US2004229137A1PendingUtilityA1
Method for correcting characteristics of attenuated phase-shift mask
Priority: Jul 22, 1999Filed: Jun 22, 2004Published: Nov 18, 2004
Est. expiryJul 22, 2019(expired)· nominal 20-yr term from priority
Inventors:Katsuhiro Takushima
G03F 1/72G03F 1/32
38
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Claims
Abstract
A method for correcting characteristics of an attenuated phase-shift mask having an attenuated layer including (a) storing a data in a memory, which shows a correlation between characteristics and process conditions, (b) measuring the characteristics of the attenuated phase-shift mask, (c) calculating a appropriate process condition from the result of the step (b) and the data stored in the memory; and (d) soaking the attenuated phase-shift mask into a liquid solution for a certain time that is calculated in the step (c) to change thickness and composition of the attenuated layer.
Claims
exact text as granted — not AI-modified1 . A method for correcting characteristics of an attenuated phase-shift mask having an attenuated layer, comprising:
(a) storing a data in a memory, which shows a correlation between characteristics and process conditions; (b) measuring the characteristics of the attenuated phase-shift mask in order to examine whether or not the attenuated phase-shift mask has the characteristics with a desired value; (c) correcting characteristics of the attenuated phase-shift mask having the attenuated layer by comparing the measurement result performed by the step (b) to the desired value of the characteristics of the attenuated phase-shift mask by the following step (d) and (e) when the measured value of the characteristics of the attenuated phase-shift mask is far from the desired value of the characteristics of the attenuated phase-shift mask; (d) calculating a desired process condition from the result of the step (b) and the data stored in the memory by the step (a); and (e) soaking the attenuated phase-shift mask into a liquid solution for a certain time that is calculated in the step (d) to change thickness and composition of the attenuated layer.
2 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 1 , further comprising, (f) heating the liquid solution based on the calculation in the step (d) before performing the step (e).
3 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 1 , wherein the characteristic to be corrected is transmittance of the attenuated phase-shift mask, wherein the liquid solution is an acid solution, and wherein the attenuated layer includes chrome.
4 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 3 , wherein the attenuated layer is formed of chromium fluoride.
5 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 3 , wherein the attenuated layer is formed of Chromium oxide and the liquid solution is sulfuric acid.
6 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 1 , wherein the attenuated layer is formed of Molybdenum silicide and the liquid solution is sulfuric acid.
7 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 1 , wherein the characteristic to be corrected is a phase difference of the attenuated phase-shift mask, wherein the liquid solution is an alkaline solution, and wherein the attenuated layer includes chrome.
8 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 7 , wherein the attenuated layer is formed of chromium fluoride.
9 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 7 , wherein the attenuated layer is formed of Chromium oxide and the liquid solution is ammonia.
10 . A method for correcting characteristics of an attenuated phase-shift mask as claimed in claim 1 , wherein the attenuated layer is formed of Molybdenum silicide and the liquid solution is dilute ammonia.
11 - 20 . (cancelled)
21 . A method for fabricating an attenuated phase-shift mask, comprising:
(a) forming an attenuated layer on a substrate; (b) forming a light shielding layer on the attenuated layer; (c) patterning the light shielding layer and the attenuated layer simultaneously in order to form a circuit pattern having the patterned attenuated layer and the patterned light shielding layer, which is formed on the substrate, whereby a primary attenuated phase-shift mask having the circuit pattern is formed; and (d) changing phase difference of the primary attenuated phase-shift mask by soaking the primary attenuated phase-shift mask into an alkaline solution, whereby the attenuated phase-shift mask having desired phase difference is completed.
22 . A method for fabricating an attenuated phase-shift mask, comprising:
(a) forming an attenuated layer on a substrate; (b) forming a light shielding layer on the attenuated layer; (c) patterning the light shielding layer and the attenuated layer simultaneously in order to form a circuit pattern having the patterned attenuated layer and the patterned light shielding layer, which is formed on the substrate, whereby a primary attenuated phase-shift mask having the circuit pattern is formed; and (d) changing transmittance of the primary attenuated phase-shift mask by soaking the attenuated phase-shift mask into an acid solution, whereby the attenuated phase-shift mask having desired transmittance is completed.Join the waitlist — get patent alerts
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