US2004228168A1PendingUtilityA1

Semiconductor memory device and method of operating same

Priority: May 13, 2003Filed: May 6, 2004Published: Nov 18, 2004
Est. expiryMay 13, 2023(expired)· nominal 20-yr term from priority
H10D 86/201H10D 86/01H10D 30/711G11C 11/4097G11C 11/404G11C 11/406G11C 8/08G11C 7/18G11C 2211/4016G11C 11/40618G11C 2211/4065H10B 12/01H10B 12/20
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Claims

Abstract

There are many inventions described and illustrated herein. In a first aspect, the present invention is directed to a memory device and technique of reading data from and writing data into memory cells of the memory device. In this regard, in one embodiment of this aspect of the invention, the memory device and technique for operating that device that minimizes, reduces and/or eliminates the debilitating affects of the charge pumping phenomenon. This embodiment of the present invention employs control signals that minimize, reduce and/or eliminate transitions of the amplitudes and/or polarities. In another embodiment, the present invention is a semiconductor memory device including a memory array comprising a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns. Each semiconductor dynamic random access memory cell includes a transistor having a source region, a drain region, a electrically floating body region disposed between and adjacent to the source region and the drain region, and a gate spaced apart from, and capacitively coupled to, the body region. Each transistor includes a first state representative of a first charge in the body region, and a second data state representative of a second charge in the body region. Further, each row of semiconductor dynamic random access memory cells includes an associated source line which is connected to only the semiconductor dynamic random access memory cells of the associated row.

Claims

exact text as granted — not AI-modified
What is claimed is:  
     
         1 . A semiconductor memory array, comprising: 
 a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns, each semiconductor dynamic random access memory cell includes at least one transistor having: 
 a source region;  
 a drain region;  
 a body region disposed between and adjacent to the source region and the drain region, wherein the body region is electrically floating; and  
 a gate spaced apart from, and capacitively coupled to, the body region;  
   wherein each transistor includes a first state representative of a first charge in the body region, and a second data state representative of a second charge in the body region; and    wherein each row of semiconductor dynamic random access memory cells includes an associated source line which is connected to only the semiconductor dynamic random access memory cells of the associated row.    
     
     
         2 . The semiconductor memory array of  claim 1  wherein each memory cell of each row of semiconductor dynamic random access memory cells includes a separate bit line which is connected to the drain region of the associated transistor.  
     
     
         3 . The semiconductor memory array of  claim 2  wherein each memory cell of a first row is programmed to a first data state by applying a control signal, having a first amplitude, to the gate of the transistor of each memory cell of the first row and a control signal, having a second amplitude, to the drain of each memory cell of the first row.  
     
     
         4 . The semiconductor memory array of  claim 3  wherein a predetermined memory cell of the first row is programmed to a second data state by applying a control signal, having a third amplitude, to the gate of the transistor of the predetermined memory cell, a control signal, having an fourth amplitude, to the drain of predetermined memory cell, and a control signal, having a fifth amplitude, to the source of predetermined memory cell of the row.  
     
     
         5 . The semiconductor memory array of  claim 4  wherein an unselected memory cell of the first row is maintained in the first data state, while the predetermined memory cell is programmed to a second data state, by applying a control signal, having a third amplitude, to the gate of the transistor of the predetermined memory cell and a control signal, having an sixth amplitude, to the drain of predetermined memory cell.  
     
     
         6 . The semiconductor memory array of  claim 5  wherein all of the memory cells of the first row are read by applying a control signal, having a seventh amplitude, to the gate of the transistor of the predetermined memory cell and a control signal, having an eight amplitude, to the drain of predetermined memory cell.  
     
     
         7 . The semiconductor memory array of  claim 6  wherein all of the memory cells of a second row are maintained in an inhibit state while the memory cells of the first row are read.  
     
     
         8 . The semiconductor memory array of  claim 6  wherein all of the memory cells of a second row are maintained in an inhibit state while the memory cells of the first row are read by applying a control signal having a ninth amplitude to the gate of the transistors of the memory cells of the second row.  
     
     
         9 . The semiconductor memory array of  claim 1  wherein each memory cell of a first row of semiconductor dynamic random access memory cells shares a drain region with a memory cell in a second row of semiconductor dynamic random access memory cells, wherein the first and second rows of memory cells are adjacent rows.  
     
     
         10 . The semiconductor memory array of  claim 1  wherein each gate of each memory cell of a first row of semiconductor dynamic random access memory cells is connected to a first gate line.  
     
     
         11 . The semiconductor memory array of  claim 1  wherein only the gate of each memory cell of the first row of semiconductor dynamic random access memory cells is connected to the first gate line.  
     
     
         12 . A semiconductor memory array, comprising: 
 a plurality of semiconductor dynamic random access memory cells arranged in a matrix of rows and columns, each semiconductor dynamic random access memory cell includes at least one transistor having: 
 a source region;  
 a drain region;  
 a body region disposed between and adjacent to the source region and the drain region, wherein the body region is electrically floating; and  
 a gate spaced apart from, and capacitively coupled to, the body region;  
   wherein each transistor includes a first state representative of a first charge in the body region, and a second data state representative of a second charge in the body region;    wherein each row of semiconductor dynamic random access memory cells includes (1) an associated source line which is connected to only the semiconductor dynamic random access memory cells in the associated row and (2) a different gate line for each semiconductor dynamic random access memory cells in the associated row.    
     
     
         13 . The semiconductor memory array of  claim 12  wherein each memory cell of each row of semiconductor dynamic random access memory cells includes a separate bit line which is connected to the drain region of the associated transistor.  
     
     
         14 . The semiconductor memory array of  claim 13  wherein each memory cell of a first row is programmed to a first data state by applying a control signal, having a first amplitude, to the gate of the transistor of each memory cell of the first row and a control signal, having a second amplitude, to the drain of each memory cell of the first row.  
     
     
         15 . The semiconductor memory array of  claim 14  wherein a predetermined memory cell of the first row is programmed to a second data state by applying a control signal, having a third amplitude, to the gate of the transistor of the predetermined memory cell, a control signal, having an fourth amplitude, to the drain of predetermined memory cell, and a control signal, having a fifth amplitude, to the source of predetermined memory cell of the row.  
     
     
         16 . The semiconductor memory array of  claim 15  wherein an unselected memory cell of the first row is maintained in the first data state, while the predetermined memory cell is programmed to a second data state, by applying a control signal, having a third amplitude, to the gate of the transistor of the predetermined memory cell and a control signal, having an sixth amplitude, to the drain of predetermined memory cell.  
     
     
         17 . The semiconductor memory array of  claim 16  wherein all of the memory cells of the first row are read by applying a control signal, having a seventh amplitude, to the gate of the transistor of the predetermined memory cell and a control signal, having an eight amplitude, to the drain of predetermined memory cell.  
     
     
         18 . The semiconductor memory array of  claim 17  wherein all of the memory cells of a second row are maintained in an inhibit state while the memory cells of the first row are read.  
     
     
         19 . The semiconductor memory array of  claim 17  wherein all of the memory cells of a second row are maintained in an inhibit state while the memory cells of the first row are read by applying a control signal having a ninth amplitude to the gate of the transistors of the memory cells of the second row.  
     
     
         20 . The semiconductor memory array of  claim 12  wherein each memory cell of a first row of semiconductor dynamic random access memory cells shares a drain region with a memory cell in a second row of semiconductor dynamic random access memory cells, wherein the first and second rows of memory cells are adjacent rows.

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