US2004226697A1PendingUtilityA1
Heat-dissipating module
Assignee: TAI SOL ELECTRONICS CO LTDPriority: May 14, 2003Filed: Jun 12, 2003Published: Nov 18, 2004
Est. expiryMay 14, 2023(expired)· nominal 20-yr term from priority
Inventors:Ko-Pin Liu
H10W 40/73H10W 40/43F28D 15/0275
21
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Claims
Abstract
A heat-dissipating module is composed of two base plates, a plurality of fins, at least one heat pipe, and a cooling fan. The two base plates are made of a heat-conductive material and each include at least one tunnel. The fins are made of a heat-conductive material and disposed between the two base plates. The heat pipe which is U-shaped includes two distal sections inserted into the tunnels and a body portion exposed outside the fins.
Claims
exact text as granted — not AI-modifiedWhat is claimed is:
1 . A heat-dissipating module comprising:
two base plates made of a heat-conductive material and having at least one tunnel therein; a plurality of fins made of heat-conductive material and mounted between said two base plates; at least one heat pipe having two distal sections inserted into said tunnels and a body portion exposed outside said fins; and a cooling fan mounted outside said fins.
2 . The heat-dissipating module as defined in claim 1 , wherein said heat pipe is three in numbers; each of said two base plates has three tunnels; each of said heat pipes is U-shaped to enable said two distal sections respectively to be inserted into said tunnels.
3 . The heat-dissipating module as defined in claim 1 , wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at another side of said fins.
4 . The heat-dissipating module as defined in claim 1 , wherein said cooling fan is positioned at a side of said fins; said body portion of said heat pipe is positioned at an opposite side of said fins.
5 . The heat-dissipating module as defined in claim 1 , wherein said cooling fan and said body portion of said heat pipe are positioned at the same side of said fins.Join the waitlist — get patent alerts
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