CTE matched application specific heat sink assembly

Abstract

An application specific heat sink assembly for dissipating heat from one or more electronic components is presented with a heat-dissipating substrate selected for one or more of its size, shape, mass, cost, thermal conductivity, or environmental resistance properties; and one or more heat-dissipating studs. Each heat-dissipating stud may be attached to the heat-dissipating substrate such that an electronic component may be attached to each heat-dissipating stud with the heat-dissipating stud providing CTE transition between the heat-dissipating substrate and the electronic component to be cooled. At least one of the heat-dissipating studs may have an upper layer with a CTE similar to the electronic component's CTE and one or more intermediate layers between the upper layer and the heat-dissipating substrate to provide CTE stepping between the CTE of the heat-dissipating substrate and the CTE of the upper layer of the heat-dissipating stud.

What is claimed is:  
     
         1 . An application specific heat sink assembly for dissipating heat from one or more electronic components, the application specific heat sink device comprising: 
 a heat-dissipating substrate selected for one or more of the following properties: size, shape, mass, cost, thermal conductivity, environmental resistance; and    one or more heat-dissipating studs; wherein each heat-dissipating stud is attached to the heat-dissipating substrate such that an electronic component may be attached to each heat-dissipating stud; wherein at least one heat-dissipating studs comprises an upper layer having a CTE similar to the electronic component's CTE and one or more intermediate layers between the upper layer and the heat-dissipating substrate; wherein the intermediate layer has a CTE between the CTE of the upper layer and the CTE of the heat-dissipating substrate.    
     
     
         2 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate comprises Aluminum Silicon Carbide.  
     
     
         3 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate comprises a carbon-metal alloy.  
     
     
         4 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate comprises a ceramic.  
     
     
         5 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate includes fins.  
     
     
         6 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate comprises a heat pipe.  
     
     
         7 . The application specific heat sink assembly in accordance with  claim 1 , wherein the heat-dissipating substrate comprises one or more cavities on a first surface, wherein at least one heat-dissipating stud is attached to the heat-dissipating substrate within the one or more cavities on the first surface of the heat-dissipating substrate, wherein the cavity provides an alignment means.  
     
     
         8 . The application specific heat sink assembly in accordance with  claim 1 , wherein one or more of the each heat-dissipating studs is formed by forming a layer having a CTE close to the CTE of the heat dissipating substrate to a top surface of the heat-dissipating substrate and then forming one or more intermediate layers of one or more studs from the layer.  
     
     
         9 . The application specific heat sink assembly in accordance with  claim 8 , wherein one or more of the heat-dissipating studs is formed by forming a layer on top of one or more of the intermediate layers; wherein the layer formed on the intermediate layer has a CTE similar to the CTE of the electronic component to be cooled.  
     
     
         10 . An application specific heat sink device in accordance with  claim 9 , wherein one or more of the heat-dissipating studs is formed by machining, laser cutting or chemical etching.  
     
     
         11 . A method for manufacturing an application specific heat sink assembly of providing heat dissipation for one or more electronic components having predetermined CTEs, comprising: 
 selecting a heat-dissipating substrate with a predetermined CTE;    forming one or more heat-dissipating studs, wherein each heat-dissipating stud is shaped and sized to mate with an electronic device to be cooled, wherein the one or more heat-dissipating studs comprises at least two layers of material, a first layer having a CTE close to the CTE of the electronic component to be cooled and a second layer with a CTE between the CTE of the heat-dissipating substrate and the CTE of the first layer; and    attaching the more than one heat-dissipating studs to predetermined locations on the heat-dissipating substrate, wherein the first layer of the heat-dissipating stud having the CTE close to the CTE of the heat-dissipating substrate is attached toward the heat-dissipating substrate.    
     
     
         12 . The method in accordance with  claim 11 , wherein the heat-dissipating substrate comprises Aluminum Silicon Carbide.  
     
     
         13 . The method in accordance with  claim 11 , wherein the heat-dissipating substrate is selected for one or more of the following qualities, thermal conductivity, environmental resistance, low mass, inexpensive price, or bondability.  
     
     
         14 . The method in accordance with  claim 11 , further comprising the step of forming one or more cavities in a top surface of the heat-dissipating substrate; wherein one or more heat-dissipating studs is attached within the one or more cavities formed on the heat-dissipating substrate.  
     
     
         15 . The method in accordance with  claim 11 , wherein the heat-dissipating substrate comprises a heat pipe.  
     
     
         16 . The method in accordance with  claim 15 , further comprising the step of forming one or more cavities in a top surface of the heat-dissipating substrate; wherein one or more heat-dissipating studs is attached within the one or more cavities formed on the heat-dissipating substrate.  
     
     
         17 . The method in accordance with  claim 11 , wherein the heat-dissipating substrate includes fins.  
     
     
         18 . The method in accordance with  claim 17 , further comprising the step of forming one or more cavities in a top surface of the heat-dissipating substrate; wherein one or more heat-dissipating studs is attached within the one or more cavities formed on the heat-dissipating substrate.