Method of manufacturing an elastomeric heat sink with a pressure sensitive adhesive backing

Abstract

The present invention discloses method of manufacturing a net-shape molded elastomeric heat-dissipating device that includes an integrally formed conformable interface surface. A base elastomeric matrix material is loaded with thermally conductive filler and injected into a mold cavity to form the completed device. Further, a layer of thermally conductive pressure sensitive adhesive material is applied to the conformable interface surface to allow the device to be securely fastened to a heat-generating surface. The present invention provides superior sealing and elimination of voids and air gaps that are typically found between the thermal transfer surfaces thereby facilitating enhanced thermal transfer properties.

What is claimed is:  
     
         1 . A method of manufacturing a heat dissipating assembly, comprising: 
 providing a base matrix of an elastomer polymer;    loading a thermally conductive filler material into said base matrix to form a mixture;    molding said mixture to form a heat sink having a base element with a top surface, a bottom surface and surface area enhancements adjacent to said top surface; and    applying a layer of pressure sensitive adhesive to said bottom surface of said base element.    
     
     
         2 . The method of manufacturing said heat-dissipating assembly of  claim 1 , further comprising: 
 installing said heat sink on a heat generating surface, said heat generating surface having surface irregularities, said bottom surface of said base member being received on said heat generating surface wherein said bottom surface of said base member conforms to said surface irregularities and is retained in contact with said heat generating surface by said layer of adhesive.    
     
     
         3 . The method of manufacturing said heat dissipating assembly of  claim 1 , wherein said surface area enhancements are integrally molded with said base member from said elastomeric polymer base matrix and said thermally conductive filler.  
     
     
         4 . The method of manufacturing said heat dissipating assembly of  claim 1 , wherein said surface are enhancements are an array of metallic elements, said base member being insert molded around said metallic elements.