Adhesives composition, adhesive film, and semiconductor apparatus using the same

Abstract

An adhesive composition is provided that may give stable fixing strength without variation in a coated amount, and may form an adhesive film having excellent storage stability in fixing of semiconductor chips with electrode members. Moreover, an adhesive film (adhesive film for die bonding) obtained from the composition concerned is provided. An adhesive composition is used that is characterized by including epoxy resins (A), phenol resins (B), synthetic rubbers (C), and microcapsules (D) including hardening accelerator that has a core/shell structure in which a core part including hardening accelerator is covered by a shell part formed with thermoplastic resins.

1 . An adhesive composition comprising epoxy resins (A), phenol resins (B), synthetic rubber (C), and microcapsules (D), each microcasule having a core/shell structure in which a core part including a hardening accelerator is covered by a shell part formed with thermoplastic resins.  
     
     
         2 . The adhesive composition according to  claim 1 , wherein the shell part of the microcapsule (D) including the hardening accelerator is formed with a polyurea having an isocyanate compound using a triisocyanate compound (1) represented with following chemical formula (1), and a triisocyanate compound (2) represented with following chemical formula (2) at a percentage of a mixed molar ratio of (compound (1))/(compound (2))=100/0-30/70 as a constituent element.  
       
         
           
           
               
               
           
         
       
     
     
         3 . The adhesive composition according to  claim 1 , wherein the shell part of the microcapsule (D) including the hardening accelerator is formed with a polyurea having a triisocyanate compound (3) represented with following general formula (3) as a constituent element, wherein R represents a bivalent organic group.  
       
         
           
           
               
               
           
         
       
     
     
         4 . The adhesive composition according to  claim 1 , wherein the epoxy resin (A) has a novolak type epoxy resin represented with the following general formula (4) as a principal component wherein G represents a glycidyl group, R represents —H or —CH 3 , and n represents an integer of 1 or more.  
       
         
           
           
               
               
           
         
       
     
     
         5 . The adhesive composition according to  claim 1 , wherein the epoxy resin (A) has a biphenyl type epoxy resin represented with the following general formula (5) as a principal component, wherein R represents —H or —CH 3 .  
       
         
           
           
               
               
           
         
       
     
     
         6 . The adhesive composition according to  claim 1 , wherein the epoxy resin (A) has a tris hydroxyphenylmethane type epoxy resin represented with the following general formula (6) as a principal component wherein, G represents a glycidyl group, R represents —H or —CH 3 , and n represents zero or an integer of 1 or more.  
       
         
           
           
               
               
           
         
       
     
     
         7 . The adhesive composition according to  claim 1 , wherein the epoxy resin (A) has a tetraphenylol ethane type epoxy resin represented with the following general formula (7) as a principal component, wherein G represents a glycidyl group, and R 1  and R 2  each represent independently —H or —CH 3 .  
       
         
           
           
               
               
           
         
       
     
     
         8 . The adhesive composition according to  claim 1 , wherein the phenol resin (B) is a phenol novolak resin represented with the following general formula (8), wherein n represents zero or an integer of 1 or more.  
       
         
           
           
               
               
           
         
       
     
     
         9 . The adhesive composition according to  claim 1 , wherein the phenol resin (B) is a phenol aralkyl resin represented with the following general formula (9), wherein n represents zero or an integer of 1 or more.  
       
         
           
           
               
               
           
         
       
     
     
         10 . The adhesive composition according to  claim 1 , wherein the synthetic rubber (C) is an acrylonitrile-butadiene rubber having a repeating unit represented with the following general formula (10) as a principal constituent element, wherein x:y=1-99:1-99.  
       
         
           
           
               
               
           
         
       
     
     
         11 . The adhesive composition according to  claim 1 , wherein the synthetic rubber (C) is a carboxylated acrylonitrile-butadiene rubber having a repeating unit represented with the following general formula (11) as a principal constituent element, wherein R represents —H or —CH 3 , and x:y:z=1-98:1-98-1-98.  
       
         
           
           
               
               
           
         
       
     
     
         12 . The adhesive composition according to  claim 1 , wherein the synthetic rubber (C) is a carboxylated acrylic rubber having a repeating unit represented with the following general formula (12) as a principal constituent element, wherein R represents a monovalent organic group, and x represents an integer of 1 or more.  
       
         
           
           
               
               
           
         
       
     
     
         13 . The adhesive composition according to  claim 1 , further comprising inorganic fillers.  
     
     
         14 . An adhesive film being formed of the adhesive composition according to  claim 1 .  
     
     
         15 . A laminated adhesive film comprising the adhesive film according to  claim 14  and a pressure sensitive adhesive film.  
     
     
         16 . The adhesive film according to  claim 14  which is configured to die bond a semiconductor device.  
     
     
         17 . A semiconductor apparatus wherein a semiconductor device is die-bonded using the adhesive film for die bonding according to  claim 16 .  
     
     
         18 . The laminated adhesive film according to  claim 15  which is configured to die bond a semiconductor device.  
     
     
         19 . A semiconductor apparatus wherein a semiconductor device is die-bonded using the laminated adhesive film for die bonding according to  claim 18.