Digital image capturing module assembly and method of fabricating the same

Abstract

A digital image capturing module assembly and method of fabricating the same is proposed, which is designed for the assembly of a digital image capturing module from a photosensitive printed circuit board and a lens holder. The proposed module assembly is characterized by the provision of a shouldered portion and a grooved portion in the lens holder's inner wall around the focusing plane of the lens holder wherein an adhesive layer is coated in the grooved portion to adhere the photosensitive printed circuit board to the lens holder. This feature allows the junction between the photosensitive printed circuit board and the lens holder to have a sealed light-impenetrable quality, so that the captured image by the digital image capturing module would be substantially free of sidelight effect. Moreover, it allows the finished product of digital image capturing module to be more compact in size than prior art.

What is claimed is:  
     
         1 . A digital image capturing module assembly, which comprises: 
 a lens holder, which has one side defined as a focusing plane, and which is formed with a shouldered portion on the lens holder's inner wall on the periphery of the focusing plane and is further formed with a grooved portion in the shouldered portion;    an adhesive layer, which is coated in the grooved portion in the shouldered portion of the lens holder; and    a photosensitive printed circuit board, which is embedded in the space confined within the lens holder's inner wall over the shouldered portion, and which is adhered by means of the adhesive layer to the lens holder so as to be fixedly mounted on the lens holder with a sealed light-impenetrable quality at the junction between the photosensitive printed circuit board and the lens holder.    
     
     
         2 . The digital image capturing module assembly of  claim 1 , wherein the photosensitive printed circuit board is a CCD-based photosensitive printed circuit board.  
     
     
         3 . The digital image capturing module assembly of  claim 1 , wherein the photosensitive printed circuit board is a CMOS-based photosensitive printed circuit board.  
     
     
         4 . The digital image capturing module assembly of  claim 1 , wherein the shouldered portion is dimensioned to a depth substantially equal to the thickness of the photosensitive printed circuit board.  
     
     
         5 . The digital image capturing module assembly of  claim 1 , wherein the space confined within the lens holder's inner wall on the shouldered portion is dimensioned to be substantially equal to the area of the photosensitive printed circuit board.  
     
     
         6 . A method for fabricating a digital image capturing module, comprising: 
 preparing a lens holder having one side defined as a focusing plane, and which is formed with a shouldered portion on the lens holder's inner wall on the periphery of the focusing plane and is further formed with a grooved portion in the shouldered portion;    preparing a photosensitive printed circuit board;    coating an adhesive layer in the grooved portion in the shouldered portion of the lens holder; and    embedding the photosensitive printed circuit board in the space confined within the lens holder's inner wall over the shouldered portion, and which is adhered by means of the adhesive layer to the lens holder so as to be fixedly mounted on the lens holder with a sealed light-impenetrable quality at the junction between the photosensitive printed circuit board and the lens holder.    
     
     
         7 . The method of  claim 6 , wherein the photosensitive printed circuit board is a CCD-based photosensitive printed circuit board.  
     
     
         8 . The method of  claim 6 , wherein the photosensitive printed circuit board is a CMOS-based photosensitive printed circuit board.  
     
     
         9 . The method of  claim 6 , wherein the shouldered portion is dimensioned to a depth substantially equal to the thickness of the photosensitive printed circuit board.  
     
     
         10 . The method of  claim 6 , wherein the space confined within the lens holder's inner wall on the shouldered portion is dimensioned to be substantially equal to the area of the photosensitive printed circuit board.