forming the solid electrolytic layer.
20 . The manufacturing method according to claim 14 , wherein the capacitor element is made to further contain a substance having a reduction potential that is equal to or higher than a hydrogen-generating potential.
21 . The manufacturing method according to claim 14 , further comprising applying a dc voltage so as to repair a defect of the oxide film.
22 . The manufacturing method according to claim 21 , wherein a defect of the oxide film layer is repaired by applying a dc voltage while liquefying the organic compound by heat generated due to the applied dc voltage.
23 . The manufacturing method according to claim 14 , wherein the organic compound is at least one selected from the group consisting of alcohol, ester, ether, and ketone.
24 . A method for manufacturing a solid electrolytic capacitor comprising a package and a capacitor element inside the package, the capacitor element comprising a valve action metal, an oxide film layer formed on the surface of the valve action metal, and a solid electrolytic layer formed on the oxide film layer, the method comprising, making the capacitor element containing an organic compound having a boiling point of not lower than 150° C. and a melting point of not higher than 150° C., and arranging the capacitor element containing the organic compound inside the package, wherein the organic compound is at least one selected from the group consisting of alcohol, ester, ether, and ketone.
25 . The manufacturing method according to claim 24 , wherein the organic compound is included in the capacitor element by impregnating a solution prepared by dissolving the organic compound in a solvent into the capacitor element and evaporating the solvent by heat.
26 . The manufacturing method according to claim 24 , wherein the organic compound is included in the capacitor element by impregnating a vapor generated by heating the organic compound into the capacitor element.
27 . The manufacturing method according to claim 24 , wherein the organic compound is included in the capacitor element by impregnating the organic compound that is liquefied by heating into the capacitor element.
28 . The manufacturing method according to claim 24 , wherein the organic compound is included in the capacitor element by impregnating the organic compound into the capacitor element after lowering the viscosity of the organic compound by heating.
29 . The manufacturing method according to claim 24 , wherein the organic compound is included in the capacitor element by adding the organic compound to a solution for forming the solid electrolytic layer.
30 . The manufacturing method according to claim 24 , wherein the capacitor element is made to further contain a substance having a reduction potential that is equal to or higher than a hydrogen-generating potential.
31 . The manufacturing method according to claim 24 , further comprising applying a dc voltage so as to repair a defect of the oxide film layer.
32 . The manufacturing method according to claim 31 , wherein a defect of the oxide film layer is repaired by applying a dc voltage while liquefying the organic compound by heat generated due to the applied dc voltage.Join the waitlist — get patent alerts
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