Semiconductor chip molding apparatus and method of detecting when a lead frame has been improperly positioned in the same

Abstract

A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.

1 - 6 . (Cancelled).  
     
     
         7 . A method for use in operating an inset-molding apparatus, comprising: 
 setting a metal part to be inset-molded on a lower mold of the molding apparatus, the lower mold defining at least one mold cavity;    providing at least one electrically conductive detecting block disposed adjacent said lower mold, the at least one electrically conductive block being electrically insulated from at least the lower mold;    subsequently imparting a voltage to at least one component of the apparatus, that includes the lower mold;    subsequently detecting whether an electrical signal flows from the detecting block.    
     
     
         8 . The method of  claim 7 , and further comprising determining that the metal part to be inset-molded has been positioned improperly on the lower mold when an electrical signal is detected as flowing from the detecting block.  
     
     
         9 . The method of  claim 8 , and wherein an operation of the molding apparatus is interrupted when the electrical signal is detected from the detecting block.