US2004228068A1PendingUtilityA1
Capacitor and memory structure and method
Priority: Mar 27, 1997Filed: Feb 24, 2004Published: Nov 18, 2004
Est. expiryMar 27, 2017(expired)· nominal 20-yr term from priority
H10D 1/712Y10S438/964H10B 12/033H10B 12/318
34
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Claims
Abstract
A rugged polysilicon electrode for a capacitor has high surface area enhancement with a thin layer by high nucleation density plus gas phase doping which also enhances grain shape and oxygen-free dielectric formation.
Claims
exact text as granted — not AI-modified1 . A capacitor, comprising:
(a) a first electrode, said first electrode including a surface of rugged polysilicon with a thickness of less than 30 nm; (b) a dielectric on said surface; and (c) a second electrode on said dielectric.
4 . The capacitor of claim 1 , wherein:
(a) said first electrode has the shape of a cylinder portion plus a bottom portion with said surface of rugged polysilicon on both inside and outside of said cylinder portion.
5 . The capacitor of claim 1 , wherein:
(a) said dielectric is oxidized silicon nitride.Join the waitlist — get patent alerts
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